Field of Invention
[0001] The present invention relates to a cooling system for a semiconductor die carrier.
Description of Related Art
[0002] Conventional cooling systems for a semiconductor die carrier suffer from several
disadvantages. While conventional cooling systems do provide some measure of cooling
for semiconductor die carriers, they do not provide optimum cooling capability for
the semiconductor die housed in the carrier and optimum performance cannot be achieved.
Conventional cooling systems for a semiconductor die carriers rely on a fan mounted
adjacent to the die carrier. This close spatial relationship and limitation on airflow
passage size reduces the cooling system's ability to effectively remove the heat generated
by the die. Furthermore, conventional cooling systems for a semiconductor die carriers
rely on the use of warm air from within a computer enclosure to cool the semiconductor
die package. Often, the air within the enclosure is substantially warmer than the
ambient air outside the computer enclosure. The performance of a semiconductor becomes
degraded as the temperature of the die carrier increases. Thus, the above-referenced
disadvantages directly effect the performance of the semiconductor die.
[0003] US-A-4674004 discloses a cooling system comprising a cooling fan 16, a cooling duct
with inlet and outlet aperture 40 and an heat exchanger 42 (see Fig. 4) mounted on
a carrier (PCB) 24, whereby the apertures are disposed upstream and adjacent to the
face of the heat exchanger and the heat exchanger comprises fins. Cooling air exiting
the aperture impinges onto the face of the hea exchanger in a direction perpendicular
thereto an is then carried in opposite directions across the heat exchanger.
[0004] US-A-4715438 shows a heat exchanger 1 which comprises radially oriented on a spreader
plate 2 first fins 5f3 (see Fig. 1) of a first length interspersed between second
fins 5f1 of a second length. Fig. 2A shows that incomming air strikes the spreader
plate 2 in a direction perpendicular thereto and is then dispersed outwardly passing
between the fins in a direction parallel thereto.
[0005] Accordingly, there is a need for a cooling system for a semiconductor die carrier
with imptoved heat dissipation characteristics.
SUMMARY OF THE INVENTION
[0006] Accordingly, the present invention is directed to a cooling system for a semiconductor
die carrier as defined in claim 1.
[0007] The cooling system preferably relies upon cool ambient air from the exterior of a
computer enclosure to cool the semiconductor die.
[0008] The cooling system further preferably directs the cool ambient air from the exterior
of a computer into a heat exchange relationship with the semiconductor die carrier.
[0009] Additional features and advantages of the invention will be set forth in the description
which follows, and in part will be apparent from the description, or may be learned
by practice of the invention. The objectives and other advantages of the invention
will be realized and attained by the structure particularly pointed out in the written
description and claims hereof as well as the appended drawings.
[0010] It is to be understood that both the general description above, and the following
detailed description are exemplary and explanatory and are intended to provide further
explanation of the invention as claimed.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] The accompanying drawings which are included to provide a further understanding of
the invention and constitute a part of this specification, illustrate embodiments
of the invention and together with the written description, serve to explain the principles
of the invention. In the drawings:
Fig. 1 is an isometric view of a preferred embodiment of a heat exchanger in accordance
with the present invention;
Fig. 2 is an isometric view of an alternate embodiment of a heat exchanger in accordance
with the present invention;
Fig. 3 is a perspective view of a cooling system for a semiconductor die carrier in
accordance with the present invention; and
Fig. 4 is an isometric view of a cooling system for a semiconductor die carrier in
accordance with the present invention mounted within a computer enclosure.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0012] Reference will now be made in detail to the preferred embodiments of the present
invention, examples of which are illustrated in the accompanying drawings.
[0013] In accordance with the objects of the present invention, the cooling system for a
semiconductor die carrier includes a cooling fan disposed at a substantial distance
from a semiconductor die carrier, a cooling duct including an inlet portion and an
outlet portion, the cooling duct inlet portion attached to the cooling fan, an a heat
exchanger disposed on an upper surface of the semiconductor die carrier, wherein the
cooling duct outlet portion is disposed in close proximity to the heat exchanger such
that the cooling fan draws ambient air into the cooling duct and the ambient air exits
the cooling duct outlet portion and passes in a heat exchange relationship with the
heat exchanger.
[0014] Fig. 1 shows an isometric view of a preferred embodiment of a heat exchanger
50 in accordance with the present invention. A heat exchanger according to the present
invention includes a contact portion and heat dissipating extensions, wherein the
contact portion is adapted to contact an upper surface of a semiconductor die carrier.
For example, heat exchanger
50 includes contact portion
52 and first and second groups of fins
54 and
58 respectively. Contact portion
52 is adapted to be mounted to the top surface of a semiconductor die carrier.
[0015] A heat exchanger according to the present invention further includes a first and
a second group of fins, the first group of fins oriented perpendicularly with respect
to the second group of fins. For example, first group of fins
54 are mounted vertically, while second group of fins
58 are mounted horizontally. Furthermore, first group of fins
54 are separated from one another by an air gap so that cooling air may flow freely
(along direction
A) between the fins. Second group of fins
58 are similarly separated from one another by an air gap so that cooling air may flow
freely (along direction
A) between the fins.
[0016] In accordance with the present invention, each of the first group of fins includes
first and second ends, the first ends of the first group of fins being disposed in
a curvilinear array. For example, as is illustrated in Fig. 5, first group of fins
54 include first ends
56 and second ends
57. The first ends
56 are arranged in a curvilinear array, while the second ends
57 are also arranged in a curvilinear array. This arrangement facilitates a preferred
cooling air flow pattern across heat exchanger
50. Heat exchanger
50 may be constructed of any appropriate heat conductive material. For example, heat
exchanger
50 may be constructed of a metal. Preferably, heat exchanger
50 may be constructed of copper or aluminum.
[0017] Fig. 2 shows an isometric view of an alternate embodiment of a heat exchanger
60 in accordance with the present invention. Heat exchanger
60 includes contact portion
61 and first and second groups of fins
62 and
66 respectively. First group of fins
62 are mounted vertically, while second group of fins
66 are mounted horizontally. Furthermore, first group of fins
62 are separated from one another by an air gap so that cooling air may flow freely
(along direction
A) between the fins. Second group of fins
66 are similarly separated from one another by an air gap so that cooling air may flow
freely (along direction
A) between the fins.
[0018] In accordance with the present invention, the first group of fins include fins of
a first length interspersed between fins of a second length, the first length being
shorter than the second length. For example, as shown in Fig. 6, first group of fins
62 includes long fins
65 with short fins
64 interspersed therebetween.
[0019] Fig. 3 is a perspective view of a cooling system for a semiconductor die carrier
in accordance with the present invention. Fig. 3 shows computer enclosure
700 which includes panels
702, 704, and
706. Printed circuit boards (PCBs)
708 and
710 are mounted within computer enclosure
700. Semiconductor die carriers
720 and
730 are mounted to PCB
710.
[0020] A cooling system for a semiconductor die carrier according to the present invention
includes a cooling fan disposed at a substantial distance from a semiconductor die
carrier, a cooling duct including an inlet portion and an outlet portion, the cooling
duct inlet portion attached to the cooling fan, and a heat exchanger disposed on an
upper surface of the semiconductor die carrier, wherein the cooling duct outlet portion
is disposed in close proximity to the heat exchanger such that the cooling fan draws
ambient air into the cooling duct and the ambient air exits the cooling duct outlet
portion and passes in a heat exchange relationship with the heat exchanger. For example,
as shown in Figs. 3 and 4, semiconductor die carrier cooling assembly
740 includes cooling fan
742, cooling duct
744, and heat exchanger
746. Preferably the cooling fan
742 of the present invention is mounted directly to an outer surface of a computer enclosure
(outer surface not shown in Figs. 7 and 8 for clarity). However, the cooling fan may
be located in numerous other positions/locations without departing from the scope
or spirit of the invention in its broader aspects. Cooling duct
744 includes inlet portion
752 and outlet portion
754. Note that cooling duct inlet portion
752 has a greater cross sectional area than cooling duct outlet portion
754. Thus, optimal airflow characteristics are achieved in the cooling duct
744.
[0021] In operation, cooling fan
742 draws in ambient air through inlet
750. Cooling air then passes through inlet portion
752 of cooling duct
744 before exiting cooling duct
744 via outlet portion
754. Cooling air flows in direction
A across the heat exchanger
746 and in between the fins of heat exchanger
746. Preferably, ambient air ( the phrase "ambient air" generally refers to cooling air
which does not originate from within the computer enclosure) flows in a direction
which is parallel to the upper surface of the semiconductor die carrier
730. Thus preferably, the axis of fan rotation is also parallel to the upper surface
of the semiconductor die carrier
730. However, other appropriate spatial arrangements of the components may be made without
departing from the scope or spirit of the invention in its broader aspects. Note that
cooling fan
742 is disposed at a substantial distance from semiconductor die carrier
730, for optimal cooling air flow characteristics. A cooling system in accordance with
the present invention allows the semiconductor die carrier to be cooled with cooler
air (for example 25°C) from outside the computer enclosure rather than conventional
systems in which the semiconductor die carrier is cooled with warmer air (for example
45° C) from within the computer enclosure.
[0022] It will be apparent to those skilled in the art that various modifications and variations
can be made in the cooling system for a semiconductor die carrier of the present invention
without departing from the scope of the invention. Thus, it is intended that the present
invention cover the modifications and variations of this invention provided they come
within the scope of the appended claims and their equivalents.
1. A cooling system for a semiconductor die carrier (730) comprising:
a cooling fan (742) disposed at a substantial distance from a semiconductor die carrier
(730);
a cooling duct (744) comprising an inlet portion (752) and an outlet portion (754),
said inlet portion (752) having a first cross sectional area, said outlet portion
(754) having a second cross-sectional area, said first cross-sectional area being
greater than said second cross-sectional area, said cooling duct inlet portion (752)
attached to said cooling fan; and
a heat exchanger (50; 60; 746) disposed on an upper surface of the semiconductor die
carrier (730), wherein said heat exchanger (50; 60; 746) comprises a plurality of
fins (54; 58; 62; 66) that comprise a first group of fins (54; 62) aligned in a first
direction (A) parallel to one another and to said upper surface of the semiconductor
die carrier (730), characterized in that said cooling duct outlet portion (754) is disposed adjacent to an edge of said heat
exchanger (50; 60; 746) such that ambient air drawn by said cooling fan (742) into
said cooling duct (744) exits said cooling duct outlet portion (754) in said first
direction (A) and passes along said heat exchanger (50; 60; 746) in said first direction
(A) freely between said fins of said first group (54; 62).
2. The cooling system of claim 1, whereby said plurality of fins (54; 58; 62; 66) also
comprises a second group of parallel fins (58; 66) aligned along said first direction
(A), said second group of fins (58; 66) being disposed perpendicularly to said first
group of fins (54; 62).
3. The cooling system of claim 1, wherein said cooling fan (742) comprises an axis of
fan rotation, said axis of fan rotation being oriented parallel to said upper surface
of the semiconductor die carrier (730).
4. The cooling system of claim 1, wherein said cooling fan (742) is attached to an outer
surface of a computer enclosure.
5. The cooling system of claim 1, wherein said first and second cross sectional areas
are rectangular in shape.
6. The cooling system of claim 1, wherein said heat exchanger (50; 60; 746) further comprises
a contact portion, said contact portion adapted to contact said upper surface of the
semiconductor die carrier (730).
7. The cooling system of claim 1, wherein each of said first group of fins comprises
first (56) and second ends (57), the first ends (56) of said first group of fins being
disposed in a curvilinear array.
8. The cooling system of claim 7, wherein second ends (57) of said first group of fins
are disposed in a curvilinear array.
9. The cooling system of claim 1, wherein said first group of fins (54; 62) comprises
fins (54; 64) of a first length interspersed between fins (54; 65) of a second length,
said first length being shorter than said second length.
10. The cooling system of claim 1, wherein said heat exchanger is formed from a metal.
11. The cooling system of claim 10, wherein said heat exchanger (50; 60; 746) is formed
from an alloy.
12. The cooling system of claim 10, wherein said heat exchanger (50; 60; 746) is formed
from aluminum.
13. The cooling system of claim 10, wherein said heat exchanger (50; 60; 746) is formed
from copper.
1. Kühlsystem für einen Halbleiterchipträger (730), umfassend:
ein Kühlgebläse (742), welches in einem erheblichen Abstand von einem Halbleiterchipträger
(730) angeordnet ist;
einen Kühlkanal (744), welcher einen Einlassabschnitt (752) und einen Auslassabschnitt
(754) umfasst, wobei der Einlassabschnitt (752) eine erste Querschnittsfläche aufweist,
der Auslassabschnitt (754) eine zweite Querschnittsfläche aufweist, die erste Querschnittsfläche
größer als die zweite Querschnittsfläche ist und der Kühlkanaleinlassabschnitt (752)
am Kühlgebläse befestigt ist; und
einen Wärmeaustauscher (50; 60; 746), welcher auf einer oberen Fläche des Halbleiterchipträgers
(730) angeordnet ist, wobei der Wärmeaustauscher (50; 60; 746) eine Mehrzahl von Kühlrippen
(54; 58; 62; 66) umfasst, welche eine erste Gruppe von Kühlrippen (54; 62) umfassen,
die in einer ersten Richtung (A) parallel zueinander und zu der oberen Fläche des
Halbleiterchipträgers (730) ausgerichtet sind, dadurch gekennzeichnet, dass die erste Gruppe von Kühlrippen (54; 62) Kühlrippen (54; 64) von einer ersten Länge
umfasst, welche zwischen Kühlrippen (54; 65) von einer zweiten Länge eingefügt sind,
wobei die erste Länge kürzer als die zweite Länge ist, der Kühlkanalauslassabschnitt
(754) benachbart zu einer Kante des Wärmeaustauschers (50; 60; 746) angeordnet ist,
so dass Umgebungsluft, welche durch das Kühlgebläse (742) in den Kühlkanal (744) gesaugt
wird, den Kühlkanalauslassabschnitt (754) in der ersten Richtung (A) verlässt und
entlang des Wärmeaustauschers (50; 60; 746) in der ersten Richtung (A) frei zwischen
den Kühlrippen der ersten Gruppe (54; 62) strömt.
2. Kühlsystem nach Anspruch 1, wobei die Mehrzahl von Kühlrippen (54; 58; 62; 66) auch
eine zweite Gruppe von parallelen Kühlrippen (58; 66) umfasst, welche entlang der
ersten Richtung (A) ausgerichtet sind, wobei die zweite Gruppe von Kühlrippen (58;
66) senkrecht zur ersten Gruppe von Kühlrippen (54; 62) angeordnet ist.
3. Kühlsystem nach Anspruch 1, wobei das Kühlgebläse (742) eine Gebläsedrehachse umfasst
und die Gebläsedrehachse parallel zu der oberen Fläche des Halbleiterchipträgers (730)
ausgerichtet ist.
4. Kühlsystem nach Anspruch 1, wobei das Kühlgebläse (742) an einer Außenfläche eines
Rechnergehäuses befestigt ist.
5. Kühlsystem nach Anspruch 1, wobei die erste und die zweite Querschnittsfläche eine
rechteckige Form aufweisen.
6. Kühlsystem nach Anspruch 1, wobei der Wärmeaustauscher (50; 60; 746) ferner einen
Kontaktabschnitt umfasst und der Kontaktabschnitt so ausgelegt ist, dass er die obere
Fläche des Halbeiterchipträgers (730) kontaktiert.
7. Kühlsystem nach Anspruch 1, wobei jede der ersten Gruppe von Kühlrippen (54; 62) erste
(56) und zweite Enden (57) umfasst und die ersten Enden (56) der ersten Gruppe von
Kühlrippen in einem krummlinigen Feld angeordnet sind.
8. Kühlsystem nach Anspruch 7, wobei die zweiten Enden (57) der ersten Gruppe von Kühlrippen
in einem krummlinigen Feld angeordnet sind.
9. Kühlsystem nach Anspruch 1, wobei die erste Gruppe von Kühlrippen in Bezug auf die
zweite Gruppe von Kühlrippen senkrecht ausgerichtet ist.
10. Kühlsystem nach Anspruch 1, wobei der Wärmeaustauscher aus einem Metall gebildet ist.
11. Kühlsystem nach Anspruch 10, wobei der Wärmeaustauscher (50; 60; 746) aus einer Legierung
gebildet ist.
12. Kühlsystem nach Anspruch 10, wobei der Wärmeaustauscher (50; 60; 746) aus Aluminium
gebildet ist.
13. Kühlsystem nach Anspruch 10, wobei der Wärmeaustauscher (50; 60; 746) aus Kupfer gebildet
ist.
1. Système de refroidissement pour porteur de puces de semi-conducteur (730), comprenant:
un ventilateur de refroidissement (742) disposé à une distance substantielle d'un
porteur de puces de semi-conducteur (730);
un conduit de refroidissement (744) comprenant une portion d'arrivée (752) et une
portion de sortie (754), ladite portion d'arrivée (752) ayant une première aire de
section transversale, ladite portion de sortie (754) ayant une seconde aire de section
transversale, la dite première aire de première section transversale étant plus grande
que ladite seconde aire de section transversale, ladite portion d'arrivée de conduit
de refroidissement (752) étant rattachée au dit ventilateur de refroidissement ; et
un échangeur de chaleur (50 ; 60 ; 746) disposé sur une surface supérieure du porteur
de puces de semi-conducteur (730), ledit échangeur de chaleur (50 ; 60 ; 746) comprenant
une pluralité d'ailettes (54 ; 58 ; 52 ; 66) qui comporte un premier groupe d'ailettes
(54 ; 52) alignées dans une première direction (A), parallèles les unes aux autres
et à ladite surface supérieure du porteur de puces de semi-conducteur (730),
caractérisé en ce que
ladite portion de sortie du conduit de refroidissement (754) est disposée adjacente
à un coin du dit échangeur de chaleur (50 ; 60 ; 746) de manière à ce que l'air ambiant
attiré par ledit ventilateur de refroidissement (742) dans ledit conduit de refroidissement
(744) sorte de ladite portion de sortie de conduit de refroidissement (754) dans ladite
première direction (A) et passe librement le long du dit échangeur de chaleur (50
; 60 ; 746) dans ladite première direction (A) entre lesdites ailettes du dit premier
groupe (54 ; 62).
2. Système de refroidissement selon la revendication 1, dans lequel ladite pluralité
d'ailettes (54 ; 58 ; 62 ; 66) comprend aussi un second groupe d'ailettes parallèles
(58 ; 66), alignées le long de ladite première direction (A), ledit second groupe
d'ailettes (58 ; 66) étant disposé perpendiculairement au dit premier groupe d'ailettes
(54 ; 62).
3. Système de refroidissement selon la revendication 1, dans lequel ledit ventilateur
de refroidissement (742) comprend un axe de rotation de ventilateur, ledit axe de
rotation de ventilateur étant orienté parallèlement à ladite surface supérieure du
porteur de puces de semi-conducteur (730).
4. Système de refroidissement selon la revendication 1, dans lequel ledit ventilateur
de refroidissement (742) est rattaché à une surface externe d'une enceinte informatique.
5. Système de refroidissement selon la revendication 1, dans lequel lesdites première
et seconde aires de section transversale sont de forme rectangulaire.
6. Système de refroidissement selon la revendication 1, dans lequel ledit échangeur de
chaleur (50 ; 60 ; 746) comprend de plus une portion de contact, ladite portion de
contact étant adaptée pour être en contact avec ladite surface supérieure du dit porteur
de puces de semi-conducteur (730).
7. Système de refroidissement selon la revendication 1, dans lequel chacune du dit premier
groupe d'ailettes comprend des premières (56) et secondes (57) extrémités, les premières
extrémités (56) du dit premier groupe d'ailettes étant disposées dans un réseau curvilinéaire.
8. Système de refroidissement selon la revendication 7, dans lequel les secondes extrémités
(57) du dit premier groupe d'ailettes sont disposées dans un réseau curvilinéaire.
9. Système de refroidissement selon la revendication 1, dans lequel ledit premier groupe
d'ailettes (54 ;52) comprend des ailettes (54 ;64) d'une première longueur intercalées
entre des ailettes (54 ; 65) d'une seconde longueur, ladite première longueur étant
plus courte que ladite seconde longueur.
10. Système de refroidissement selon la revendication 1, dans lequel ledit échangeur de
chaleur est composé de métal.
11. Système de refroidissement selon la revendication 10, dans lequel ledit échangeur
de chaleur (50 ; 60 ; 746) est composé d'un alliage.
12. Système de refroidissement selon la revendication 10, dans lequel ledit échangeur
de chaleur (50 ; 60 ; 746) est composé d'aluminium.
13. Système de refroidissement selon la revendication 10, dans lequel ledit échangeur
de chaleur (50 ; 60 ; 746) est composé de cuivre.