Background of the Invention
[0001] 1.
Field of the Invention: The present invention relates to connectors and specifically to high speed, shielded
connectors having one or more integrated PCB assemblies.
[0002] 2.
Brief Description of Prior Developments: Right angle connectors are now widely used and available in many different configurations.
For right angle connector structures, the usual method of manufacture comprises stitching
terminals into a suitable housing followed by row-by-row tail bending of the terminal
tails. However, the method of bending the tails of each of the terminals is complex,
especially since the bending is different for each row. The bending for each row must
be done in such a way that each of the board contact terminals extends substantially
the same distance from the connector body. Moreover, each of said board contact terminals,
in the assembled state of the connector, must be precisely positioned in such a way
that the pattern of board contact terminals corresponds closely to the pattern of
holes in the PCB into which they will be inserted. An additional difficulty is related
to the EMI shielding of the tails for high-frequency applications. In particular for
the latter difficulty, a controlled-impedance tail section is preferred with additional
ground shielding options. Towards this end, it is known to subdivide the manufacture
of such a connector into one part for accommodating contact terminals for mating contact
with the contact terminal of a mating connector and a separate part for the tail end.
Separate shielding casings, if required in a right angled configuration, may be provided
around each of the terminals within the connector. Although connectors manufactured
in this way operate satisfactorily, the manufacturing costs are high.
[0003] An approach for the manufacturing of a similar component is disclosed in Document
GB-A-2 083 289 which relates to an interconnection device particularly designed as
a socket for light emitting diode. Such a socket comprises an insulating substrate
having a first surface and circuit traces disposed on the first surface and extending
from a first area of the substrate to a second area of the substrate, the circuit
trace includes at least a first location for mounting an electrical terminal on the
substrate, a first electrical terminal having a mounting section for mounting the
terminal at the first location on the circuit trace and a contact section for mounting
the connector onto the surface of a board, the electrical terminal being in electrical
connection with the circuit trace, the said mounting section being the force application
structure receiving during the assembly the force applied to the terminal.
[0004] U.S. Patent No. 4,571,014 shows a different approach for the manufacturing of right
angle connectors using one or more PCB assemblies. Each of the PCB assemblies comprises
one insulated substrate, one spacer, and one cover plate, all of which are attached
to one another. The insulating substrate is provided with a predetermined pattern
of conducting tracks, while ground tracks are provided between the conducting tacks.
The conducting tracks are connected at one end to a female contact terminal and at
the other end to a male contact terminal. Each of the cover plates is a conductive
shield member.
[0005] In the arrangement according to U.S. Patent No. 4,571,014, the insulating substrates
are rather thick to allow plated blind holes to be made for the construction of female-type
contacts for mating contact with male-type pins of a mating connector or the like.
The female contacts are connected to conducting tracks on the surface of the insulating
substrate through a thin metal tail extending from the plated blind hole through the
material of the insulating substrate to the corresponding track. However, in practice
it is very difficult to produce such construction with thin metal tails in a cost-effective
and reliable way. Moreover, it is practically very difficult to produce deep plated
blind holes having a plating of a uniform thickness. Because of the application of
plated blind holes within the insulating substrates each of the printed circuit boards
has to have a predetermined thickness which reduces the possibilities of miniaturization.
[0006] Another disadvantage of the connector known from this U.S. Patent No. 4,571,014 is
that the shield members, the insulating substrates and the spacers have to be aligned
with small holes and are fixed to one another by conducting rivets or pins through
the aligned holes; the holes in the insulating substrates are plated through-holes,
thus establishing an electrical contact between each of the ground tracks between
the conducting tracks and the shield members in the assembled state. However, in practice
this is not a very reliable way of assuring electrical contact between the shield
members and the ground tracks on the insulating substrates.
Summary of the Invention
[0007] The object of the present invention is to provide a connector which overcomes the
disadvantages described above.
[0008] This object is obtained by the present invention by providing a connector according
to claim 1.
[0009] In order to provide shielding between adjacent conducting tracks on the PCB, ground
tracks may be provided between the conducting tracks on a first surface and a ground
layer may be provided on a second surface opposite the first surface.
[0010] The cover plates are made of insulating material and may be provided with cover plate
conducting tracks and cover plate ground tracks in a predetermined pattern on a first
cover plate surface facing the insulating substrate. The cover plate conducting tracks
may have one end for connection to one first contact terminal and another end for
connection to one second contact terminal. The cover plates may have the second cover
plate surface opposite said first cover plate surface covered by a cover plate ground
layer. Thus, each of the first contact terminals may be connected to one second contact
terminal through one conducting track on the insulating substrate and through a conducting
track on the cover plate. Thereby, the electrical resistance between a first contact
terminal and a respective second contact terminal is reduced. The pattern of conducting
tracks on the insulating substrate and the pattern of conducting tracks on the cover
plate may be in mirror relation to each other.
[0011] The ground tracks on the insulating substrate and the cover plate ground tracks on
the cover plate, respectively, can be connected to the ground layer on the second
surface of the insulating substrate and to the cover plate ground layer, respectively,
through plated through-holes. This can be easily achieved, by starting the production
of a connector according to the invention with an insulating substrate having metal
layers at both sides. One side of the substrate is, then, patterned to be provided
with suitable conducting tracks and ground tracks in a predetermined pattern, in accordance
with known PCB manufacturing techniques. The ground tracks may then be electrically
connected to the metal layer at the opposite side by plated through-holes, which can
be made by well known manufacturing techniques.
[0012] The recesses in the spacer or cover plate can be designed for entirely accommodating
one first contact terminal in such a way that, in the assembled state, none of the
first contact terminals extends outside the connector. Such a configuration, used
in conjunction with a shielding ground layer, provides improved shielding as it is
possible to enclose each of the contact terminals to a greater extent.
[0013] The second contact terminals may comprise press-fit pins, surface mount terminals
and solder contact pins for connecting the connector to a printed circuit board or
the like.
[0014] The connector may also comprise an insulating connector body accommodating each of
said one or more integrated PCB assemblies and provided with a metallized shielding
layer on its outer surface. Thereby, the electromagnetic interference caused by such
a connector to the environment is further reduced. The connector body desirably includes
structure for receiving and securing PCB modules in alignment.
[0015] A simplified configuration results when in the connector according to the invention
each spacer and its adjacent cover plate are substituted by another cover plate, provided
with suitable recesses for accommodating first contact terminals and/or second contact
terminals.
[0016] According to another feature of the invention, the PCB modules include planar insulating
substrates having conductive traces on which terminals are secured and insulating
covers disposed over the terminal carrying side of the substrate, the covers having
recesses for accommodating the terminals. The covers and associated recesses can comprise
a means of applying a force to the contact terminals, such as an insertion force necessary
to press fit the connector into a circuit board, in a manner that minimizes or eliminates
the imposition of stresses on the connection of the terminals to the circuit traces.
The terminals include structure, engaged by the cover, for imparting force to the
terminals.
[0017] The connector may be provided with suitable filter elements by arranging at least
one electrical component within the connector, for instance selected from the group
of components comprising resistors, capacitors and inductors.
[0018] The present invention will be further illustrated with reference to some drawings
which are meant for illustration purposes only and not intended to limit the scope
of the present invention.
[0019] In the drawings:
Figure 1 schematically shows a connector which does not fall within the scope of the
claims in order to illustrate the principles of the present invention;
Figures 2a-2c show a right angle connector ; which does not fall within the scope
of the claims in order to illustrate the principles of the present invention;
Figures 3a through 3c show a right angle connector according to a method which does
not fall within the scope of the claims in order to illustrate the principles of the
present invention;
Figure 4 is a side elevational view of a PCB assembly according to an embodiment of
the invention.
Figures 5, 6 and 7 are fragmentary views showing the mounting of terminals on the
PCB assembly shown in Figure 4.
Figures 8-8d show different views of an insulative cover to be used in conjunction
with the PCB assembly of Figure 4 to form a terminal row module.
Figures 9-9e illustrate an assembled terminal module formed of a PCB assembly as shown
in Figure 4 and a cover as shown in Figure 9.
Figures 10, 10a and 11 are enlarged views showing portions of the integrated terminal
module shown in Figure 9.
Figures 12-12c show views of a connector housing for receiving a plurality of modules
as illustrated in Figure 9.
Figures 13, 13a and 13b show various views of a lead-in plate for the housing shown
in Figure 12.
Figures 14-14c show views of a completed connector assembly.
[0020] It is to be understood that although the figures illustrate right angle connectors,
the principles of the present invention equally apply to other connector configurations.
[0021] Figure 1 shows an integrated PCB assembly 1 having an insulating body 13. The insulating
body 13 may comprise two or more layers as explained below and may be provided with
shielding ground layers 9 at either main outer surface. However, depending on the
application one of the shielding ground layers, or both, may be omitted.
[0022] The body 13 is provided with a first series of openings or recesses 2 in a first
side surface for accommodating suitable contact terminals 4. At a second side surface,
the body 13 is provided with similar openings or recesses 3 for accommodating suitable
board contact terminals 7. Each of said openings or recesses 2 and 3 includes a conductive
surface therein. The recess 2 and 3 may be entirely or partly metallized.
[0023] Each of the contact terminals 4 is shown to have a female type contact portion 14,
a tail connect portion 6 and a body connect portion 5. Each of the body connect portions
5 is designed to be received by one of the recesses 2 and to be electrically connected
to the metal layer within the hole 2, e.g. by soldering or a press-fit connection.
[0024] If desired, each of the female-type contact portions 14 may be substituted by male-type
contact portions or hermaphrodite-type contact portions, as is known to any person
skilled in the art.
[0025] Each of the board contact terminals 7 is shown to have a board contact portion 15
and a body connect portion 8. Each of the body connect portions 8 is to be received
by one recess 3 and to be connected e.g. by soldering or by a press-fit connection
thereto. Each of the board contact portions 15 is designed to be received by an appropriate
hole in a printed circuit board and to be connected thereto,. e.g. by soldering. However,
a press-fit connection, as shown, can also be provided instead. As a further alternative,
the board contact portion 15 may be designed to be suitable for surface mount or through
mount connection to a printed circuit board. It is observed that the phrase "printed
circuit board" is not used in a limiting sense, but is meant to include any kind of
substrate to which connectors and right angle connectors may be connected, as is known
by a person skilled in the art.
[0026] Each of the recesses 2 are electrically connected to a corresponding recesses 3 by
suitable conducting means within the body 13. These suitable conducting means may
be conductive traces 11 as will be explained below by reference to Figures 2a and
3a.
[0027] In order to provide a shielding effect between adjacent conducting means 11 within
the body 13, ground tracks 10 may be provided in-between. Instead of providing a ground
track 10 between each two adjacent conducting means 11 other configurations are possible.
Ground tracks 10 may, e.g., be present between adjacent groups of two conducting means
11 thus having a twinax-type configuration.
[0028] Figures 2a through 2c show subsequent manufacturing steps of producing a right angle
connector according to the invention in which standard methods of producing printed
circuit boards are used.
[0029] Figure 2a shows an insulating substrate 16, formed for example of conventional flat
PCB material provided with several parallel conducting tracks 11. Conducting ground
tracks 10 may be provided between adjacent conducting tracks 11. The outer most conducting
ground track 10 is provided with a ground contact terminal 7' to be connected to ground
through the printed circuit board to which the connector is to be connected. Methods
of producing an insulating substrate 16 with parallel conducting tracks 10, 11 are
widely known in the field of manufacturing printed circuit boards and need not be
explained here.
[0030] Each of the conducting tracks 11 is connected to board contact terminals 7, the board
contact portions 15 of which extending beyond the insulating substrate 16. Although
the board contact portions 15 are shown as press-fit terminals they might be replaced
by suitable solder tail terminals or surface mount terminals as mentioned above.
[0031] The other ends of the conducting tracks 11 are connected to suitable contact terminals
4 which, in the embodiment shown in Figures 2a through 2c, do not extend beyond the
insulating substrate 16.
[0032] Preferably, the body contact portions 5 and 8 of terminals 4 and 7, respectively
are fixed onto suitable solder pads formed at the ends of traces 11. This can be achieved
by conventional surface mount soldering techniques.
[0033] An insulating spacer 17 is provided having a first series of openings 24 for accommodating
the contact terminals 4 and a second series of openings 25 for accommodating at least
part of the board contact terminals 7. The recess 2 and 3 in the insulating body 13
are formed at the interface of adjacent layers or laminations. That is, the recesses
2, for example, are bounded by the insulating layer 16, the edges of openings 24 or
25 and the cover 18. This allows the contacts to be secured on layer 16 by conventional
surface mounting or other bonding techniques.
[0034] An insulating cover plate 18, optionally provided with a fully metallized ground
layer 9, is provided.
[0035] To reduce the electrical resistance between each of the contact terminals 4 and the
board contact terminals 7 each of the insulating cover plates 18 may be provided with
suitable conducting tracks 11 one end of which is electrically connected to a contact
terminal 4 and the other end of which is electrically connected to a board contact
terminal 7. These conducting tracks may be provided in a mirrored relation to the
conducting tracks 11 on the insulating substrate 16. Cover plate 18 may also be provided
with ground tracks 10 between those conducting tracks 11 (not shown). These ground
tracks 10 are preferably connected to the ground layer 9 by means of plated through-holes
26. The manufacturing of plated through-holes is known to persons skilled in the art
and need no further explanation. Of course, substrate 16 may be provided with similar
plated through-holes 26 in order to connect ground tracks 10 to ground layer 9 at
the outer surface of substrate 16.
[0036] Figure 2b shows one integrated PCB assembly manufactured from the components shown
in Figure 2a, i.e. an insulating substrate 16 to which an insulating spacer 17 is
attached and an insulating cover plate 18 attached to the insulating spacer 17. The
first series of openings 24 in the insulating spacer 17 form recesses 2, in which
the female-type contact terminals 4 are disposed to receive contact terminals of a
mating connector (not shown). It is to be understood that the female-type contact
terminals 4 shown in Figure 2a may be replaced by male-type or hermaphrodite-type
contact terminals.
[0037] Instead of providing both a spacer and a cover plate 18, only a cover plate could
be provided in which suitable recesses are made for accommodating the contact terminals
4 and the board contact terminals 7. Such recesses would serve the same purpose as
openings 24, 25 in spacer 17 shown in Figure 2a. Alternatively, but less desirably
from a cost standpoint, such recesses could be provided in substrate 16.
[0038] Figure 2c shows several integrated PCB assemblies as shown in Figure 2b parallel
to each other and to be inserted into a connector body 19. The connector body 19 may
be made of any insulating material and may be provided with a metallized outer surface
to enhance the shielding effectiveness. The connector body 19 may be provided with
suitable guiding ridges 23 and one or more guiding extensions 22 for properly connecting
the assembled connector to a mating connector (not shown).
[0039] As is conventional, a locating and securing post 21, receivable within a hole in
a printed circuit board to which the connector, is to be connected, is provided at
the bottom side of the connector body 19. Preferably, each of the integrated PCB assemblies
have at least one ground layer 9 on one of their main outer surfaces to shield the
parallel integrated PCB assemblies from each other. Both outer surfaces of each of
the outer integrated PCB assemblies in the configuration shown in figure 2c are preferably
provided with ground layers 9 to enhance the shielding effectiveness.
[0040] The connector body 19 is provided with suitable lead-in holes 20 in corresponding
relationship with each of the contact terminals 4. Each of the lead-in holes 20 is
suitable for receiving a mating male-type contact terminal of a mating connector (not
shown). The lead-in holes 20 are arranged in columns and rows as is designated by
arrows c and r.
[0041] The main difference between the embodiments of Figures 2a through 2c and Figures
3a through 3c is that the contact terminals 4 in the embodiments of Figures 3a through
3c extend beyond the outer dimensions of the integrated PCB assembly.
[0042] In Figure 3a several contact terminals 4 are shown adjoined on a carrier as one stamped
part. The additional joining metal between adjacent contact terminals 4 is stamped
away as a final step during manufacturing. The function of the carrier is to form
a one stitch process.
[0043] Also board contact terminals 7 are shown to be adjoined on a carrier as one stamped
part. The additional joining metal between adjacent board contact terminals is stamped
away as final step during manufacturing.
[0044] Also here, the cover plate 18 may be provided with a plurality of suitable conducting
tracks one side of which is to be connected electrically to one contact terminal 4
and the other side of which is to be connected to one board contact terminal 7 in
order to reduce the electrical resistance.
[0045] Either or both of the insulating substrates 16 or the insulating cover plates 18
may be provided with a suitable ground layer 9.
[0046] The insulating substrate, the insulating spacer and the insulating cover plate are
adhered to each other by widely known means like glue, conductive adhesives in track
areas and/or use of pressure in order to produce one integrated PCB assembly as shown
in Figure 3b.
[0047] Like in the embodiment according to Figures 2a-2c spacer 17 could be omitted whereas,
then, cover plate 18 could be provided with suitable recesses for accommodating those
parts of contact terminals 4 and board contact terminals 7 not extending from substrate
16. Alternatively but less desirably, such recesses could be provided in substrate
16.
[0048] Several parallel integrated PCB assemblies as shown in Figure 3b are introduced in
the rear side of a connector body 19 which is provided with suitable openings in the
rear side to accommodate the extending contact terminals 4 (Figure 3c). When shielding
between adjacent contact terminals 4 is required shielding means may be provided within
the connector body 19. However, when shielding between contact terminals is desired,
the embodiment according to Figures 2a through 2c may be preferred because it is easier
to provide for shielding between adjacent contact terminals 4.
[0049] It is to be understood that the present invention is not limited to the embodiments
shown in the figures. Especially, the invention is not limited to providing integrated
PCB assemblies having one insulating substrate 16, one spacer 17 and one cover plate
18. Other numbers of substrates, spacers and cover plates are possible and are considered
within the scope of the present invention. Moreover, the substrate 16, spacer 17 and
cover plate 18 may have any desired dimension. Since separate substrates, spacers,
cover plates, etc. may be used to manufacture connectors in accordance with the invention,
filter elements, like resistors, capacitors and inductors, can be easily incorporated
within the connector by using well known PCB manufacturing techniques. For example,
they may be manufactured by well known thin film techniques.
[0050] Any of the insulating substrates 16 may, e.g., be provided with suitable connecting
pins to be received by suitable holes in the insulating cover plates 18 to provide
easier alignment of parallel integrated PCB assemblies and to prevent shifting of
integrated PCB assemblies when inserting several parallel integrated PCB assemblies
into the rear side of the connector body 19.
[0051] The connector according to the invention can be manufactured by using standard and
inexpensive PCB manufacturing methods without the stamping/moulding/bending processes
which are now widely used and which are relatively expensive. Moreover, impedance
matching can be easily obtained since the manufacturing tolerances can be easily controlled.
The connector according to the present invention can also be designed for miniature
coaxial or twinax applications.
[0052] Although in the description presented above, the connector according to the invention
is provided with a set of contact terminals 4 at one side and a set of board contact
terminals 7 at another side it is to be understood that the principles of the invention
also apply to connectors in which the board contact terminals 7 are substituted by
contact terminals suitable for connection to a mating connector or the like. Moreover,
the set of contact terminals 4 may be constructed as board contact terminals to be
suited for connection to a printed circuit board or the like.
[0053] Figures 4-14c illustrate a second embodiment of an integral terminal PCB module.
This embodiment eliminates the separate spacer element 17 of the previous embodiment
and incorporates certain of its functions into a single cover/ spacer member. The
cover and an associated PCB terminal assembly form a terminal module, several of which
can be held together in side-by-side relationship in a housing to form an electrical
connector.
[0054] Referring to Figure 4, the PCB assembly 30 comprises an insulating substrate 31 of
a material commonly commercially used for making PCBs. The substrate 31 can be a resin
impregnated fiber assembly such as is sold under the designation FR4, having a thickness
0.4 mm, for example. On a first surface of the substrate 31, a plurality of circuit
traces 32 are formed by conventional PCB techniques. Each trace 32 extends from a
first portion of the substrate 31, for example adjacent the front edge as shown in
Figure 4, to a second area or region of the substrate 31, such as the bottom edge
as shown in Figure 4. The traces 32 include contact pads at each end adapted to have
metal terminals secured to them, as by conventional surface mounting techniques using
solder. A plurality of ground or shielding traces 33 may also be applied to the substrate
31. The shielding traces 33 may be disposed between each of the circuit traces 32
or between groups of such traces. A terminal, such as a contact terminal 34 is mounted
at the first end of each trace 32 and a connector mounting side terminal 35 is mounted
on the second end of each circuit trace 32. An additional shielding or ground layer
36 may be applied to the remainder of the substrate 31. A ground terminal 37 is fixed
onto the ground layer 36, in alignment with the terminals 35.
[0055] A locating hole 39 may be appropriately placed in the substrate 31. The locating
hole 39 preferably comprises a plated through hole for establishing electrical connection
with a grounding layer 38 (Figure 5) that may extend substantially over the entire
back surface of the substrate 31. As previously described, small vias forming plated
through-holes may be disposed in each of the ground tracks 33 so that the ground tracks
33, the shield layer 36 and the back shield layer 38 form a shielding structure for
the signal traces 33 and associated terminals.
[0056] As shown in the fragmentary views of Figures 5 and 6, contact terminals 34 are formed
as a one-piece stamping and can comprise a dual beam contact having a base section
40 having an opposed pair of upstanding portions 41. A spring section 42 is cantilevered
from each of the upstanding portions 41 to define an insertion axis for a mating terminal,
such as a pin from a pin header. Such a pin would be engaged by the contact portions
43 disposed at the end of each cantilevered arm 42. The contact terminals also include
a mounting section, such as the planar member 44, that is adapted to be secured onto
the end of the circuit trace 32, typically by solder 46. The latter can be accomplished
by conventional surface mounting or other bonding techniques. As can be realized by
the above description, the cantilevered arms 42 and contact portions 43 define a contact
mating or pin insertion axis that is generally parallel to the plane of substrate
31, but is offset from the surface carrying the conductive traces 32.
[0057] As illustrated in Figure 7, one preferred form of connector mounting terminal 35
includes a press-fit section 48 and a board mounting section 49. The board mounting
section 49 includes a generally planar base 50 with an upturned top tang 52 disposed
along a top edge. A pair of opposed side tangs 53 are also upturned from the base
50. The mounting portion 49 is retained on the circuit trace 32 by solder fillets
54, again formed by conventional surface mounting solder techniques. Preferably, the
top tang 52 is spaced closely adjacent to or rests on the top surfaces of the side
tangs 53 as shown in Figure 7.
[0058] Figures 8, 8a, 8b, 8c and 8d illustrate an insulative cover/spacer member 56, preferably
molded from an appropriate polymeric insulating material. The cover includes a plurality
of contact recesses 57 formed along one edge. Each of the recesses 38 includes a contact
preload rib 58. A large central recess 59 may also be formed in the cover. A second
plurality of terminal recesses 60 is formed along a second edge of the cover. Further,
a locating boss 62 is integrally formed with the cover and is sized and shaped to
be received, with limited clearance, in the locating opening 39 in the substrate 31.
The cover further includes an upper rim 63 extending from the rear of the cover to
a location near the recesses 57. A bottom rim or support member 64 is formed on a
portion of the bottom surface of the cover. The cover 56 further includes an upper
locating and mounting rib 65, preferably in the form of a dove tail rib as shown.
A similar but shorter mounting and locating rib 66 is disposed on the bottom edge
of the cover. The surfaces 67a and 67b form board rest surfaces against which a substrate
31 is placed. The surfaces 67a and 67b may carry an adhesive or alternately a double
adhesive coated film (not shown) may be applied to extend from surface 67a to surface
67b.
[0059] A terminal module 69 (Figure 9) is formed by associating a PCB terminal assembly
30 with a cover 56. Figure 9 is substantially an x-ray view through the cover 56 for
ease in showing the location of the elements on substrate 31, with respect to the
cover. The PCB assembly 30 is located in the vertical direction by the upper and lower
rim or mounting members 63, 64 and is located in a longitudinal manner by the locating
boss 62. The contact terminals 34 are located in the contact recesses 57 and the connector
mounting terminals 35 are located in the recesses 60. The previously mentioned adhesive
or adhesive coated films on surface 67a and 67b maintain the PCB assembly and cover
56 together.
[0060] Figure 9a is a sectional view taken along line AA of Figure 9 and shows the contact
terminals 34 located in the contact recesses 57. The terminals 34 are positioned so
that the contact portions 43 bear against the preload ribs 58 to impart a desired
preload on the cantilevered spring arms 42.
[0061] Figure 9b is a sectional view taken along line BB. As shown in Figure 9b, the substrate
31 is essentially located in a vertical position by the rims 63 and 64. The overall
thickness of the module 69 generally approximates the desired contact pitch of the
finished connector. For example, if a 2.0 mm contact pitch is desired, and assuming
a substrate thickness of 0.4 mm, the thickness of cover 56 would be approximately
1.6 mm. Thus, if the modules 69 are stacked in side by side relationship, the desired
pitch is achieved.
[0062] As illustrated in Figure 9c, each connector mounting 35 has its mounting portion
received within a corresponding recess 60. If the board mounting terminal is of a
type that is likely to have a relatively high axial force applied to it, such as a
press-fit terminal, the surface 68 (Figure 8d) of the recess 60 is advantageously
located so that it bears against the upturned tang 52 of the terminal. The views in
Figures 9c and Figure 11 are taken substantially along section line CC of Figure 9.
[0063] Figure 9d is a fragmentary cross sectional view taken along line DD of Figure 9 showing
a positioning of grounding terminal 37 in a similar fashion to terminal 35 in Figures
9c and Figure 11.
[0064] Figure 9e is a view of the back end of the module 69 showing in phantom views the
locating boss 62 and the mounting portion of a terminal 35.
[0065] Figures 10 and 10a illustrate enlarged views of the connector contacts 34 located
in recesses 57 of the cover 56. Figure 10a is a cross sectional view taken along line
GG of Figure 10 and shows the positioning of the preload rib 58 with respect to the
contact portions 43.
[0066] Figure 11 illustrates the interaction of the cover 56 with the board connection terminal
35 when a downward force F is applied to the top edge of the module 69. That force
is transmitted by the cover to the pressing surface 68 formed by the top surface of
the recess 60. As a result, a vertical insertion force that is used to push the press-fit
48 into the hole T is applied directly to the upper tang 52 and the side tangs 53.
In this manner, shear stress occuring at the solder connection between the base 50
of the terminal and the circuit trace 32 is minimized. In this manner, loosening or
detachment of the terminal 35 is avoided. This is achieved, at least in part, by positioning
the surface 68 so that it will engage tang 52 before the rim 63 beings applying a
vertical force to the upper edge of the substrate 31. One way to accomplish this is
to provide an initial, small clearance between the rim 63 and the adjacent edge of
substrate 31. Additionally, the cover is designed so that a significant proportion
of the insertion force is applied directly to terminal 35 so that stress at the terminal/conductive
track interface is minimized. The structure disclosed is designed to withstand required
press-fit pin insertion forces of 35-50 Newtons per pin.
[0067] Figure 12 is a cross sectional view taken along line HH of Figure 12a and shows a
connector housing 70 having a top wall 72, a bottom wall 76 and a front wall 78. The
top wall 72 includes a plurality of locating slots, for example the dove tail slots
73. One or more guiding ridges 74 may be formed on a top surface of the top 72. The
bottom 76 also includes a locating slot, for example the dove tail slots 77. The front
wall 78 includes a plurality of openings 79.
[0068] Figure 13a is a front elevational view of a lead-in face plate 80 having a plurality
of tapered lead-in sections 84 arranged in the form of a grid. Each of the lead-in
portions 84 extends to a pin insertion port 85. A plurality of sleeves or hollow bosses
86 extend from the rear surface of the face plate 80 and are shaped in size to be
positioned in the openings 79 in the front wall 78 of housing 70.
[0069] Figure 14 is a sectional view showing the assembly of contact module 69, housing
70 and face plate 80 to form a completed right angle connector. A plurality of pins
90 and 90a are shown being received in the mating contact terminals 34. The pins designated
as 90a in both Figures 14 and 14c are shown in a somewhat misaligned, as can occur
when pins are bent. As shown in Figure 14b, in order to form a finished connector,
a plurality of contact modules 69 are assembled in the housing 70 by aligning the
dove tail ribs 65 and 66 of each module with the dove tail slots 73 and 77 respectively
of the housing and pushing the modules in the direction of front wall 78. The mounting
contacts 33 and ground contact 37 are positioned to be inserted into the holes of
a circuit board on to which the connector is to be mounted. This would conventionally
be accomplished by applying a downward force, usually to the top of the housing 70
extending over the region of the board contacts 35.
[0070] Additional shielding can be provided by metallizing appropriate surfaces of the housing
70.
[0071] The foregoing constructions yield connectors with excellent high speed characteristics
at low manufacturing costs. Although the preferred embodiment is illustrated in the
context of a right angle press-fit connector, the invention is not so limited and
the techniques disclosed in this application can be utilized for many type of high
density connectors systems wherein signal contact are arranged in rows and columns.
1. A high speed electrical connector for mounting on a board comprising:
an insulating substrate (31) having a first surface and at least one circuit trace
(32) disposed on the first surface and extending from a first area of the substrate
(31) to a second area of the substrate, the circuit trace (32) including at least
a first location for mounting an electrical terminal on the substrate (31),
a first electrical terminal (35) having a mounting section (49) for mounting the terminal
(35) at the first location on the circuit trace (32) and a contact section (48) for
mounting the connector onto the surface of the board, the electrical terminal being
in electrical connection with the circuit trace (32),
said mounting section (49) extending away from the surface of the substrate being
a force application structure adapted to receive a force applied to the terminal,
characterized in that
said mounting section (49) comprises a generally planar base (50) parallel to the
plane of the substrate (31) with an upturned top tang (52) disposed along a top edge
and extending away from the surface of the planar base (50).
2. A high speed electrical connector according to claim 1,
characterized in that the planar base (50) of the mounting section (49) further comprises a pair of opposed
side tangs (53) upturned from the base (50) and extending away from the surface of
the planar base (50).
3. A high speed electrical connector according to claim 1,
characterized in that the mounting section (49) is retained on the circuit trace (32) by solder.
4. A high speed electrical connector according to claim 1,
characterized in that the terminal (35) is a press-fit terminal.
5. A high speed electrical connector according to claim 1,
characterized in that it further comprises an insulative cover (56) for covering the first surface of the
substrate (31), the cover (56) and the substrate (31) forming a module (69) so that
a significant proportion of the force is applied to terminal (35).
6. A high speed electrical connector according to claims 1 to 5,
characterized in that the cover (56) includes engaging means for engaging said force application structure
to apply said force thereto.
7. A high speed electrical connector according to claim 6,
characterized in that the engaging means comprises a pressing surface (68) adapted to bear against the
top tang (52).
8. A high speed electrical connector according to claim 6,
characterized in that the cover further comprises a recess (60) for receiving the terminal (35), the pressing
surface (68) being formed by the ground surface of said recess (60).
9. A high speed electrical connector according to claim 6,
characterized in that the cover further comprises an upper rim (63) applying a vertical force to the upper
edge of the substrate (31).
10. A high speed electrical connector according to claims 6 to 9,
characterized in that a small clearance is provided initially between the rim (63) and the upper edge of
the substrate (31) so that the pressing surface (68) will engage the top tang (52)
before the upper rim (63) applies said vertical force.
1. Elektrischer Hochgeschwindigkeitsverbinder zur Befestigung auf einer Platte, mit:
einem isolierenden Substrat (31) mit einer ersten Oberfläche und mindestens einer
Leiterbahn (32), die auf der ersten Oberfläche angeordnet ist und von einem ersten
Bereich des Substrats (31) zu einem zweiten Bereich des Substrats verläuft, wobei
die Leiterbahn (32) mindestens eine erste Stelle zur Befestigung eines elektrischen
Anschlusses auf dem Substrat (31) aufweist,
einem ersten elektrischen Anschluss (35), der einen Befestigungsabschnitt (49) zur
Befestigung des Anschlusses (35) an der ersten Stelle auf der Leiterbahn (32) und
einen Kontaktbereich (48) zur Befestigung des Verbinders auf der Oberfläche der Platte
aufweist, wobei der elektrische Anschluss mit der Leiterbahn (32) in elektrischer
Verbindung steht,
wobei der Befestigungsbereich (49), der sich von der Oberfläche des Substrats weg
erstreckt, eine Krafteinwirkungsstruktur ist, die angepasst ist, um eine auf den Anschluss
ausgeübte Kraft aufzunehmen,
dadurch gekennzeichnet, dass
der Befestigungsabschnitt (49) eine im wesentlichen ebene Basis (50) parallel zur
Ebene des Substrats (31) mit einem nach oben gebogenen, oberen Lappen (52) aufweist,
der entlang einer Oberkante angeordnet ist und sich von der Oberfläche der ebenen
Basis (50) weg erstreckt.
2. Elektrischer Hochgeschwindigkeitsverbinder nach Anspruch 1, dadurch gekennzeichnet, dass die ebene Basis (50) des Befestigungsabschnitts (49) weiter ein Paar von gegenüberliegenden
seitlichen Lappen (53) aufweist, die von der Basis (50) nach oben gebogen sind und
sich von der Oberfläche der ebenen Basis (50) weg erstrecken.
3. Elektrischer Hochgeschwindigkeitsverbinder nach Anspruch 1, dadurch gekennzeichnet, dass der Befestigungsabschnitt (49) auf der Leiterbahn (32) durch Lötverbindung gehalten
wird.
4. Elektrischer Hochgeschwindigkeitsverbinder nach Anspruch 1, dadurch gekennzeichnet, dass der Anschluss (35) ein Presspassungsanschluss ist.
5. Elektrischer Hochgeschwindigkeitsverbinder nach Anspruch 1, dadurch gekennzeichnet, dass er weiter eine isolierende Abdekkung (56) zum Abdecken der ersten Oberfläche des
Substrats (31) aufweist, wobei die Abdeckung (56) und das Substrat (31) einen Modul
(69) bilden, so dass ein beträchtlicher Anteil der Kraft auf den Anschluss (35) ausgeübt
wird.
6. Elektrischer Hochgeschwindigkeitsverbinder nach den Ansprüchen 1 bis 5, dadurch gekennzeichnet, dass die Abdeckung (56) Eingriffmittel aufweist, um mit der Krafteinwirkungsstruktur in
Eingriff zu gelangen, um die Kraft darauf anzuwenden.
7. Elektrischer Hochgeschwindigkeitsverbinder nach Anspruch 6, dadurch gekennzeichnet, dass das Eingriffmittel eine Druckfläche (68) aufweist, die angepasst ist, um gegen den
oberen Lappen (52) anzuliegen.
8. Elektrischer Hochgeschwindigkeitsverbinder nach Anspruch 6, dadurch gekennzeichnet, dass die Abdeckung weiter eine Vertiefung (60) zur Aufnahme des Anschlusses (35) aufweist,
wobei die Druckfläche (68) von der Bodenfläche der Vertiefung (60) gebildet wird.
9. Elektrischer Hochgeschwindigkeitsverbinder nach Anspruch 6, dadurch gekennzeichnet, dass die Abdeckung weiter einen oberen Rand (63) aufweist, der eine senkrechte Kraft auf
die Oberkante des Substrats (31) ausübt.
10. Elektrischer Hochgeschwindigkeitsverbinder nach den Ansprüchen 6 bis 9, dadurch gekennzeichnet, dass ein kleiner Spielraum ursprünglich zwischen dem Rand (63) und der Oberkante des Substrats
(31) vorgesehen ist, so dass die Druckfläche (68) in den oberen Lappen (52) eingreift,
ehe der obere Rand (63) die senkrechte Kraft anlegt.
1. Connecteur électrique haute vitesse pour le montage sur une carte comprenant :
un substrat isolant (31) ayant une première surface et au moins une piste de circuit
(32) disposée sur la première surface et s'étendant d'une première zone du substrat
(31) à une seconde zone du substrat, la piste du circuit (32) comprenant au moins
un premier endroit pour le montage d'un contact électrique sur le substrat (31), un
premier contact électrique (35) ayant une section de montage (49) pour le montage
du contact (35) au premier endroit sur la piste du circuit (32) et une section de
contact (48) pour le montage du connecteur sur la surface de la carte, le contact
électrique étant en connexion électrique avec la piste du circuit (32),
ladite section de montage (49) s'étendant de la surface du substrat étant une structure
d'application de force adaptée à recevoir une force appliquée au contact,
caractérisé en ce que
ladite section de montage (49) comprend une base généralement plane (50) parallèle
au plan du substrat (31) avec un tenon supérieur (52) tourné dans sa partie haute,
disposé le long d'un bord supérieur et s'étendant depuis la surface de la base plane
(50).
2. Connecteur électrique haute vitesse selon la revendication 1, caractérisé en ce que la base plane (50) de la section de montage (49) comprend en outre une paire de tenons
latéraux opposés (53) tournés dans leur partie haute depuis la base (50) et s'étendant
depuis la surface de la base plane (50).
3. Connecteur électrique haute vitesse selon la revendication 1, caractérisé en ce que la section de montage (49) est retenue sur la piste du circuit (32) par une soudure.
4. Connecteur électrique haute vitesse selon la revendication 1, caractérisé en ce que le contact (35) est un contact emmanché par serrage.
5. Connecteur électrique haute vitesse selon la revendication 1, caractérisé en ce qu'il comprend en outre un couvercle isolant (56) pour la couverture de la première surface
du substrat (31), le couvercle (56) et le substrat (31) formant un module (69) de
sorte qu'une proportion significative de la force soit appliquée au contact (35).
6. Connecteur électrique haute vitesse selon les revendications 1 à 5, caractérisé en ce que le couvercle (56) comprend un moyen d'engagement pour engager ladite structure d'application
de la force pour appliquer ladite force à celui-ci.
7. Connecteur électrique haute vitesse selon la revendication 6, caractérisée en ce que le moyen d'engagement comprend une surface de pression (68) adaptée à porter sur
le tenon supérieur (52).
8. Connecteur électrique haute vitesse selon la revendication 6, caractérisé en ce que le couvercle comprend en outre un évidement (60) pour recevoir le contact (35), la
surface de pression (68) étant formée par la surface du fond dudit évidement (60).
9. Connecteur électrique haute vitesse selon la revendication 6, caractérisé en ce que le couvercle comprend en outre un rebord supérieur (63) appliquant une force verticale
sur le bord supérieur du substrat (31).
10. Connecteur électrique haute vitesse selon les revendications 6 à 9, caractérisé en ce qu'un petit jeu est prévu initialement entre le rebord (63) et le bord supérieur du substrat
(31) de sorte que la surface de pression (68) s'engage dans le tenon supérieur (52)
avant que le rebord supérieur (63) n'applique ladite force verticale.