A header contact and a header connector for use therewith

(19)

(11)

EP 1 530 261 A3

(12)	EUROPEAN PATENT APPLICATION

(88)	Date of publication A3:
	08.02.2006 Bulletin 2006/06

(43)	Date of publication A2:
	11.05.2005 Bulletin 2005/19

(21)	Application number: 04256883.2

(22)	Date of filing: 05.11.2004

(51)

International Patent Classification (IPC):

H01R 12/16^(2006.01)

(84)	Designated Contracting States:
	AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LU MC NL PL PT RO SE SI SK TR
	Designated Extension States:
	AL HR LT LV MK YU

(30)

Priority:

07.11.2003 JP 2003379197

(71)	Applicant: J.S.T. Mfg. Co., Ltd.
	Osaka-shi, Osaka (JP)

(72)	Inventors:
	Aramoto, Kiyoshi c/o J.S.T. Mfg.Co.,Ltd. Nishiyodogawa-ku Osaka-shi Osaka (JP) Sano, Koji c/o J.S.T. Mfg.Co.,Ltd. Nishiyodogawa-ku Osaka-shi Osaka (JP) Matsuno, Toshiaki c/o J.S.T. Mfg.Co.,Ltd. Nishiyodogawa-ku Osaka-shi Osaka (JP)

(74)	Representative: DeVile, Jonathan Mark
	D Young & Co 120 Holborn London EC1N 2DY London EC1N 2DY (GB)

(54)	A header contact and a header connector for use therewith

(57) A header contact fixes a header housing reliably and prevents separation or the like of a soldering part so as to secure a function of signal connection and enhance the electric reliability of a header connector. The header contact (110) is provided in the header connector (100) that is to be mounted on a surface of an object for mounting (B) having conductor pattern. This header contact (110) comprises a contacting part (112)which is to contact a socket contact (220) of a counterpart socket connector (200), and a first connecting part (113) and a second connecting part (114)which are to be soldered onto the conductor pattern (FP), (SP) of the object for mounting (B).

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