Technical Field
[0001] The present invention relates to a dressing tool, a dressing apparatus and a dressing
method which are used to dress the working surface of a working tool that is used
to perform polishing, grinding or lapping, etc., a working apparatus which has such
a dressing tool or dressing apparatus, and a semiconductor device manufacturing method.
Background Art
[0002] Working tools that perform polishing, grinding or lapping, etc., deteriorate due
to the fact that clogging of the working surface progresses as the working time increases.
Accordingly, such working tools are maintained by performing periodic dressing so
that favorable working can always be performed. For example, such working tools include
polishing pads that are used in chemical-mechanical polishing apparatuses (CMP apparatuses)
that perform polishing on circuit constituent films, etc., that are formed on the
surfaces of wafers in semiconductor wafer manufacturing processes. Such polishing
pads are also dressed at specified intervals by means of a dressing tool. Fore example,
such dressing methods and apparatuses include those disclosed in Japanese Patent Application
Kokai No. H10-71557.
[0003] A conventional example of the dressing of the polishing surface of such a polishing
pad using a dressing tool is shown in Figure 18. Here, an example is shown in which
a doughnut disk-form pad surface (working surface) 101 in a polishing pad 100 constituting
a working tool is dressed by means of a dressing tool 110 which has a ring-form dressing
surface 111. The dressing surface 111 of the dressing tool 110 consists of a narrow
ring-form flat surface with a width indicated by hatching in the figure; this dressing
surface 111 faces the pad surface 101. Furthermore, dressing (recovery of the surface
state and flattening) of the pad surface 101 is accomplished by causing the dressing
surface 111 to contact the pad surface 101 as shown in Figure 18 while causing the
dressing tool 110 to rotate about a rotational axis O2 that passes through the center
point of the dressing tool 110 and extends perpendicular to the dressing surface 111,
in a state in which the polishing pad 100 is caused to rotate about a rotational axis
O1 that passes through the center point of the polishing pad 100 and extends perpendicular
to the pad surface 101.
[0004] In cases where dressing is performed in this way, the amount of the pad surface 101
that is ground away by the dressing tool 110 is greater at the inner circumferential
position A and outer circumferential position C of the pad surface 101 than at the
middle circumferential position B. As a result, the following problem arises: namely,
as is shown in Figure 18 (A), the cross-sectional shape of the pad surface 101 following
dressing is such that the inner circumferential position A and outer circumferential
position C of the pad surface 101 are lower than the middle circumferential position
B, so that the cross-sectional shape in the radial direction tends to assume a convex
shape at the top. The reason for this is as follows: namely, the amount of the pad
surface 101 that is ground away by the dressing tool 110 corresponds to the contact
length of the dressing surface 111 on the circumference of the pad surface 101, and
as is clearly seen from the figures, the contact lengths S1 and S3 at the inner circumferential
position A and outer circumferential position C are longer than the contact length
S2 at the middle circumferential position B.
[0005] Furthermore, the following problem also arises: namely, in order to cause uniform
contact of the dressing surface 111 of the rotating dressing tool 110 with the pad
surface 101 of the polishing pad 100 that is thus rotating, either the polishing pad
100 or the dressing tool 110 must be centered by means of a gimbal centering mechanism,
etc., so that the construction of the dressing apparatus tends to become complicated.
[0006] Furthermore, even if support by means of a centering mechanism is thus provided,
if the dressing tool 110 deviates toward the outer circumferential side or inner circumferential
side of the pad surface 101, there is a resulting imbalance in the contact surface
pressure between the dressing surface 111 and pad surface 101, so that there is a
problem in terms of a loss of flatness of the pad surface 101 following dressing.
For example, in cases where the rotational axis O2 of the dressing tool 110 deviates
toward the outer circumferential side from the state shown in Figure 18 (i.e., in
cases where the rotational axis O2 deviates so that this rotational axis is separated
from the rotational axis O1 of the polishing pad 100 in Figure 18), the following
problem arises: namely, the contact surface pressure on the outer circumferential
side is increased, so that the outer circumferential position C becomes lower than
the inner circumferential position A as shown in Figure 18 (B), thus resulting in
a cross-sectional shape in which the overall pad surface 101 following dressing assumes
a convex shape at the top. Conversely, in cases where the rotational axis O2 of the
dressing tool 110 deviates toward the inner circumferential side from the state shown
in Figure 18 (i.e., in cases where the rotational axis O2 deviates so that this rotational
axis is closer to the rotational axis O1 of the polishing pad 100 in Figure 18), the
following problem is encountered: specifically, the contact surface pressure on the
inner circumferential side is increased, so that the inner circumferential position
A becomes lower than the outer circumferential position C as shown in Figure 18 (C),
thus resulting in a cross-sectional shape in which the overall pad surface 101 following
dressing assumes a concave shape at the top.
[0007] In the case of conventional dressing tools, abrasive grains such as diamond particles
are distributed at a constant mean distribution density over the entire dressing surface.
Accordingly, the grinding capacity per unit area in various parts of the dressing
surface is constant over the entire surface. Furthermore, the shape of a conventional
dressing surface is circular or annular.
[0008] Since the dressing tool is used to dress the polishing pad as described above, it
is not desirable that the mean distribution density of the abrasive grains be as high
as possible; instead, there is an optimal mean distribution density for creating an
appropriate roughness in the polishing surface of the polishing pad. Accordingly,
the abrasive grains should be distributed at such a mean distribution density over
the entire dressing surface. Specifically, conventional technical common sense dictates
that the abrasive grains should be distributed at a certain constant mean distribution
density over the entire dressing surface.
[0009] However, in the case of the above-mentioned conventional dressing tools, it is difficult
to flatten the polishing surface of the polishing pad with a high degree of precision.
As a result of such a low flatness of the polishing pad, it is difficult to polish
semiconductor wafers, etc., to a flat surface with a high degree of precision using
such a polishing pad.
[0010] Furthermore, dressing is performed by causing contact between the polishing surface
of the polishing pad supported on a substrate and the dressing surface of the dressing
tool, and causing relative motion between the above-mentioned substrate and dressing
tool, For example, the above-mentioned relative motion is accomplished by causing
both the dressing tool and the substrate that supports the polishing pad to rotate.
Because of manufacturing error, etc., it is difficult to position the rotational axis
of the above-mentioned substrate and the rotation axis of the dressing tool so that
these axes are perfectly parallel; accordingly, the two rotational axes are actually
slightly inclined relative to each other.
[0011] Conventionally, in order to dress the polishing pad to a flat surface in spite of
such an inclination, a gimbal mechanism has been used between the dressing tool and
the rotational axis of this dressing tool, and dressing has been performed using the
angular tracking characteristics of the dressing tool obtained by means of this gimbal
mechanism. For example, in the case of a CMP apparatus, it is necessary that the semiconductor
wafers, etc., be polished to a flat surface with a high degree of precision; consequently,
the polishing pad must also be flat with a high degree of precision. Conventionally,
therefore, in cases where the polishing pad used in a CMP apparatus, etc., is dressed,
the utilization of the angular tracking characteristics obtained by means of the above-mentioned
gimbal mechanism has been considered indispensable.
[0012] In recent years, however, because of the increasing fineness of semiconductor devices,
the polishing of semiconductor wafers, etc., to a flat surface with an even higher
degree of precision has become necessary. Consequently, it has become necessary that
polishing pads also be flat with an even higher degree of precision. Accordingly,
there is now a need to dress polishing pads to a flat surface with an even higher
degree of precision.
Disclosure of the Invention
[0013] The present invention was devised in light of these problems. First of all, it is
an object of the present invention to provide a dressing tool and apparatus which
can sufficiently maintain the flatness of the working surface following dressing,
and a manufacturing apparatus using a working tool which is dressed by means of such
a dressing apparatus. Furthermore, it is also an object of the present invention to
provide a dressing tool and apparatus that have a construction which is such that
there is no need for a centering mechanism in the apparatus that holds the working
tool and dressing tool during dressing.
[0014] Secondly, it is an object of the present invention to provide a dressing tool which
can ensure the flatness of the polishing surface of the polishing pad following dressing
with a high degree of precision, and a dressing apparatus using this dressing tool.
[0015] Third, it is an object of the present invention to provide a dressing method and
apparatus which can dress a polishing pad to a flat surface with a higher degree of
precision, to provide a polishing apparatus which can polish an object of polishing
using this polishing pad that has been dressed to a flat surface with a high degree
of precision, and to provide a semiconductor device manufacturing method which makes
it possible to manufacture semiconductor devices at a higher yield and lower cost
than conventional semiconductor device manufacturing methods.
[0016] Inventions that are used to achieve these objects will be described below. However,
the respective inventions are not inventions that achieve all of the above-mentioned
objects of the invention. Which objects are achieved by which inventions will be clear
from the constructions of the inventions, and from the working configurations and
embodiments of the inventions that are described below.
[0017] The first invention that is used to achieve the above-mentioned objects is a dressing
tool which performs the dressing of a working tool that has a doughnut disk-form or
circular disk-form working surface, this dressing tool being characterized by the
fact that the tool has a substantially rectangular dressing surface that performs
dressing by contacting the working surface of the above-mentioned working tool, and
the above-mentioned dressing surface is disposed so that the centerline of the above-mentioned
dressing surface in the direction of the short sides of the above-mentioned substantially
rectangular shape coincides with the radial direction passing through the center of
the above-mentioned doughnut disk or circular disk of the above-mentioned working
tool during dressing.
[0018] The second invention that is used to achieve the above-mentioned objects is the above-mentioned
first invention which is further characterized by the fact that the shapes of both
long sides of the above-mentioned substantially rectangular shape that extend parallel
to the above-mentioned centerline in the direction of the short sides are shapes which
are such that when the above-mentioned dressing surface is caused to contact the above-mentioned
working surface, the contact length between the above-mentioned working surface and
the above-mentioned dressing surface is equal at all positions in the radial direction
of the above-mentioned working surface.
[0019] The third invention that is used to achieve the above-mentioned objects is a dressing
apparatus which is characterized by the fact that this apparatus has the dressing
tool of the above-mentioned first invention or second invention, and a working tool
holding mechanism which holds a working tool that has a doughnut disk-form or circular
disk-form working surface, and which causes this working tool to rotate about an axis
that passes through the center of the above-mentioned doughnut disk or circular disk
perpendicular to the above-mentioned working surface.
[0020] The fourth invention that is used to achieve the above-mentioned objects is the above-mentioned
third invention, which is further characterized by the fact that this apparatus has
a plurality of dressing tools, and these dressing tools are disposed so that the plurality
of dressing tools simultaneously dress the above-mentioned working surface.
[0021] The fifth invention that is used to achieve the above-mentioned objects is a working
apparatus which has the above-mentioned working tool that is dressed by the dressing
tool constituting the above-mentioned first invention or second invention.
[0022] The sixth invention that is used to achieve the above-mentioned objects is a working
apparatus which has the above-mentioned working tool that is dressed by the dressing
apparatus constituting the above-mentioned third invention or fourth invention.
[0023] The seventh invention that is used to achieve the above-mentioned objects is a dressing
tool which is used to dress the working surface of a working tool that has a circular
outer circumference, this dressing tool being characterized by the fact that the dressing
tool comprises a dressing surface which is constructed from a circular region that
has a first cutting capacity per unit area, and an annular region that is concentric
with the above-mentioned circular region and that has a second cutting capacity per
unit area that is higher than the above-mentioned first cutting capacity per unit
area, the diameter of the above-mentioned circular region of the above-mentioned dressing
surface is greater than the effective use width within the radius of the above-mentioned
working surface, and the external diameter of the above-mentioned annular region of
the above-mentioned dressing surface is substantially half of the external diameter
of the above-mentioned working surface.
[0024] The eighth invention that is used to achieve the above-mentioned objects is a dressing
tool which is used to dress the working surface of a working tool that has a circular
outer circumference, this dressing tool being characterized by the fact that the dressing
tool comprises a dressing surface which is constructed from a circular region in which
abrasive grains are distributed at a first mean distribution density, and an annular
region which is concentric with the above-mentioned circular region, and in which
abrasive grains are distributed at a second mean distribution density that is higher
than the above-mentioned first mean distribution density, the diameter of the above-mentioned
circular region of the above-mentioned dressing surface is greater than the effective
use width within the radius of the above-mentioned working surface, and the external
diameter of the above-mentioned annular region of the above-mentioned dressing surface
is substantially half of the external diameter of the above-mentioned working surface.
[0025] The ninth invention that is used to achieve the above-mentioned objects is the above-mentioned
eighth invention, which is further characterized by the fact that the above-mentioned
first mean distribution density is 10% to 50% of the above-mentioned second mean distribution
density.
[0026] The tenth invention that is used to achieve the above-mentioned objects is a dressing
apparatus which is characterized by the fact that this dressing apparatus comprises
the dressing tool constituting any of the above-mentioned seventh through ninth inventions,
and a rotational mechanism which causes this dressing tool to rotate.
[0027] In this invention, since the dressing tool constituting any of the above-mentioned
seventh through ninth inventions is provided, dressing can be performed utilizing
the actions and effects of the respective tools.
[0028] The eleventh invention that is used to achieve the above-mentioned objects is a dressing
method for dressing the working surface of a working tool supported on a substrate
by causing contact between this working surface and the dressing surface of a dressing
tool and causing relative motion between the above-mentioned substrate and the above-mentioned
dressing tool, this dressing method being characterized by the fact that this method
comprises a setting stage in which the relative inclination of the above-mentioned
dressing surface with reference to the above-mentioned substrate is adjusted to a
desired inclination and set, and a dressing stage in which the above-mentioned working
surface is dressed while maintaining the above-mentioned relative inclination set
in the above-mentioned setting stage.
[0029] The twelfth invention that is used to achieve the above-mentioned objects is the
above-mentioned eleventh invention, which is further characterized by the fact that
the above-mentioned setting stage includes a stage in which information corresponding
to the surface shape of the above-mentioned working surface is obtained, and a stage
in which the above-mentioned relative inclination is adjusted and set on the basis
of the above-mentioned information.
[0030] The thirteenth invention that is used to achieve the above-mentioned objects is the
above-mentioned eleventh or twelfth invention, which is further characterized by the
fact that the above-mentioned setting stage and the above-mentioned dressing stage
are alternately repeated a multiple number of times each.
[0031] The fourteenth invention that is used to achieve the above-mentioned objects is any
of the above-mentioned eleventh through thirteenth inventions, which is further characterized
by the fact that the dressing of the above-mentioned working surface in the above-mentioned
dressing stage is performed in a state in which a portion of the above-mentioned dressing
surface protrudes from the circumference of the above-mentioned working surface.
[0032] The fifteenth invention that is used to achieve the above-mentioned objects is any
of the above-mentioned eleventh through fourteenth inventions, which is further characterized
by the fact that the above-mentioned relative inclination is an inclination about
a specified axial line that is substantially perpendicular to a straight line passing
through the vicinity of the center of the above-mentioned working surface and the
vicinity of the center of the above-mentioned dressing surface.
[0033] The sixteenth invention that is used to achieve the above-mentioned objects is a
dressing apparatus which dresses the working surface of a working tool supported on
a substrate by causing contact between this working surface and the dressing surface
of a dressing tool and causing relative motion between the above-mentioned substrate
and the above-mentioned dressing tool, this dressing apparatus being characterized
by the fact that the apparatus comprises an inclination adjustment mechanism that
can adjust the relative inclination of the above-mentioned dressing surface with reference
to the above-mentioned substrate to a desired inclination and set this inclination,
and a moving mechanism which dresses the above-mentioned working surface by causing
relative motion between the above-mentioned substrate and the above-mentioned dressing
tool while maintaining the above-mentioned relative inclination set by the above-mentioned
inclination adjustment mechanism.
[0034] The seventeenth invention that is used to achieve the above-mentioned objects is
the above-mentioned sixteenth invention, which is further characterized by the fact
that the dressing apparatus is an apparatus that dresses the working surface of a
working tool that has a circular outer circumference, the above-mentioned dressing
tool comprises a dressing surface which is constructed from a circular region that
has a first cutting capacity per unit area, and an annular region that is concentric
with the above-mentioned circular region and that has a second cutting capacity per
unit area that is higher than the above-mentioned first cutting capacity per unit
area, the diameter of the above-mentioned circular region of the above-mentioned dressing
surface is greater than the effective use width within the radius of the above-mentioned
working surface, and the external diameter of the above-mentioned annular region of
the above-mentioned dressing surface is substantially half of the external diameter
of the above-mentioned working surface.
[0035] The eighteenth invention that is used to achieve the above-mentioned objects is the
above-mentioned sixteenth invention or seventeenth invention, which is further characterized
by the fact that the dressing apparatus comprises a control part that operates the
above-mentioned inclination adjustment mechanism on the basis of information corresponding
to the surface shape of the above-mentioned working surface so that the above-mentioned
relative inclination is a desired inclination.
[0036] The nineteenth invention that is used to achieve the above-mentioned objects is the
above-mentioned eighteenth invention, which is further characterized by the fact that
the dressing apparatus comprises a measuring part that acquires the above-mentioned
information.
[0037] The twentieth invention that is used to achieve the above-mentioned objects is a
dressing apparatus which dresses the working surface of a working tool supported on
a substrate by causing contact between this working surface and the dressing surface
of a dressing tool and causing relative motion between the above-mentioned substrate
and the above-mentioned dressing tool, this dressing apparatus being characterized
by the fact that the apparatus comprises an inclination adjustment mechanism that
can adjust the relative inclination of the above-mentioned dressing surface with reference
to the above-mentioned substrate to a desired inclination and set this inclination,
a moving mechanism which dresses the above-mentioned working surface by causing relative
motion between the above-mentioned substrate and the above-mentioned dressing tool
while maintaining the above-mentioned relative inclination set by the above-mentioned
inclination adjustment mechanism, a measuring part which acquires information corresponding
to the surface shape of the above-mentioned working surface, and a control part which,
in response to specified command signals, (i) causes the above-mentioned dressing
to be performed by operating the above-mentioned moving mechanism, (ii) makes a judgement
as to whether or not the above-mentioned relative inclination that is currently set
is the desired inclination on the basis of the above-mentioned information acquired
by the above-mentioned measuring part following the dressing performed in the above-mentioned
(i), (iii) ends the adjustment of the above-mentioned relative inclination in cases
where it is judged in the above-mentioned (ii) that the currently set inclination
is the desired inclination, and (iv) repeats the operation from the above-mentioned
(i) on after operating the above-mentioned inclination adjustment mechanism so that
the above-mentioned relative inclination is adjusted to the desired inclination or
an inclination that approaches this desired inclination in cases where it is judged
in the above-mentioned (ii) that the currently set inclination is not the desired
inclination.
[0038] The twenty-first invention that is used to achieve the above-mentioned objects is
the above-mentioned twentieth invention, which is further characterized by the fact
that the dressing apparatus is an apparatus that dresses the working surface of a
working tool that has a circular outer circumference, the above-mentioned dressing
tool comprises a dressing surface which is constructed from a circular region that
has a first cutting capacity per unit area, and an annular region that is concentric
with the above-mentioned circular region and that has a second cutting capacity per
unit area that is higher than the above-mentioned first cutting capacity per unit
area, the diameter of the above-mentioned circular region of the above-mentioned dressing
surface is greater than the effective use width within the radius of the above-mentioned
working surface, and the external diameter of the above-mentioned annular region of
the above-mentioned dressing surface is substantially half of the external diameter
of the above-mentioned working surface.
[0039] The twenty-second invention that is used to achieve the above-mentioned objects is
any of the above-mentioned sixteenth through twenty-first inventions, which is further
characterized by the fact that the dressing of the above-mentioned working surface
is performed in a state in which a portion of the above-mentioned dressing surface
protrudes from the circumference of the above-mentioned working surface.
[0040] The twenty-third invention that is used to achieve the above-mentioned objects is
any of the above-mentioned sixteenth through twenty-second inventions, which is further
characterized by the fact that the above-mentioned relative inclination is an inclination
about a specified axial line that is substantially perpendicular to a straight line
passing through the vicinity of the center of the above-mentioned working surface
and the vicinity of the center of the above-mentioned dressing surface.
[0041] The twenty-fourth invention that is used to achieve the above-mentioned objects is
a working apparatus which comprises a working tool that has a working surface, and
a holding part that holds the workpiece, and which works the above-mentioned workpiece
by applying a load between the above-mentioned working surface of the above-mentioned
working tool and the above-mentioned workpiece and causing the relative motion of
the above-mentioned working tool and the above-mentioned workpiece, this working apparatus
being characterized by the fact that the above-mentioned working surface is dressed
by the dressing method of any of the above-mentioned eleventh through fifteenth inventions.
[0042] The twenty-fifth invention that is used to achieve the above-mentioned objects is
a working apparatus which comprises a working tool that has a working surface, and
a holding part that holds the object of polishing, and which works the above-mentioned
workpiece by applying a load between the above-mentioned working surface of the above-mentioned
working tool and the above-mentioned object of polishing and causing the relative
motion of the above-mentioned polishing tool and the above-mentioned object of polishing,
this working apparatus being characterized by the fact that the above-mentioned working
surface is dressed by the dressing apparatus of any of the above-mentioned sixteenth
through twenty-third inventions.
[0043] The twenty-sixth invention that is used to achieve the above-mentioned objects is
a working apparatus which comprises a working tool that has a working surface, and
a holding part that holds the workpiece, and which works the above-mentioned workpiece
by applying a load between the above-mentioned working surface of the above-mentioned
working tool and the above-mentioned workpiece and causing the relative motion of
the above-mentioned working tool and the above-mentioned workpiece, this working apparatus
being characterized by the fact that the apparatus comprises the dressing apparatus
of any of the above-mentioned sixteenth through twenty-third inventions.
[0044] The twenty-seventh invention that is used to achieve the above-mentioned objects
is a semiconductor device manufacturing method which is characterized by the fact
that this method has a process in which the surface of a semiconductor wafer is flattened
using the working apparatus of the above-mentioned fifth or sixth inventions, or of
any of the above-mentioned twenty-fourth through twenty-sixth inventions.
Brief Description of the Drawings
[0045]
Figure 1 is a schematic structural diagram which shows the construction of a dressing
apparatus constituting a working configuration of the present invention in model form.
Figure 2 is a schematic plan view which shows the positional relationship between
the polishing pad and the dressing apparatus in the dressing apparatus shown in Figure
1.
Figure 3 is a graph which shows the results of a simulation of the flatness of the
polishing pad surface in a case where dressing was performed using a dressing tool
with a rectangular shape.
Figure 4 is an explanatory diagram which shows the contact length relationship between
the rectangular dressing tool of the present invention and the polishing pad.
Figure 5 is a diagram which shows an example of the shapes of the left-right sides
in a case where a correction is performed so that the contact lengths with the polishing
pad in the circumferential direction are all equal in the rectangular dressing tool
of the present invention.
Figure 6 is a schematic plan view which shows a dressing apparatus constituting a
working configuration of the present invention.
Figure 7 is a schematic structural diagram which shows the construction of a dressing
apparatus constituting a working configuration of the present invention.
Figure 8 is a schematic plan view which shows in model form the positional relationship
between the dressing surface of the dressing tool and the polishing pad during the
dressing of the polishing pad by the dressing apparatus shown in Figure 7.
Figure 9 is an enlarged schematic sectional view which shows in model form the dressing
tool used in the dressing apparatus shown in Figure 7.
Figure 10 is a diagram which shows the results of a simulation of the thickness distribution
of the polishing pad following dressing.
Figure 11 is a diagram which shows the results of another simulation of the thickness
distribution of the polishing pad following dressing.
Figure 12 is a schematic structural diagram which shows in model form the construction
of a polishing apparatus constituting a working configuration of the present invention.
Figure 13 is a schematic plan view which shows in model form the positional relationship
between the dressing surface of the dressing tool and the polishing pad during the
dressing of the polishing pad in the polishing apparatus shown in Figure 12.
Figure 14 is a schematic flow chart which shows the operation of the inclination adjustment
control.
Figure 15 is a schematic structural diagram which shows in model form the construction
of a dressing apparatus constituting a working configuration of the present invention.
Figure 16 is a schematic plan view which shows in model form the positional relationship
between the dressing surface of the dressing tool and the polishing pad in the dressing
apparatus shown in Figure 15.
Figure 17 is a flow chart which shows a semiconductor device manufacturing process.
Figure 18 shows a schematic diagram and sectional view which illustrate the construction
of a conventional dressing apparatus and the shape of the working surface following
dressing.
Best Mode for Carrying Out the Invention
[0046] Preferred working configurations of the present invention will be described below
with reference to the figures. However, the descriptions of these working configurations
do not limit the scope of the present invention.
[First Working Configuration]
[0047] A dressing apparatus DA for a polishing pad constructed using the dressing tool 1
of the present invention is shown in Figure 1. This dressing apparatus DA is an apparatus
which dresses a pad surface (polishing surface) 15a of a polishing pad 15 used in
a CMP apparatus, and is constructed from a pad holding mechanism 10 which holds the
polishing pad 15 by vacuum chucking, etc., and causes this polishing pad 15 to rotate,
and a dressing tool holding mechanism 1 which has a dressing tool 2 that dresses the
pad surface 15a of the polishing pad 15 that is held and caused to rotate by the above-mentioned
pad holding mechanism 10. The pad holding mechanism 10 is constructed from a pad holding
head 11 which holds the polishing pad 15 by vacuum chucking, a rotating shaft 12 which
is connected to the pad holding head 11, and a rotational driving device (not shown
in the figures) which causes the pad holding head 11 to rotate about its rotational
axis O3 via this rotating shaft 12. Furthermore, as is shown in Figure 2, the polishing
pad 15 consists of a plate-form member which has a doughnut disk-form pad surface
15a, and is held by the pad holding head 11 so that an axial line that passes through
the center point of the polishing pad 15 and is perpendicular to the pad surface 15a
constitutes the above-mentioned rotational axis O3.
[0048] The dressing tool holding mechanism 1 is constructed from the dressing tool 2 which
has a rectangular dressing surface 3 as shown in Figure 2, and a holding cylinder
mechanism 5 which holds this dressing tool 2 so that the dressing tool 2 is free to
move upward and downward. The dressing tool 2 has a length dimension that is slightly
greater than the radial dimension of the pad surface 15a of the polishing pad 15,
and has a rectangular dressing surface 3 in which the width dimension of the left-right
sides (long sides) 3a and 3b is w. The holding cylinder mechanism 5 comprises a cylinder
tube 6 which is fastened to the surface of a base 4, a piston head 7a which is inserted
into the cylinder tube 6 so that this piston head 7a is free to slide in the axial
direction, and a rod 7b which is connected to this piston head 7a, and which passes
through the cylinder tube 6 and extends upward. The dressing tool 2 is held by being
fastened to the upper end of the rod 7b.
[0049] The dressing tool holding mechanism 1 holds the dressing tool 2 so that the dressing
surface 3 is caused to face the pad surface 15a of the polishing pad 15 that is held
and rotated by the pad holding mechanism 10. In this case, as is shown in Figure 2,
the dressing tool 2 is held so that the centerline L1 of the dressing surface 3 in
the direction of width (short-side direction) extends in the radial direction of the
doughnut disk-form pad surface 15a, and the dressing tool 2 is raised by the holding
cylinder mechanism 5 so that the dressing surface 3 is pressed against the pad surface
15a. The pressing force in this case is set at an appropriate value by means of the
holding cylinder mechanism 5, so that the dressing of the pad surface 15a is performed.
[0050] In the case of the dressing apparatus DA constructed as described above, since the
dressing tool 2 is fastened and held, and the polishing pad 15 is caused to rotate
by the pad holding mechanism 10, there is no need for a centering mechanism such as
that used in a conventional dressing apparatus, so that the construction of the apparatus
is simplified.
[0051] However, in the case of dressing by means of a dressing tool 2 which has a rectangular
dressing surface 3 as described above, the contact length S of the dressing surface
3 in the circumferential direction of the pad surface 15a varies (although only slightly)
according to the position in the radial direction. Accordingly, there is a possibility
that the flatness of the pad surface 15a following dressing will drop. For example,
as is shown in Figure 2, if the contact length Si in the circumferential direction
at the inner circumferential position A and the contact length So in the circumferential
direction at the outer circumferential position B are compared, Si > So since the
curvature of the inner circumferential position A is greater than the curvature of
the outer circumferential position B. Consequently, a greater amount of dressing is
performed on the inner circumferential side, so that the pad surface 15a tends to
assume an overall cross-sectional shape that is concave at the top as shown in Figure
18 (C).
[0052] Figure 3 shows simulation results regarding this. Here, the position in the radial
direction of the pad surface 15a of the polishing pad 15 (as is seen from this figure,
the pad surface 15a has a doughnut disk shape with an internal diameter of approximately
60 mm and an external diameter of approximately 170 mm) is shown on the horizontal
axis, and the amount of variation (%) of the pad surface following dressing with respect
to a flat surface is shown on the vertical axis. In this simulation, the amounts of
variation of the pad surface 15a with respect to a flat surface are shown for cases
where dressing was performed under the same conditions using five types of dressing
tools 2 in which the width dimensions w of the dressing surfaces 3 were 10 mm, 20
mm, 30 mm, 40 mm and 50 mm, respectively. As is seen from this figure, the flatness
is improved as the width dimension w is smaller; for example, a dressing tool 2 which
has a dressing surface 3 in which w = approximately 10 to 20 mm is adequate for practical
use.
[0053] However, it is desirable to increase the dressing efficiency by shortening the dressing
time; in order to accomplish this, an increase in the width dimension w of the dressing
surface 3 is desired. Here, we will consider the cause of the drop in flatness that
accompanies an increase in the width dimension w as shown in Figure 3. As is shown
in Figure 4, in regard to the contact length S in the circumferential direction at
a circumferential position D of radius
r in a case where the dressing surface 3 (width dimension w) of the dressing tool 2
is caused to contact the polishing surface 15a of the polishing pad 15, these relationships
can be expressed by the following Equations (1) and (2), where 2β is the circumferential
angle corresponding to this contact length S.
[0054] Here, if the shapes of the left-right sides 3a and 3b of the dressing surface 3 are
corrected so that the contact length s determined by Equation (2) is equal for all
radii r (i.e., at all circumferential positions), then the amount of dressing will
be the same over the entire pad surface 15a, so that the pad surface 15a can be made
flat following dressing even if the width w is increased. Furthermore, an example
of the shapes of the left-right sides 3a' and 3b' of the dressing surface 3' corrected
in this manner is shown in Figure 5. In Figure 5, the horizontal axis shows the position
in the radial direction (direction of the Y axis) from the center position of the
pad, and the vertical axis shows the position in the direction of the Y axis perpendicular
to this. The area 3' surrounded by the substantially rectangular line is the dressing
surface. In the case of a dressing tool 2 comprising a dressing surface 3' which has
left-right sides 3a' and 3b' that are corrected in this manner, the dressing efficiency
can be increased by increasing the width dimension w.
[0055] Furthermore, if a dressing apparatus is constructed as shown in Figure 6 using a
plurality of dressing tools 2 which have a dressing surface 3' with such a large width
dimension w, the dressing of the pad surface 15a can be accomplished efficiently in
a shorter time. Moreover, in cases where a plurality of dressing tools are thus used,
the respective dressing tools need not be tools in which the shapes of the left-right
sides are corrected as described above; these tools may be rectangular tools with
a small width dimension w.
[0056] The manufacturing apparatus of the invention in this first working configuration
is constructed with a polishing pad 15 which is dressed by a dressing apparatus DA
constructed using the dressing tool 2 described above; a CMP apparatus which polishes
wafers using this polishing pad 15 corresponds to the working apparatus of the above-mentioned
sixth invention. Furthermore, it is desirable that the respective dressing tools be
attached to the same substrate.
[0057] Furthermore, in the first working configuration, the polishing pad had a doughnut
disk-form shape; however, the above-mentioned first through sixth inventions can also
be applied to a polishing pad with a circular disk shape.
[0058] In the invention of the first working configuration described above, since dressing
is performed by causing only the working tool to rotate in a state in which the dressing
tool is held in a fixed position, there is no need for a centering mechanism, so that
the construction of the apparatus can be simplified. Furthermore, since a dressing
tool which has a substantially rectangular shape is used, the contact length on the
circumference between the working surface and the dressing surface is the same at
all positions in the radial direction, so that the flatness of the working surface
following dressing can be improved.
[Second Working Configuration]
[0059] Figure 7 is a schematic structural diagram which shows a dressing apparatus constituting
a second working configuration of the present invention. Figure 8 is a schematic plan
view which shows in model form the positional relationship between the dressing surface
of the dressing tool 21 and the polishing pad 25 during the dressing of the polishing
pad 25. Figure 9 is an enlarged schematic sectional view which shows the dressing
tool 21 in model form.
[0060] As is shown in Figure 7, the dressing apparatus of the present working configuration
comprises a dressing tool 21 and a rotational mechanism 23 which causes the dressing
tool 21 to rotate with respect to a base 22. This dressing apparatus is constructed
so that this apparatus dresses the polishing surface 25a of a CMP apparatus polishing
pad 25 supported on a substrate 24. The substrate 24 and polishing pad 25 may constitute
the CMP apparatus polishing tool itself, or the substrate 24 may be a member that
is separate from the polishing tool. In the former case, the dressing apparatus according
to the present working configuration is disposed in the dressing station (dressing
zone) of the CMP apparatus.
[0061] As is shown in Figure 8, the polishing surface 25a of the polishing pad 25 has a
circular outer circumference. In the present example, the polishing pad 25 is constructed
with an annular shape in which the central part is removed. Of course, the polishing
pad that is the object of dressing by the dressing apparatus of the present working
configuration is not limited to an annular polishing pad; for example, this polishing
pad may also be a circular polishing pad in which the central part is not removed.
In the present working configuration, the entire annular polishing surface 25a of
the polishing pad 25 forms an effective use region that can be effectively used in
the polishing of an object of polishing such as a semiconductor wafer. The effective
use width within the radius of the polishing pad 25 is half the difference between
the external diameter and internal diameter.
[0062] The polishing pad 25 and substrate 24 are arranged so that these parts can be rotated
and moved upward and downward as indicated by the arrows a and b in Figure 7 by a
mechanism (not shown in the figures) using electric motors as actuators. Furthermore,
the substrate 24 is mechanically connected to a rotating shaft 26 via a gimbal mechanism
(not shown in the figures). Of course, it is not absolutely necessary to install a
gimbal mechanism. Furthermore, in Figure 8, O1 indicates the center of the polishing
pad 25, and the polishing pad 25 rotates about this center O1 as the center of rotation.
[0063] In the present working configuration, as is shown in Figure 9, the dressing tool
21 has a substrate 31 consisting of a disk, diamond particles 32 used as abrasive
grains which are distributed on the upper surface of the substrate 31, and a nickel
plating 33 that fastens the diamond particles 32 to the substrate 31. In the circular
region R1 in the central part of the upper surface of the dressing tool 21, the diamond
particles 32 are distributed at a mean distribution density D1. On the other hand,
in the annular region R2 that is concentric with the circular region R1 on the upper
surface of the dressing tool 21, the diamond particles 32 are distributed at a mean
distribution density D2 that is higher than the mean distribution density D1.
[0064] In cases where the mean distribution density D1 exceeds 50% of the mean distribution
density D2 when the polishing pad used in the CMP polishing apparatus is polished
, the thickness distribution in the radial direction of the polishing pad 25 becomes
a thickness distribution that is concave in the downward direction, so that the flatness
required in the polishing pad of the CMP apparatus cannot be achieved. On the other
hand, in cases where the mean distribution density D1 is less than 10% of the mean
distribution density D2, the thickness distribution in the radial direction of the
polishing pad 25 becomes a thickness distribution that is convex in the upward direction,
so that the flatness required in the polishing pad of the CMP apparatus cannot be
achieved. Accordingly, it is desirable that the mean distribution density D1 be 10%
to 50% of the mean distribution density D2.
[0065] In the present working configuration, a concentric circular groove 31a is formed
in the substrate 31 between the circular region R1 and annular region R2. However,
it is not absolutely necessary that such as groove 31a be formed. The dressing surface
of the dressing tool 21 is constructed by the circular region R1 and annular region
R2. In Figure 8, O2 indicates the center of the circular region R1 and annular region
R2, and the rotational mechanism 23 causes the dressing tool 21 to rotate about this
center O2 as the center of rotation.
[0066] Since the mean distribution density D2 is set higher than the mean distribution density
D1 as was described above, the cutting capacity per unit area of the annular region
R2 is higher than the cutting capacity per unit area of the circular region R1. Furthermore,
the present working configuration is an example in which the dressing surface is formed
using diamond particles 32 as abrasive grains. However, the present invention is not
limited to this; for example, it would also be possible to set the cutting capacity
per unit area of the annular region R2 at a value that is higher than the cutting
capacity per unit area of the circular region R1 by using other cutting edges instead
of using abrasive particles, and appropriately setting the distribution density of
these cutting edges.
[0067] Furthermore, the above-mentioned dressing tool 21 can basically be manufactured by
a method using electrodeposition (similar to that used in conventional dressing tools)
in which diamond particles are used as abrasive grains. Here, in order to vary the
mean distribution density of the diamond particles 32 in the respective regions R1
and R2, the diamond particles 32 can be separately distributed in the two regions
R1 and R2, for example, by masking the annular region R2 with a mask plate, etc.,
when the diamond particles 32 are distributed in the circular region R1, and masking
the circular region R1 with a mask plate, etc., when the diamond particles 32 are
distributed in the annular region R2. Of course, it goes without saying that various
methods can be used as the manufacturing method of the dressing tool 21.
[0068] As is shown in Figure 8, the diameter of the circular region R1 of the dressing surface
is set so that this diameter is slightly larger than the above-mentioned effective
use width within the radius of the polishing pad 25. The external diameter of the
annular region R2 of the dressing surface is set at approximately half of the external
diameter of the polishing pad 25.
[0069] In this dressing apparatus, as is shown in Figures 7 and 8, the polishing surface
25a of the polishing pad 25 is dressed by respectively rotating the polishing pad
25 and dressing tool 21 as indicated by the arrows a and c in a state in which the
polishing surface (the undersurface in the present working configuration) of the polishing
pad 25 is pressed against the dressing surface of the dressing tool 21 with a specified
pressure (load)
[0070] In the present working configuration, since the dressing surface of the dressing
tool 21 is constructed from a circular region R1 which has a relatively low cutting
capacity per unit area and an annular region R2 which has a relatively high cutting
capacity per unit area, the polishing surface of the polishing pad can be flattened
with a high degree of precision by appropriately setting these cutting capacities.
[0071] In order to confirm this effect, the present inventors obtained the thickness distribution
in the radial direction of a polishing pad 25 (that was initially completely flat)
following dressing for a specified period of time by means of a dressing apparatus
similar to the dressing apparatus of the above-mentioned working configuration or
a dressing apparatus constituting a modification of this dressing apparatus, by means
of a simulation using the equation of Preston. The simulation results are shown in
Figures 10 and 11.
[0072] The simulation conditions when the simulation results A shown in Figure 10 were obtained
were as follows: specifically, in the above-mentioned working configuration, the internal
diameter of the annular polishing pad 25 was set at 60 mm, the external diameter of
the polishing pad 25 was set at 170 mm, the load between the polishing pad 25 and
the dressing tool 21 was set at 3 kgf, the rotational speed of the polishing pad 25
was set at 395 rpm, the rotational speed of the dressing tool 21 was set at 175 rpm,
the rotational directions of the polishing pad 25 and dressing tool 21 were set as
the same direction, the diameter of the circular region R1 of the dressing tool 21
was set at 70 mm, the internal diameter of the annular region R2 of the dressing tool
21 was set at 80 mm, the external diameter of the annular region R2 was set at 100
mm, the distance between the center O1 of the polishing pad 25 and the center O2 of
the dressing tool 21 was set at 52.5 mm, and the mean distribution density D1 of the
abrasive grains in the circular region R1 when the mean distribution density D2 of
the abrasive grains in the annular region R2 was normalized to 1 was set at 0.25 (i.e.,
D1/D2 = 0.25).
[0073] The simulation conditions when the simulation results B shown in Figure 10 were obtained
were as follows: specifically, D1/D2 was set at 0.5, and the remaining conditions
were the same as in the case of the simulation results A. The simulation conditions
when the simulation results C shown in Figure 10 were obtained were as follows: specifically,
D1/D2 was set at 0.75, and the remaining conditions were the same as in the case of
the simulation results A. The simulation conditions when the simulation results D
shown in Figure 10 were obtained were as follows: specifically, D1/D2 was set at 1,
and the remaining conditions were the same as in the case of the simulation results
A.
[0074] The simulation results A, B and C are simulation results of respective embodiments
of the present invention, while the simulation results D are simulation results of
a comparative example.
[0075] The simulation conditions when the simulation results E shown in Figure 11 were obtained
were as follows: specifically, the dressing surface of the dressing tool 21 was constructed
only from an annular region R2, with the circular region R2 eliminated; furthermore,
the internal diameter of the annular region R2 was set at 80 mm, and the external
diameter of the annular region R2 was set at 100 mm. The remaining conditions were
the same as the conditions in the case of the simulation results A.
[0076] The simulation conditions when the simulation results F shown in Figure 11 were obtained
were as follows: specifically, the dressing surface of the dressing tool 1 was constructed
only from a circular region R1, with the annular region R2 eliminated; furthermore,
the diameter of the circular region R1 was set at 70 mm. The remaining conditions
were the same as the conditions in the case of the simulation results A.
[0077] The simulation results E and F are simulation results for examples of dressing apparatuses
corresponding to respective conventional techniques. Furthermore, G in Figure 11 indicates
the initial thickness distribution of the polishing pad 25 prior to dressing.
[0078] It is seen from the simulation results A through D shown in Figure 10 that the thickness
of the polishing pad 25 following dressing can be flattened (compared to a case where
D1 = D2) by setting D1 and D2 so that D1 < D2. In particular, in the simulation examples
shown in Figure 10, the polishing pad 25 is almost completely flattened if D1/D2 is
set at 0.25, as in the simulation results A.
[0079] In a case where the dressing surface of the dressing tool 21 is constructed only
from an annular region R2, a thickness distribution that is convex in the upward direction
is obtained, as in the simulation results E shown in Figure 11. On the other hand,
in a case where the dressing surface of the dressing tool 21 is constructed only from
a circular region R1, a thickness distribution that is concave in the downward direction
is obtained, as in the simulation results F shown in Figure 11. In the simulation
results A through C of embodiments of the present invention, it appears that thickness
distribution characteristics are obtained in which the tendency toward a thickness
distribution that is convex in the upward direction caused by the annular region R2
and the tendency toward a thickness distribution that is concave in the downward direction
caused by the circular region R1 are synthesized, so that the degree of the contributions
of both distributions is determined by D1/D2. In the simulation examples shown in
Figure 10, it appears that the two tendencies cancel each other more or less completely
when D1/D2 = 0.25, so that a more or less completely flat thickness distribution is
obtained.
[0080] Since the above results are based on logical calculations by simulation, actual results
will show some deviation from the simulation results. However, when the present inventors
performed actual experiments, although there was some need for appropriate alteration
of the numerical values of the conditions as required, experimental results showing
tendencies similar to those of the simulations were obtained. In regard to the actual
conditions, for example, D1/D2, etc., may be appropriately set so that the polishing
pad 25 reaches the greatest degree of flatness following dressing. Furthermore, the
values of the mean distribution densities D1 and D2 themselves may be appropriately
set with the particle size of the diamond particles 32, etc., being taken into account
so that such a ratio is satisfied, and so that the polishing surface of the polishing
pad 25 is roughened to the desired extent following dressing.
[0081] The invention of the working configuration described above using Figures 7 through
11 makes it possible to provide a dressing tool that can flatten the polishing surface
of the polishing pad following dressing with good precision, and a dressing apparatus
using this dressing tool.
[Third Working Configuration]
[0082] Figure 12 is a schematic structural diagram which shows in model form a polishing
apparatus constituting a third working configuration of the present invention. Figure
13 is a schematic plan view which shows in model form the positional relationship
between the dressing surface 53 of the dressing tool 51 and the polishing pad 44 during
the dressing of the polishing pad 44.
[0083] The polishing apparatus of the present working configuration comprises a polishing
tool 41, a wafer holder 43 which holds a wafer 42 beneath the polishing tool 41 positioned
in a polishing station (polishing zone) indicated on the right side of the figure,
a polishing agent supply part (not shown in the figures) which supplies a polishing
agent (slurry) to the space between the wafer 42 and the polishing tool 41 via a supply
path (not shown in the figures) formed in the polishing tool 41, a dressing apparatus
46 which is disposed in a dressing station (dressing zone) shown on the left side
of the figure and which dresses the polishing surface of the polishing pad 44 of the
polishing tool 41 positioned in the dressing station, a displacement meter 47 which
is disposed in the dressing station, a control part 48 consisting of a computer, etc.,
a driving part 49 which drives the motors of various parts under the control of the
control part 48, and an input part 50 such as a keyboard.
[0084] The polishing tool 41 has a polishing pad 44 and a substrate 45 which supports the
surface of the polishing pad 44 on the opposite side from the polishing surface. In
the present working configuration, as is shown in Figure 13, the shape of the polishing
pad 44 is a ring-form shape in which the portion in the vicinity of the center of
rotation is removed. However, the present invention is not limited to this; for example,
this shape may also be a circular disk-form shape. The polishing tool 41 is arranged
so that this tool can be rotated, moved upward and downward and caused to swing (perform
a reciprocating motion) to the left and right as indicated by the arrows A, B and
C in Figure 12 by means of a mechanism (not shown in the figures) using electric motors
as actuators. Furthermore, as is shown in Figure 12, the polishing tool 41 can be
moved between the polishing station and the dressing station by means of a moving
mechanism (not shown in the figures) using an electric motor as an actuator.
[0085] The polishing tool 41 is mechanically connected to a rotating shaft 56 via a lockable
gimbal mechanism 55. Although this is not shown in the figures, this gimbal supporting
structure 55 has basically the same construction as a conventionally used gimbal mechanism.
However, this gimbal mechanism 55 also has a locking mechanism that is operated by
an electromagnetic actuator, and is constructed so that this mechanism can be switched
between a state in which the polishing tool 41 can be freely inclined with respect
to the rotating shaft 56 under the control of the control part 48 (gimbal state),
and a state in which the polishing tool 41 is fixed so that this tool cannot be inclined
with respect to the rotating shaft 56 (gimbal locked state). In the gimbal locked
state, the undersurface (polishing pad supporting surface) of the substrate 45 is
perpendicular to the rotating shaft 56. The gimbal mechanism 55 is placed in the gimbal
state in the polishing station, and is placed in the gimbal locked state in the dressing
station.
[0086] The wafer 42 is held on the wafer holder 43, and the upper surface of the wafer 42
is the surface that is polished. The wafer holder 43 can be rotated as indicated by
the arrow D in Figure 12 by a mechanism (not shown in the figures) using an electric
motor as an actuator.
[0087] In the present working configuration, the diameter of the polishing tool 41 is set
at a value that is smaller than the diameter of the wafer 42, so that the footprint
of the apparatus as a whole is small, and so that high-speed, low-load polishing is
facilitated. Of course, in the present invention, the diameter of the polishing tool
41 may also be the same as or larger than the diameter of the wafer 42.
[0088] Here, the polishing of the wafer 42 by this polishing apparatus will be described.
In the polishing station, the polishing tool 41 is caused to swing back and forth
while rotating, and is pressed against the upper surface of the wafer 42 on the wafer
holder 43 with a specified pressure (load). The wafer holder 43 is caused to rotate
so that the wafer 42 is also caused to rotate, thus causing a relative motion to be
performed between the wafer 42 and the polishing tool 41. In this state, a polishing
agent is supplied to the space between the wafer 42 and the polishing tool 41 from
the polishing agent supply part; this polishing agent diffuses between the wafer 42
and polishing tool 41, and polishes the surface of the wafer 42 that is being polished.
Specifically, favorable polishing is accomplished as a result of the synergistic effect
of the mechanical polishing effected by the relative motion of the polishing tool
41 and wafer 42 and the chemical action of the polishing agent.
[0089] The dressing apparatus 46 comprises a dressing tool 51. In the present working configuration,
the dressing tool 51 has a circular disk-form tool body in which a ring-form part
on the outer circumferential side of the upper surface is formed as a planar surface
that is a step higher; this dressing tool 51 has a structure in which abrasive grains
such as diamond particles are distributed on the upper surface of this ring-form part
that is a step higher. The ring-form region in which these abrasive grains are distributed
constitutes the dressing surface 53. Of course, the construction of the dressing tool
51 is not limited to such a construction. Furthermore, the dressing surface 53 is
not limited to a ring-form surface; for example, this dressing surface 53 may also
have a circular shape.
[0090] Furthermore, in the present working configuration, the dressing apparatus 46 comprises
a rotating mechanism 61 which causes the dressing tool 51 to rotate as indicated by
the arrow E, and an inclination adjustment mechanism 62 which can adjust and set the
inclination of the dressing surface 53 in the direction indicated by the arrow F.
[0091] The inclination adjustment mechanism 62 has a bracket 64 which is fastened to a base
63, an inclining member 66 which is supported on the bracket 64 so that this member
can be caused to incline by a shaft 65, and an electric motor used as an actuator
(not shown in the figures). When the inclining member 66 is inclined by operating
the above-mentioned electric motor, and the above-mentioned electric motor is then
stopped, the inclining member 66 is held in this position. Of course, the inclination
adjustment mechanism 62 is not limited to such a structure; it goes without saying
that various types of structures may be used. Although this is not shown in detail
in the figures, the base side of the rotating mechanism 61 is fastened to the inclining
member 66, and the rotating side of the rotating mechanism 61 is fastened to the tool
main body 62 of the dressing tool 51. The rotating mechanism 61 has an electric motor
(not shown in the figures) as an actuator.
[0092] The shaft 65 of the inclination adjustment mechanism 62 extends in a direction perpendicular
to the plane of the page in Figure 12, and extends in a direction perpendicular to
the straight line G shown in Figure 13 (i.e., a straight line that passes through
the center O1 of the polishing pad 44 and the center O2 of the dressing surface 53
of the dressing tool 51 during the dressing shown in Figure 13). As a result, in the
present working configuration, inclination of the dressing surface 53 about the axial
line of this shaft 65 (direction indicated by the arrow F) can be adjusted and set.
It is most desirable that it be possible to adjust the inclination of the dressing
surface 53 in this direction F; however, the inclination adjustment mechanism 62 may
also be constructed so that the inclination in some direction other than this direction
is adjustable. Furthermore, in the present working configuration, the inclination
adjustment mechanism 62 is constructed so that the inclination of the dressing surface
53 can be adjusted and set as described above; conversely, however, it would also
be possible to construct the inclination adjustment mechanism 62 so that the inclination
of the polishing tool 41 can be adjusted and set.
[0093] As is shown in Figures 12 and 13, the dressing of the polishing surface (undersurface
in the present working configuration) of the polishing pad 44 is accomplished in the
same manner as polishing by pressing the polishing pad 44 of the polishing tool 41
positioned in the dressing station against the dressing surface 53 of the dressing
tool 51 in a state in which a load is applied, and causing the polishing tool 41 and
dressing tool 51 to rotate as indicated by the respective arrows A and E. However,
the swinging motion of the polishing tool 41 in the direction indicated by the arrow
C is not performed. As is shown in Figures 12 and 13, this dressing is performed in
a state in which a portion of the dressing surface 53 protrudes from the polishing
pad 44 on the inner circumferential side and outer circumferential side. During this
dressing, the gimbal mechanism 55 is placed in the gimbal locked state; furthermore,
in the inclination adjustment mechanism 62, a preset inclination of the dressing surface
53 of the dressing tool 51 is held "as is." Accordingly, during the dressing of the
polishing pad 44, there is no change in the relative inclination of the dressing surface
53 with reference to the polishing pad supporting surface (undersurface) of the substrate
45 of the polishing tool 41.
[0094] In the present working configuration, the displacement meter 47 disposed in the dressing
station constitutes a measuring part that obtains information corresponding to the
surface shape of the polishing surface of the polishing pad 44. The displacement meter
47 obtains this information under the control of the control part 48. In the present
working configuration, although this is not shown in the figures, a commercially marketed
contact needle-type displacement meter is used as the displacement meter 47. This
displacement meter is arranged so that the contact needle contacts the polishing surface
of the polishing pad 44 and moves upward and downward in accordance with the height
of this polishing surface, thus making it possible to measure the surface shape of
the polishing surface of the polishing pad 44 by sliding the contact needle in the
radial direction of the polishing pad 44. Furthermore, since the heights at respective
positions on a circumference of the same radius on the polishing pad 44 are substantially
the same, it is necessary only to measure the heights at respective positions on a
single line along a given radius of the polishing pad 44. For example, it would also
be possible to use an optical-type displacement meter, etc., as the displacement meter
47 instead of a contact needle-type displacement meter.
[0095] The control part 48 controls the respective parts (as ordinary control) so that the
above-mentioned polishing operation is performed in the polishing station, and controls
the respective parts so that the above-mentioned dressing is performed in the dressing
station with a specified frequency.
[0096] Furthermore, the control part 48 also performs the inclination adjustment control
shown in Figure 14. Figure 14 is a schematic flow chart which shows the operation
of this inclination adjustment control. The control part 48 initiates inclination
adjustment control in response to an inclination adjustment command signal from the
input part 50 that is input by the operation of the operator. For example, this command
signal may be sent when the dressing tool 51 is replaced with a new dressing tool.
Of course, such inclination adjustment command signals may also be sent at a specified
frequency within the period of use of the same dressing tool 51. The system may also
be devised, for instance, so that the control part 48 itself judges a period corresponding
to a preset frequency and automatically generates such inclination adjustment command
signals, instead of these signals being sent from the input part 50 by the operator.
[0097] When the control part 48 initiates this inclination adjustment control, the above-mentioned
dressing of the polishing pad 44 is first performed (step S1). When this dressing
is completed, the control part 48 sends a control signal to the displacement meter
47 and causes the displacement meter to measure the above-mentioned surface shape
of the polishing pad 44. The control part 48 inputs this surface shape data (step
S2). During the measurement of this surface shape, for example, the measurement is
performed in a state in which the rotation of the dressing tool 51 is stopped, the
polishing surface of the polishing pad 44 is caused to float from the dressing surface
53 of the dressing tool 51, and the polishing tool 41 is caused to rotate.
[0098] Next, the control part 48 makes a judgement as to whether or not the surface shape
most recently input in step S2 is a surface shape that is within a predetermined permissible
range with respect to an ideal, completely flat surface shape, and thus judges whether
or not the inclination of the dressing surface 53 of the dressing tool 51 that is
currently set by the inclination adjustment mechanism 62 is the desired inclination
(step S3).
[0099] If it is judged in step S3 that the surface shape is not a surface shape within the
above-mentioned permissible range (i.e., that the current inclination of the dressing
surface 53 is not the desired inclination), the control part 48 operates the inclination
adjustment mechanism 62 so that the inclination of the dressing surface 53 is adjusted
to an inclination which is such that the surface shape following dressing is a surface
shape that is within the permissible range or a surface shape that approaches such
a surface shape within the permissible range, and sets the inclination at this inclination
(step S4). The control part 48 then returns to step S1. Furthermore, with regard to
the relationship between the surface shape and the inclination of the dressing surface
53, the necessary amount of inclination adjustment can be determined by using an equation
or look-up table that is determined from experimental data, etc. Alternatively, the
amount of inclination adjustment can be set at a certain small fixed amount, and determined
from the surface shape obtained in step S2 only in the direction of increasing or
decreasing inclination.
[0100] On the other hand, if it is judged in step S3 that the surface shape is a surface
that is within the permissible range, the control part 48 ends the inclination adjustment
control, and performs the above-mentioned ordinary control.
[0101] In the present working configuration, as was described above, the relative inclination
of the dressing surface 53 with reference to the polishing pad supporting surface
(undersurface) of the substrate 45 of the polishing tool 41 is maintained at the inclination
adjusted and set beforehand by the inclination adjustment mechanism 62 during the
dressing of the polishing pad 44. Furthermore, as a result of the above-mentioned
inclination adjustment control by the control part 48, the relative inclination of
the dressing surface 53 that is finally set is unaffected by the difference in inclination
between the rotating shaft of the polishing tool 41 and the rotating shaft of the
dressing tool 51, and is adjusted and set at inclination which is such that a surface
shape of the polishing pad 44 that is extremely close to an ideal, completely flat
surface shape can be obtained.
[0102] Accordingly, in the present working configuration, factors that hinder the improvement
of the flattening of the polishing pad in a polishing pad dressing technique using
angular tracking by means of a gimbal mechanism are eliminated; furthermore, the effect
of the difference in inclination between the rotating shaft of the polishing tool
41 and the rotating shaft of the dressing tool 51 is completely eliminated. Accordingly,
in the present working configuration, the polishing pad 44 can be dressed to a flat
shape with a higher degree of precision than in conventional techniques. Furthermore,
in the present working configuration, since the wafer 42 is polished in the polishing
station by a polishing pad 44 that has thus been dressed to a flat state with a high
degree of precision, the wafer 42 can be polished to a flat state with a high degree
of precision.
[0103] Furthermore, in the present working configuration, it would also be possible to use
the dressing tool 51 instead of the dressing tool 21 shown in Figure 7. If this is
done, the effects of the present working configuration described above, and the effects
of using a dressing tool 21 with a special structure as described in the above-mentioned
second working configuration, can both be obtained.
[Fourth Working Configuration]
[0104] Figure 15 is a schematic structural diagram which shows in model form a dressing
apparatus constituting a fourth working configuration of the present invention. Figure
16 is a schematic plan view which shows in model form the positional relationship
between the dressing surface 84 of the dressing tool 72 and the polishing pad 44.
[0105] In the above-mentioned third working configuration, the dressing apparatus 46 was
built into the polishing apparatus. Furthermore, in the third working configuration,
the inclination adjustment performed by the inclination adjustment mechanism 62 was
automated.
[0106] In contrast, the dressing apparatus of the present working configuration is constructed
independently from the polishing apparatus. Furthermore, the present working configuration
is constituted so that the inclination adjustment performed by the inclination adjustment
mechanism is performed manually by the operator.
[0107] For example, the dressing apparatus of the present working configuration dresses
the polishing surface (undersurface in Figure 15) of the polishing pad 44 used in
a polishing apparatus in which the dressing apparatus 46 in the polishing apparatus
shown in Figure 12 (according to the above-mentioned third working configuration)
is removed.
[0108] The dressing apparatus of the present working configuration comprises a pad holder
71 which holds the polishing pad 44 by vacuum suction chucking, etc., a dressing tool
72, an inclination adjustment mechanism 73, a raising and lowering mechanism 74, a
displacement meter 75, and a display part 76.
[0109] The pad holder 71 has a circular disk-form substrate 81 which supports the surface
of the polishing pad 44 on the opposite side from the polishing surface. In the present
working configuration as well, the shape of the polishing pad 44 is a ring-form shape
in which the portion in the vicinity of the center of rotation is removed as shown
in Figure 16. However, the shape used is not limited to this shape; for example, a
circular disk-form shape may also be used. The pad holder 71 can be caused to rotate
as indicated by the arrow H in Figures 15 and 16 by a mechanism (not shown in the
figures) that uses an electric motor as an actuator. The pad holder 71 does not perform
an upward and downward motion or swinging motion. The pad holder 71 is fastened to
a rotating shaft 72 without a gimbal mechanism. Accordingly, the pad holder 71 cannot
tilt.
[0110] In the present working configuration, the dressing tool 72 has a tool main body 83
which has the shape of a rectangular solid; this dressing tool 72 has a structure
in which abrasive grains such as diamond particles are distributed over the entire
upper surface. The rectangular region over which these abrasive grains are distributed
constitutes a dressing surface 84. Of course, the construction of the dressing tool
72 and the shape of the dressing surface 74 are not limited to such a construction
and shape.
[0111] The inclination adjustment mechanism 73 is constructed so that the inclination of
the dressing surface 84 in the direction indicated by the arrow J can be adjusted
and set. The inclination adjustment mechanism 73 has a bracket 86 which is fastened
to a base-side member 85, an inclining member 88 which is supported on the bracket
86 so that this member can be inclined by a shaft 87, an adjustment screw 89, a supporting
member 90 which is fastened to the member 85 and which supports the adjustment screw
89 so that this screw is free to turn, a left-right moving member 91 with which the
adjustment screw 89 is screw-engaged, and which can move over the member 85 to the
left and right as indicated by the arrow K in Figure 15, and a lock screw (not shown
in the figures) which locks the inclining member 88 to the bracket 86 at the adjusted
inclination, and which releases this locking action. The upper surface of the left-right
moving member 91 and the undersurface on the tip end of the inclining member 88 are
formed as tapered surfaces that engage with each other- In this inclination adjustment
mechanism 73, when the operator releases the above-mentioned lock screw and turns
the adjustment screw 89 in one direction or the other, the left-right moving member
91 moves to the left or right in accordance with the direction and amount of this
turning of the adjustment screw. Since the tapered surfaces of the left-right moving
member 91 and inclining member 88 are engaged with each other, the inclination of
the inclining member 88 in the direction indicated by the arrow J in Figure 15 is
determined in accordance with the left-right movement of the left-right moving member
91. The inclining member 88 and the tool main body 73 of the dressing tool 72 are
fastened to each other via a connecting member 92. Accordingly, by releasing the above-mentioned
lock screw and turning the adjustment screw 89 in one direction or the other, the
operator can adjust the inclination of the dressing surface 84 in the direction indicated
by the arrow J; furthermore, the operator can cause this inclination to be held by
locking this inclination with the above-mentioned lock screw following this adjustment.
Of course, the inclination adjustment mechanism 73 is not limited to such a structured
it goes without saying that various types of structures may be used.
[0112] The shaft 87 of the inclination adjustment mechanism 73 extends in a direction perpendicular
to the plane of the page in Figure 15, and extends in a direction that is perpendicular
to the straight line M shown in Figure 16 (i.e., a straight line that passes through
the center O1 of the polishing pad 44 and the center O3 of the dressing surface 84
of the dressing tool 72 during the dressing shown in Figure 16). As a result, in the
present working configuration, the inclination of the dressing surface 84 about the
axial line of this shaft 87 (the direction indicated by the arrow J) can be adjusted
and set. It is most desirable that it be possible to adjust the inclination of the
dressing surface 84 in this direction J; however, the inclination adjustment mechanism
73 may also be constructed so that the inclination in some direction other than this
direction is adjustable. Furthermore, in the present working configuration, the inclination
adjustment mechanism 73 is constructed so that the inclination of the dressing surface
84 can be adjusted and set as described above; conversely, however, it would also
be possible to construct the inclination adjustment mechanism 73 so that the inclination
of the pad holder 71 can be adjusted and set.
[0113] The raising and lowering mechanism 74 is constructed by a cylinder. Specifically,
the raising and lowering mechanism 34 has a cylinder tube 94 which is fastened to
a base 93, a piston 95 which is inserted into the cylinder tube 94 so that this piston
95 is free to slide in the axial direction (vertical direction), and a piston rod
96 which is connected to this piston 95, and which passes through the cylinder tube
94 and extends upward. The upper end of the rod 96 is fastened to the member 85. By
appropriately setting the supply and discharge of air and the pressure in the compartments
on both sides demarcated by the piston 95 inside the cylinder tube 94, it is possible
to move the piston rod 96 upward and downward in the direction indicated by the arrow
L, and to determine the pressing force exerted on the polishing pad 44 by the dressing
surface 84 of the dressing tool 72.
[0114] Like the displacement meter 47 shown in Figure 12, the displacement meter 75 constitutes
a measuring part that obtains information corresponding to the surface shape of the
polishing surface of the polishing pad 44; the same displacement meter used as the
displacement meter 47 can also be used here. The display part 76 displays the surface
shape measured by the displacement meter 75.
[0115] In the present working configuration, as is shown in Figures 15 and 16, the dressing
of the polishing surface (the undersurface in the present working configuration) of
the polishing pad 44 is accomplished by raising the dressing tool 72 by means of the
raising and lowering mechanism 74 so that the polishing pad 44 is pressed against
the dressing surface 84 of the dressing tool 72 in a state in which a load is applied,
and by causing the pad holder 71 to rotate as indicated by the arrow H. As is shown
in Figures 15 and 16, this dressing is performed in a state in which a portion of
the dressing surface 84 protrudes from the polishing pad 44 on the outer circumferential
side and inner circumferential side. During this dressing, the inclination of the
pad holder 71 does not change; furthermore, the inclination of the dressing surface
84 of the dressing tool 72 set beforehand by the inclination adjustment mechanism
73 is held "as is." Accordingly, during the dressing of the polishing pad 44, there
is no change in the relative inclination of the dressing surface 84 with reference
to the polishing pad supporting surface (undersurface) of the substrate 81 of the
pad holder 71.
[0116] In the present working configuration, the operator performs a function that more
or less corresponds to the inclination adjustment control function (shown in Figure
14) of the above-mentioned control part 48 shown in Figure 12. Specifically, the operator
first causes the above-mentioned dressing operation to be performed. When this dressing
is completed, the operator measures the surface shape of the polishing pad 44 using
the displacement meter 75, and displays the measured surface shape on the display
part 76. Then, the operator views the surface shape displayed on the display part
76, and judges whether or not the inclination of the dressing surface 84 of the dressing
tool 72 currently set by the inclination adjustment mechanism 73 is the desired inclination
by judging whether or not this surface shape is a surface shape that is within the
predetermined permissible range for an ideal, completely flat surface shape. In cases
where the surface shape is not a surface shape that is within the permissible range,
the operator adjusts the inclination of the dressing surface 84 by means of the inclination
adjustment mechanism 73 on the basis of the surface shape displayed by the display
part 76 so that the surface shape following dressing is adjusted to a surface shape
within the permissible range or a surface shape that approaches such a surface shape,
and sets the inclination at this inclination. Then, the operator repeats the above-mentioned
operation until the surface shape that is measured and displayed is adjusted to a
surface shape that is within the permissible range. Once a surface shape that is within
the permissible range is obtained, the adjustment of the inclination of the dressing
surface 84 is ended; furthermore, the dressing of the polishing pad 44 is completed.
[0117] In the present working configuration, since work by an operator is required, the
operation is slightly more complicated than in the case of the above-mentioned third
working configuration; however, as in the case of the above-mentioned first working
configuration, the polishing pad 44 can be dressed to a flat state with a higher degree
of precision than in conventional techniques.
[0118] Incidentally, in the above-mentioned third working configuration, it would also be
possible to install the inclination adjustment mechanism 73 and connecting member
92 shown in Figure 15 instead of the inclination adjustment mechanism 62 and rotating
mechanism 61 shown in Figure 12. Conversely, in the above-mentioned fourth working
configuration, it would also be possible to install the inclination adjustment mechanism
62 and rotating mechanism 61 shown in Figure 12 instead of the inclination adjustment
mechanism 73 and connecting member 92 shown in Figure 15. In this case, if a control
part and input part that perform a control procedure corresponding to the above-mentioned
operation of the operator are installed, automation can also be achieved in a dressing
apparatus that is independent of the polishing apparatus. In cases where automation
is achieved in such an independent dressing apparatus, it is not absolutely necessary
to install a displacement meter 75 in the dressing apparatus. In this case, the surface
shape of the polishing surface of the polishing pad 44 may be measured by a separate
displacement meter that is independent from the dressing apparatus in a state in which
the polishing pad 44 is temporarily removed from the pad holder 71, and the data may
be input into the control part from the input part.
[0119] Furthermore, in the case of a polishing apparatus in which the dressing apparatus
46 is removed from the polishing apparatus according to the above-mentioned third
working configuration shown in Figure 12, the use of a polishing pad 44 that is dressed
by the dressing apparatus of the above-mentioned fourth working configuration results
in a polishing apparatus according to another working configuration of the present
invention.
[Fifth Working Configuration]
[0120] Figure 17 is a flow chart which shows a semiconductor device manufacturing process
that constitutes a working configuration of the present invention. The semiconductor
device manufacturing process is started, and an appropriate treatment process is first
selected in step S200 from the subsequently shown steps S201 through S204. The processing
then proceeds to one of these steps S201 through S204 in accordance with this selection.
[0121] Step S201 is an oxidation process in which the surface of the silicon wafer is oxidized.
Step S202 is a CVD process in which an insulating film is formed on the surface of
the silicon wafer by CVD, etc. Step S203 is an electrode formation process in which
electrode films are formed on the surface of the silicon wafer by a process such as
vapor deposition. Step S204 is an ion injection process in which ions are injected
into the silicon wafer.
[0122] Following the CVD process or electrode formation process, the processing proceeds
to step S209, and a judgement is made as to whether or not a CMP process is to be
performed. In cases where such a process is not to be performed, the processing proceeds
to step S206; however, in cases where such a process is to be performed, the processing
proceeds to step S205. Step S205 is a CMP process; in this process, flattening of
the inter-layer insulating film, or the formation of a damascene by the polishing
of a metal film on the surface of the semiconductor device, etc., is performed using
the polishing apparatus of the present invention.
[0123] Following the CMP process or oxidation process, the processing proceeds to step S206.
Step S206 is a photolithographic process. In this photolithographic process, the silicon
wafer is coated with a resist, a circuit pattern is burned onto the silicon wafer
by exposure using an exposure apparatus, and the exposed silicon wafer is developed.
Furthermore, the subsequent step S207 is an etching process in which the portions
other than the developed resist image are removed by etching, after which the resist
is stripped away, and the resist that has become unnecessary following the completion
of etching is removed.
[0124] Next, in step S208, a judgement is made as to whether or not all of the necessary
processes have been completed. In cases where these processes have not been completed,
the processing returns to step S200, and the preceding steps are repeated so that
a circuit pattern is formed on the silicon wafer. If it is judged in step S208 that
all of the processes have been completed, the processing is ended.
[0125] In the semiconductor device manufacturing method of the present invention, since
the polishing apparatus of the present invention is used in the CMP process, wafers
can be polished to a flat state with a high degree of precision. Accordingly, the
following effect is obtained: namely, the yield of the CMP process is increased, so
that semiconductor devices can be manufactured at a lower cost than in conventional
semiconductor device manufacturing methods.
[0126] Furthermore, the polishing apparatus of the present invention may also be used in
the CMP processes of semiconductor device manufacturing processes other than the above-mentioned
semiconductor device manufacturing process.
[0127] As a result, the semiconductor device manufacturing method of the present invention
makes it possible to manufacture semiconductor devices at a lower cost than conventional
semiconductor device manufacturing methods, so that the manufacturing cost of semiconductor
devices can be reduced.
Industrial Applicability
[0128] The dressing tool and dressing apparatus of the present invention can be used in
the polishing of the polishing pad in a polishing apparatus, etc. Furthermore, the
working apparatus of the present invention can be used as (for example) a polishing
apparatus in the polishing of wafers in a semiconductor device manufacturing process.
Moreover, the semiconductor device manufacturing method of the present invention can
be used to manufacture semiconductor devices that have fine patterns.
1. A dressing tool which performs the dressing of a working tool that has a doughnut
disk-form or circular disk-form working surface, this dressing tool being characterized by the fact that the tool has a substantially rectangular dressing surface that performs
dressing by contacting the working surface of the above-mentioned working tool, and
the above-mentioned dressing surface is disposed so that the centerline of the above-mentioned
dressing surface in the direction of the short sides of the above-mentioned substantially
rectangular shape coincides with the radial direction passing through the center of
the above-mentioned doughnut disk or circular disk of the above-mentioned working
tool during dressing.
2. The dressing tool according to Claim 1, which is characterized by the fact that the shapes of both long sides of the above-mentioned substantially
rectangular shape that extend parallel to the above-mentioned centerline in the direction
of the short sides are shapes which are such that when the above-mentioned dressing
surface is caused to contact the above-mentioned working surface, the contact length
between the above-mentioned working surface and the above-mentioned dressing surface
is equal at all positions in the radial direction of the above-mentioned working surface.
3. A dressing apparatus which is characterized by the fact that this apparatus has the dressing tool according to Claim 1, and a working
tool holding mechanism which holds a working tool that has a doughnut disk-form or
circular disk-form working surface, and which causes this working tool to rotate about
an axis that passes through the center of the above-mentioned doughnut disk or circular
disk perpendicular to the above-mentioned working surface.
4. The dressing apparatus according to Claim 3, which is characterized by the fact that this apparatus has a plurality of dressing tools, and these dressing
tools are disposed so that the dressing tools simultaneously dress the above-mentioned
working surface.
5. A working apparatus which has the above-mentioned working tool that is dressed by
the dressing tool according to Claim 1.
6. A working apparatus which has the above-mentioned working tool that is dressed by
the dressing apparatus according to Claim 3.
7. A dressing tool which is used to dress the working surface of a working tool that
has a circular outer circumference, this dressing tool being characterized by the fact that the dressing tool comprises a dressing surface which is constructed
from a circular region that has a first cutting capacity per unit area, and an annular
region that is concentric with the above-mentioned circular region and that has a
second cutting capacity per unit area that is higher than the above-mentioned first
cutting capacity per unit area, the diameter of the above-mentioned circular region
of the above-mentioned dressing surface is greater than the effective use width within
the radius of the above-mentioned working surface, and the external diameter of the
above-mentioned annular region of the above-mentioned dressing surface is substantially
half of the external diameter of the above-mentioned working surface.
8. A dressing tool which is used to dress the working surface of a working tool that
has a circular outer circumference, this dressing tool being characterized by the fact that the dressing tool comprises a dressing surface which is constructed
from a circular region in which abrasive grains are distributed at a first mean distribution
density, and an annular region which is concentric with the above-mentioned circular
region, and in which abrasive grains are distributed at a second mean distribution
density that is higher than the above-mentioned first mean distribution density, the
diameter of the above-mentioned circular region of the above-mentioned dressing surface
is greater than the effective use width within the radius of the above-mentioned working
surface, and the external diameter of the above-mentioned annular region of the above-mentioned
dressing surface is substantially half of the external diameter of the above-mentioned
working surface.
9. The dressing tool according to Claim 8, which is characterized by the fact that the above-mentioned first mean distribution density is 10% to 50% of
the above-mentioned second mean distribution density.
10. A dressing apparatus which is characterized by the fact that this dressing apparatus comprises the dressing tool according to Claim
7, and a rotational mechanism which causes this dressing tool to rotate.
11. A dressing method which dresses the working surface of a working tool supported on
a substrate by causing contact between this working surface and the dressing surface
of a dressing tool and causing relative motion between the above-mentioned substrate
and the above-mentioned dressing tool, this dressing method being characterized by the fact that this method comprises a setting stage in which the relative inclination
of the above-mentioned dressing surface with reference to the above-mentioned substrate
is adjusted to a desired inclination and set, and a dressing stage in which the above-mentioned
working surface is dressed while maintaining the above-mentioned relative inclination
set in the above-mentioned setting stage.
12. The dressing method according to Claim 11, which is characterized by the fact that the above-mentioned setting stage includes a stage in which information
corresponding to the surface shape of the above-mentioned working surface is obtained,
and a stage in which the above-mentioned relative inclination is adjusted and set
on the basis of the above-mentioned information.
13. The dressing method according to Claim 11, which is characterized by the fact that the above-mentioned setting stage and the above-mentioned dressing
stage are alternately repeated a multiple number of times each until the surface shape
of the above-mentioned working surface becomes a surface shape that is within the
permissible range.
14. The dressing method according to Claim 11, which is characterized by the fact that the dressing of the above-mentioned working surface in the above-mentioned
dressing stage is performed in a state in which a portion of the above-mentioned dressing
surface protrudes from the circumference of the above-mentioned working surface.
15. The dressing method according to Claim 11, which is characterized by the fact that the above-mentioned relative inclination is an inclination about a
specified axial line that is substantially perpendicular to a straight line passing
through the vicinity of the center of the above-mentioned working surface and the
vicinity of the center of the above-mentioned dressing surface.
16. A dressing apparatus which dresses the working surface of a working tool supported
on a substrate by causing contact between this working surface and the dressing surface
of a dressing tool and causing relative motion between the above-mentioned substrate
and the above-mentioned dressing tool, this dressing apparatus being characterized by the fact that the apparatus comprises an inclination adjustment mechanism that can
adjust the relative inclination of the above-mentioned dressing surface with reference
to the above-mentioned substrate to a desired inclination and set this inclination,
and a moving mechanism which dresses the above-mentioned working surface by causing
relative motion between the above-mentioned substrate and the above-mentioned dressing
tool while maintaining the above-mentioned relative inclination set by the above-mentioned
inclination adjustment mechanism.
17. The dressing apparatus according to Claim 16, which is characterized by the fact that the dressing apparatus is an apparatus that dresses the working surface
of a working tool that has a circular outer circumference, the above-mentioned dressing
tool comprises a dressing surface which is constructed from a circular region that
has a first cutting capacity per unit area, and an annular region that is concentric
with the above-mentioned circular region and that has a second cutting capacity per
unit area that is higher than the above-mentioned first cutting capacity per unit
area, the diameter of the above-mentioned circular region of the above-mentioned dressing
surface is greater than the effective use width within the radius of the above-mentioned
working surface, and the external diameter of the above-mentioned annular region of
the above-mentioned dressing surface is substantially half of the external diameter
of the above-mentioned working surface.
18. The dressing apparatus according to Claim 16, which is characterized by the fact that the dressing apparatus comprises a control part that operates the above-mentioned
inclination adjustment mechanism on the basis of information corresponding to the
surface shape of the above-mentioned working surface so that the above-mentioned relative
inclination is a desired inclination.
19. The dressing apparatus according to Claim 18, which is characterized by the fact that the dressing apparatus comprises a measuring part that acquires the
above-mentioned information,
20. A dressing apparatus which dresses the working surface of a working tool supported
on a substrate by causing contact between this working surface and the dressing surface
of a dressing tool and causing relative motion between the above-mentioned substrate
and the above-mentioned dressing tool, this dressing apparatus being characterized by the fact that the apparatus comprises an inclination adjustment mechanism that can
adjust the relative inclination of the above-mentioned dressing surface with reference
to the above-mentioned substrate to a desired inclination and set this inclination,
a moving mechanism which dresses the above-mentioned working surface by causing relative
motion between the above-mentioned substrate and the above-mentioned dressing tool
while maintaining the above-mentioned relative inclination set by the above-mentioned
inclination adjustment mechanism, a measuring part which acquires information corresponding
to the surface shape of the above-mentioned working surface, and a control part which,
in response to specified command signals, (i) causes the above-mentioned dressing
to be performed by operating the above-mentioned moving mechanism, (ii) makes a judgement
as to whether or not the above-mentioned relative inclination that is currently set
is the desired inclination on the basis of the above-mentioned information acquired
by the above-mentioned measuring part following the dressing performed in the above-mentioned
(i), (iii) ends the adjustment of the above-mentioned relative inclination in cases
where it is judged in the above-mentioned (ii) that the currently set inclination
is the desired inclination, and (iv) repeats the operation from the above-mentioned
(i) on after operating the above-mentioned inclination adjustment mechanism so that
the above-mentioned relative inclination is adjusted to the desired inclination or
an inclination that approaches this desired inclination in cases where it is judged
in the above-mentioned (ii) that the currently set inclination is not the desired
inclination.
21. The dressing apparatus according to Claim 20, which is characterized by the fact that the dressing apparatus is an apparatus that dresses the working surface
of a working tool that has a circular outer circumference, the above-mentioned dressing
tool comprises a dressing surface which is constructed from a circular region that
has a first cutting capacity per unit area, and an annular region that is concentric
with the above-mentioned circular region and that has a second cutting capacity per
unit area that is higher than the above-mentioned first cutting capacity per unit
area, the diameter of the above-mentioned circular region of the above-mentioned dressing
surface is greater than the effective use width within the radius of the above-mentioned
working surface, and the external diameter of the above-mentioned annular region of
the above-mentioned dressing surface is substantially half of the external diameter
of the above-mentioned working surface.
22. The dressing apparatus according to Claim 16, which is characterized by the fact that the dressing of the above-mentioned working surface is performed in
a state in which a portion of the above-mentioned dressing surface protrudes from
the circumference of the above-mentioned working surface.
23. The dressing apparatus according to Claim 20, which is characterized by the fact that the dressing of the above-mentioned working surface is performed in
a state in which a portion of the above-mentioned dressing surface protrudes from
the circumference of the above-mentioned working surface.
24. The dressing apparatus according to Claim 16, which is characterized by the fact that the above-mentioned relative inclination is an inclination about a
specified axial line that is substantially perpendicular to a straight line passing
through the vicinity of the center of the above-mentioned working surface and the
vicinity of the center of the above-mentioned dressing surface.
25. The dressing apparatus according to Claim 20, which is characterized by the fact that the above-mentioned relative inclination is an inclination about a
specified axial line that is substantially perpendicular to a straight line passing
through the vicinity of the center of the above-mentioned working surface and the
vicinity of the center of the above-mentioned dressing surface.
26. A working apparatus which comprises a working tool that has a working surface, and
a holding part that holds the workpiece, and which works the above-mentioned workpiece
by applying a load between the above-mentioned working surface of the above-mentioned
working tool and the above-mentioned workpiece and causing the relative motion of
the above-mentioned working tool and the above-mentioned workpiece, this working apparatus
being characterized by the fact that the above-mentioned working surface is dressed by the dressing method
according to Claim 11.
27. A working apparatus which comprises a working tool that has a working surface, and
a holding part that holds the object of polishing, and which works the above-mentioned
workpiece by applying a load between the above-mentioned working surface of the above-mentioned
working tool and the above-mentioned object of polishing and causing the relative
motion of the above-mentioned polishing tool and the above-mentioned object of polishing
, this working apparatus being characterized by the fact that the above-mentioned working surface is dressed by the dressing apparatus
according to Claim 16.
28. A working apparatus which comprises a working tool that has a working surface, and
a holding part that holds the object of polishing , and which works the above-mentioned
workpiece by applying a load between the above-mentioned working surface of the above-mentioned
working tool and the above-mentioned object of polishing and causing the relative
motion of the above-mentioned polishing tool and the above-mentioned object of polishing
, this working apparatus being characterized by the fact that the above-mentioned working surface is dressed by the dressing apparatus
according to Claim 20.
29. A working apparatus which comprises a working tool that has a working surface, and
a holding part that holds the workpiece, and which works the above-mentioned workpiece
by applying a load between the above-mentioned working surface of the above-mentioned
working tool and the above-mentioned workpiece and causing the relative motion of
the above-mentioned working tool and the above-mentioned workpiece, this working apparatus
being characterized by the fact that the apparatus comprises the dressing apparatus according to Claim 16.
30. A working apparatus which comprises a working tool that has a working surface, and
a holding part that holds the workpiece, and which works the above-mentioned workpiece
by applying a load between the above-mentioned working surface of the above-mentioned
working tool and the above-mentioned workpiece and causing the relative motion of
the above-mentioned working tool and the above-mentioned workpiece, this working apparatus
being characterized by the fact that the apparatus comprises the dressing apparatus according to Claim 20.
31. A semiconductor device manufacturing method which is characterized by the fact that this method has a process in which the surface of a semiconductor wafer
is flattened using the working apparatus according to Claim 5.
32. A semiconductor device manufacturing method which is characterized by the fact that this method has a process in which the surface of a semiconductor wafer
is flattened using the working apparatus according to Claim 6.
33. A semiconductor device manufacturing method which is characterized by the fact that this method has a process in which the surface of a semiconductor wafer
is flattened using the working apparatus according to Claim 26.
34. A semiconductor device manufacturing method which is characterized by the fact that this method has a process in which the surface of a semiconductor wafer
is flattened using the working apparatus according to Claim 27.
35. A semiconductor device manufacturing method which is characterized by the fact that this method has a process in which the surface of a semiconductor wafer
is flattened using the working apparatus according to Claim 28.
36. A semiconductor device manufacturing method which is characterized by the fact that this method has a process in which the surface of a semiconductor wafer
is flattened using the working apparatus according to Claim 29.
37. A semiconductor device manufacturing method which is characterized by the fact that this method has a process in which the surface of a semiconductor wafer
is flattened using the working apparatus according to Claim 30.