BACKGROUND OF THE INVENTION
[0001] The present invention relates to a switch circuit, and particularly to a composite
switch circuit comprising a diode switch circuit incorporated with a low pass filter
circuit for use as a high frequency switch circuit of a digital cellular radiotelephone,
etc. to alternately switch transmission paths for transmitting or receiving communication
signals. The present invention relates also to a composite switch device of an integral
multi-layer body including the composite switch circuit.
[0002] A switch circuit for a digital cellular radiotelephone, etc. is utilized to alternately
connect a receiving circuit to an antenna or a transmitting circuit to the antenna.
In a radiotelephone employing a reception diversity system, the switch circuit also
alternately connects a receiving circuit to a first antenna or the receiving circuit
to a second antenna. Likely, in a base station for a radio communication system employing
a transmission diversity system, the switch circuit is also utilized to alternately
connect a transmitting circuit to a first antenna or the transmitting circuit to a
second antenna.
[0003] In a radiotelephone having an external port for connecting an automotive booster,
etc., the switch circuit is also used for switching a path to an internal circuit
and a path to the external port. Further, the switch circuit is used for switching
a plurality of channels of base stations for the radio communication system.
[0004] Fig. 11 is a schematic circuit diagram showing a conventional switch circuit disclosed
in Japanese Patent Laid-Open No. 6-197040. In Fig. 11, the switch circuit alternately
connects a transmitting circuit Tx to an antenna ANT or a receiving circuit Rx to
the antenna ANT. The transmitting circuit Tx is connected to an anode of a first diode
D101 via a first capacitor C101. A cathode of the first diode D101 is connected to
the antenna ANT via a third capacitor C103. The antenna ANT is also connected to a
receiving circuit Rx via series-connected third capacitor C103, second transmission
line SL2 and fourth capacitor C104. An anode of the first diode D101 is grounded via
series-connected first transmission line SL1 and second capacitor C102. Further, a
control circuit T1 is connected to a node formed between the first transmission line
SL1 and the second capacitor C102 via a resistance R101. An anode of a second diode
D102 is connected to a node formed between the second transmission line SL2 and the
fourth capacitor C104, and a cathode thereof is grounded. The transmission lines and
some of the capacitors are disposed on a plurality of substrates of a dielectric laminate
body, and the diodes, resistance and the other of the capacitors are mounted on a
top surface of the laminate body.
[0005] When a filter circuit is used with the switch circuit, the switch circuit and the
filter circuit are separately formed and then connected together. Therefore, a large
mounting area is needed, and an additional circuit for impedance-matching is required.
[0006] To solve the above problem, EP 0 785 590 A discloses a composite device including
a switch circuit and a filter circuit. This device has the features included in the
first part of claim 1. An equivalent circuit of the composite device is shown in Fig.
12. In Fig. 12, a filter circuit portion is represented by a block shown in broken
line. The filter circuit is positioned to interconnect a transmitting circuit Tx and
the switch circuit. An equivalent circuit when the transmitting circuit Tx is electrically
connected to the antenna ANT is shown in Fig. 13. In the equivalent circuit, the diodes
D201 and D202 are not shown because they are on position by DC current and in low
impedance state to form short circuits.
[0007] As seen from Fig. 13, a conventional circuit formed by simply connecting the filter
circuit to the switch circuit lacks symmetry in the circuit configuration to exhibit
a sufficient frequency characteristics only in a narrow frequency band. A narrow-band
switch circuit is of less performance in view of the full utilization of the frequency
band allocated for a communication system, and is poor in productivity due to the
variability of products.
OBJECT AND SUMMARY OF THE INVENTION
[0008] Accordingly, an object of the present invention is to provide a broad band, composite
switch circuit with a high symmetry in the circuit configuration and a miniaturized
composite switch device of an integral multi-layer structure including the composite
switch circuit.
[0009] This object is met by the circuit defined in claim 1.
[0010] As a result of the intense research in view of the above objects, the inventors have
found that the symmetry in the circuit configuration can be increased by disposing
a low pass filter circuit between a diode and a transmission line in a switch circuit
in stead of simply connecting the low pass filter circuit to the switch circuit, thereby
decreasing the level of insertion loss and ensuring a high performance of the switch
circuit in a broader frequency band as compared with conventionally known switch circuits.
[0011] Preferred embodiments of the invention are set forth in the dependent claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012]
Fig. 1 is a perspective view showing a composite switch device of the present invention;
Fig. 2 is a perspective view showing respective substrates constructing the integral
multi-layer body of the composite switch device shown in Fig. 1;
Fig. 3 is a schematic circuit diagram showing an equivalent circuit of a radio transceiver
circuit including a composite switch circuit of the present invention;
Fig. 4 is a schematic circuit diagram showing an equivalent circuit of Fig. 3, in
which the transmitting circuit Tx is electrically connected to the antenna ANT;
Fig. 5 is a schematic circuit diagram showing an equivalent circuit of a radio transceiver
circuit including another composite switch circuit of the present invention;
Fig. 6A is a graph showing the insertion loss at a frequency up to 5.5 GHz measured
on the composite switch device of the present invention;
Fig. 6B is a graph showing the enlarged passband of Fig. 6A;
Fig. 7 is a schematic circuit diagram showing an equivalent circuit of the low pass
filter portion of the composite switch circuit of the present invention;
Fig. 8 is a perspective view showing respective substrates constructing an integral
multi-layer body disposed by another composite switch circuit of the present invention;
Fig. 9 is a schematic circuit diagram showing an equivalent circuit of a transceiver
circuit including the composite switch circuit disposed on the integral multi-layer
body of Fig. 8;
Fig. 10 is a schematic circuit diagram showing a partial equivalent circuit of still
another composite switch circuit of the present invention;
Fig. 11 is a schematic circuit diagram showing an equivalent circuit of a conventional
switch circuit;
Fig. 12 is a schematic circuit diagram showing an equivalent circuit of another conventional
switch circuit; and
Fig. 13 is a schematic circuit diagram showing an equivalent circuit of the conventional
switch circuit of Fig. 12, in which the transmitting circuit Tx is electrically connected
to the antenna ANT.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0013] As summarized above, the composite switch circuit of the present invention is a switch
circuit incorporated with a low pass filter circuit, and is operable to alternately
and electrically connecting a first circuit to a third circuit or a second circuit
to the third circuit In a preferred embodiment, the composite switch circuit may be
an antenna switch circuit in which the first circuit is a transmitting circuit, the
second circuit is a receiving circuit, and the third circuit is an antenna. The present
invention will be described more in detail with respect to such an antenna switch
circuit. However, it should be considered to illustrate one of various preferred embodiments
of the present invention.
[0014] In the present invention, a circuit for a low pass filter circuit is incorporated
into a switch circuit to form a single composite switch circuit. The composite switch
circuit may be disposed on a plurality of dielectric substrates to form a miniaturized
composite switch device of an integral multi-layer body.
[0015] An equivalent circuit of a radio transceiver circuit including a composite switch
circuit of the present invention is shown in Fig. 3. In the equivalent circuit, the
first circuit is a transmitting circuit Tx, the second circuit is a receiving circuit
Rx, and the third circuit is an antenna ANT. A composite switch circuit 30 within
a block indicated by broken line includes a first path interconnecting the transmitting
circuit Tx and the antenna ANT and a second path interconnecting the receiving circuit
Rx and the antenna ANT. The first path includes a first diode D1 and a first transmission
line L1, a first side portion of the first diode D1 being connected to the antenna
ANT and a first side portion of the first transmission line L1 being connected to
a node between a second side portion of the first diode D1 and the transmitting circuit
Tx in a shunt configuration. The second path includes a second transmission line L2
and a second diode D2, a first side portion of the second transmission line L2 being
connected to the antenna ANT and a first side portion of the second diode D2 being
connected to a node between a second side portion of the second transmission line
L2 and the receiving circuit Rx in a shunt configuration.
[0016] The low pass filter circuit LPF within a block indicated by broken line is incorporated
into the switch circuit so as to interconnect the second side portion of the first
diode D1 and the first side portion of the shunt-connected first transmission line
L1, thereby to form the composite switch circuit of the present invention. As shown
in Fig. 3, the low pass filter circuit LPF usually comprises a transmission line L3,
a capacitor C4 in parallel to the transmission line L3, and capacitors C2 and C3 each
forming a shunt path to ground.
[0017] Further, as seen from Fig. 3, a second side portion of the transmission line L1 is
grounded via a capacitor C14, and a first control circuit CONT1 is shunt-connected
between the first transmission line L1 and the capacitor C14 via a resistance R1.
The CONT1 may be omitted, and if omitted, the first transmission- line L1 may be directly
grounded. Further, a second side portion of the second diode D2 is grounded via a
capacitor C1, and a second control circuit CONT2 is shunt-connected between the second
diode D2 and the capacitor C1 via a resistance R2. The control circuits control whether
the transmitting circuit Tx (first circuit) or the receiving circuit Rx (second circuit)
is electrically connected to the antenna ANT (third circuit) by biasing the diodes
D1 and D2. To each input/output terminal of the transmitting circuit Tx, the receiving
circuit Rx and the antenna ANT, connected is a DC cutting capacitor C11, C12 or C13
for passing only high frequency signals therethrough.
[0018] In the present invention, the low pass filter circuit is not simply connected to
a switch circuit, but is incorporated into the switch circuit, more specifically,
is incorporated between the second side portion of the first diode D1 and the first
side portion of the shunt-connected first transmission line L1. An equivalent circuit
of Fig. 3 when the transmitting circuit Tx is electrically connected to the antenna
ANT is shown in Fig. 4. In Fig. 4, the diodes D1 and D2 are not shown because they
are in a highly conducting, low impedance state to form short circuits.
[0019] As seen from Fig. 4, the composite switch circuit of the present invention is highly
symmetric in the circuit configuration. Namely, the transmitting circuit Tx, the capacitor
C11, the transmission line L1 and the capacitor C14 are positioned symmetrically with
the antenna ANT, the capacitor C13, the transmission line L2 and the capacitor C1(C12),
respectively, with respect to the central low pass filter circuit. With such a symmetry
in the circuit configuration, the composite switch circuit of the present invention
exhibits a lower level of insertion loss and sufficient characteristics in a broader
frequency band as compared with conventional switch circuits.
[0020] An equivalent circuit of another composite switch circuit 50 of the present invention
is shown in Fig. 5. The equivalent circuit of Fig. 5 is similar to that of Fig. 3,
but in which the first and second diodes D1 and D2 are reversely connected with respect
to anode and cathode. When the transmitting circuit Tx is electrically connected to
the antenna ANT, the circuit of Fig. 5 has the same equivalent circuit as shown in
Fig. 4. Namely, the composite switch circuit of Fig. 5 has also a high symmetry in
the circuit configuration, and exhibits a lower level of insertion loss and sufficient
characteristics in a broader frequency band as compared with conventional switch circuits.
[0021] The equivalent circuit of Fig. 3 has been experimentally confirmed to have a lower
level of insertion loss and a good isolation as compared with the equivalent circuit
of Fig. 5.
[0022] Fig. 1 is a perspective view showing a composite switch device of the present invention.
Substrates constructing the integral multi-layer body of the composite switch device
of Fig. 1 are perspectively shown in Fig. 2, and an equivalent circuit of a composite
switch circuit disposed on a plurality of dielectric substrates of the composite switch
device of Figs. 1 and 2 is shown in Fig. 3.
[0023] As seen from Fig. 1, the composite switch device comprises a semiconductor element
1 containing two diodes and an integral multi-layer body 2 of a plurality of dielectric
substrates. In Figs. 1 and 2, a portion indicating the electrodes are shown by hatch
makings.
[0024] In Fig. 3, the composite switch circuit of the present invention comprises the elements
contained within the block 30 indicated by broken line, and capacitors C11, C12, C13,
C14 and the resistances R1 and R2 outside the block 30 are external elements which
may be formed on a circuit board on which the composite switch device is mounted,
or may be disposed on the dielectric substrates or the top surface of the integral
multi-layer body.
[0025] As seen from Fig. 2, the composite switch device of the embodiment comprises a bottom
dielectric substrate 21, inner substrates 22-28 and a top dielectric substrate 29.
[0026] On the top surface of the bottom dielectric substrate 21, a first ground electrode
31 is formed, from which lead electrodes extend to be connected to external electrodes
T2, T7 and T8 on the side surface of the integral multi-layer body 2.
[0027] On the top surface of the dielectric substrate 22 laminated on the bottom dielectric
substrate 21, a capacitor electrode 41 opposing the first ground electrode 31 is formed
so as to form the capacitor C1. A lead electrode extending from the capacitor electrode
41 is connected to an external electrode T4. Although the capacitor C1 is formed inside
the integral multi-layer body in this embodiment, it may be externally formed, for
example, on the top surface of the top dielctric surbstrate 29 or on the circuit board
on which the composite switch device is mounted.
[0028] On the dielectric substrate 22, dielectric substrates 23 and 24 having electrodes
forming the transmission lines are laminated. A spiral line electrode 11 on the dielectric
substrate 23 is connected to a spiral line electrode 12 on the dielectric substrate
24 via a through-hole electrode 51 to form the transmission line L1. Two lead electrodes
extend from the spiral line electrodes 11 and 12 to be respectively connected to external
electrodes T3 and T6. A spiral line electrode 13 on the dielectric substrate 23 is
connected to a spiral line electrode 14 on the dielectric substrate 24 via a through-hole
electrode 52 to form the transmission line L2. Two lead electrodes extend from the
spiral line electrodes 13 and 14 to be respectively connected to external electrodes
T5 and T1.
[0029] On the top surface of a dielectric substrate 25 laminated on the dielectric substrate
24, a second ground electrode 32 is formed. Three lead electrodes extend from the
second ground electrode 32 to be respectively connected to the external electrodes
T2, T7 and T8.
[0030] On the dielectric substrate 25, a dielectric substrate 26 is laminated. On the top
surface the dielectric substrate 26, a capacitor electrode 42 opposing the second
ground electrode 32 is formed to form the capacitor C2 of the low pass filter circuit.
Also formed on the dielectric substrate 26 is a capacitor electrode 43 opposing the
second ground electrode 32 to form the capacitor C3 of the low pass filter circuit.
From the capacitor electrode 42, a lead electrode extends to be connected to the external
electrode T3.
[0031] A capacitor electrode 44 opposing the capacitor electrode 42 of the dielectric substrate
26 is formed on the top surface of a dielectric substrate 27 to form the capacitor
C4 of the low pass filter circuit. The capacitor electrode 44 is connected to the
capacitor electrode 43 on the dielectric substrate 26 via a through-hole 53.
[0032] On the top surface of the dielectric substrate 28, a spiral line electrode 15 forming
the transmission line L3 of the low pass filter circuit is formed. An end of the spiral
line electrode is connected to the external electrode T3, and the opposite end is
connected to the capacitor electrodes 44 and 43 via the through-holes 54 and 53.
[0033] On the top surface of the top dielectric substrate 29, pattern electrodes 16 and
17 are formed. The pattern electrode 16 is connected to the through-hole 54 on the
dielectric substrate 28 via a through-hole 55. The pattern electrode 17 serves as
a marker. On the top surface of the top dielectric substrate 29, pattern electrodes
to be connected to the external electrodes T1, T4, T5 and T6 are further formed.
[0034] An composite switch device having the above construction was produced by using dielectric
material having a dielectric constant of about 8. The dielectric material was made
into a sheet form (dielectric substrates) by a doctor blade and respective pattern
electrodes were formed on the dielectric sheets by screen-printing an electrically
conductive material such as Ag. The dielectric substrates having thereon pattern electrodes
printed were laminated, compressed and fired to an integral multi-layer body. After
firing, the external electrodes T1 to T8 and the pattern electrodes were formed on
the side surface and the top surface of the integral multi-layer body. Finally, the
semiconductor element 1 containing the first and second diodes D1 and D2 was mounted
on the top surface of the integral multi-layer body so that the first diode D1 was
connected to the pattern electrode 16 and the external electrodes T5, and the second
diode D2 was connected to the external electrodes T1 and T4, respectively, to obtain
a composite switch device of the present invention of a size having length/width of
4.5 mm/3.2 mm and a thickness of 2 mm.
[0035] In the composite switch device thus obtained, the low pass filter circuit comprising
the capacitors C2, C3 and C4 and the transmission line L3 was inserted between the
anode portion of the first diode D1 and the first side portion of the shunt-connected
transmission line L1.
[0036] A radio transceiver circuit of Fig. 3 is obtained by connecting the transmitting
circuit Tx to the external electrode T3 via the capacitor Cell, connecting the antenna
ANT to the external electrode T5 via the capacitor C13, connecting the receiving circuit
Rx to the external electrode T1 via the capacitor 12, connecting the first control
circuit CONT1 to the external electrode T6 via the resistance R1, connecting the capacitor
C14 to the external electrode T6 to form a path to ground, and connecting the second
control circuit CONT2 to the external electrode T4 via the resistance R2.
[0037] The insertion loss at a frequency up to 5.5 GHz measured on the composite switch
device obtained above is shown in Fig. 6A. An enlarged representation of the passband
(0.5 to 1.5 GHz) of Fig. 6A is shown in Fig. 6B. As better seen from Fig. 6B, the
composite switch device exhibited an insertion loss as low as 1 dB or less at a frequency
range of 900 ± 250 MHz. Thus, the composite switch circuit of the preferred embodiment
of the present invention is excellent in minimizing the insertion loss. Further, since
the geometrical size can be reduce, only a small space is required in mounting the
composite switch device of the present invention on a circuit board, thereby reducing
the size of a radio transceiver such as a cellular radiotelephone. The composite switch
device of the present invention is suitably used in a frequency range of about 800
MHz to several gigas of hertz.
[0038] In the above embodiment, the first and second transmission lines L1 and L2 were disposed
between the first ground electrode 31 and the second ground electrode 32, and a substantial
part of the switch circuit portion is disposed nearer to the mounting surface than
the low pass filter circuit portion. With such a construction, the second ground electrode
32 forming the grounded capacitors C2 and C3 with the opposing capacitor electrodes
42 and 43 may have a lead portion, i.e. the external electrode T2 in the above embodiment,
to be connected to a ground terminal of a circuit board on which the composite switch
device is mounted. The external electrode T2 functions as a line electrode which may
be considered as inductors L4 and L5, as shown by an equivalent circuit of Fig. 7,
connected to the capacitors C2 and C3 in series. In such an equivalent circuit, harmonics
can be effectively reduced by the series resonance between the capacitor C2 with the
inductor L4, and the capacitor C3 with the inductor L5.
[0039] Therefore, in the present invention, it is preferable that the first and second transmission
lines L1 and L2 are disposed between two ground electrodes, and that the capacitor
of the low pass filter circuit is formed by the ground electrode above the transmission
lines L1 and L2 and the capacitor electrode above and opposing the ground electrode.
With such a construction, a miniaturized composite switch device with high performance
can be obtained.
[0040] In the above embodiment, the transmission lines L1 and L2 were formed by spiral line
electrodes printed on successively adjacent two dielectric substrates. By making the
line electrodes spiral and partially overlapping the line electrodes on the tow dielectric
substrates, the length of the line electrodes were made shorter.
[0041] Fig. 8 is a perspective view showing respective substrates constructing an integral
multi-layer body disposed by another composite switch circuit 90 of the present invention.
An equivalent circuit including the composite switch circuit 90 is shown in Fig. 9.
The equivalent circuit of Fig. 9 is similar to that of Fig. 2, but in which an additional
capacitor C5 is connected between the low pass filter circuit and the shunt-connected
first transmission line L1 to form a shunt path to ground. The capacitor C5 is formed
by a first ground electrode 31 on a dielectric substrate 21 and a capacitor electrode
45 on a dielectric substrate 22 which is connected to an external electrode T3. Since
the third to ninth substrates from the bottom of Fig. 8 are respectively the same
as the dielectric substrates 23 to 29 of Fig. 2, the description of these substrates
are omitted here and in Fig. 8.
[0042] A composite switch device including the above composite switch circuit was produced
in the same manner as described above, and was confirmed to have the same performance
as in the above embodiment.
[0043] In place of the capacitor C5, an additional capacitor C6 may be connected as shown
in Fig. 10. By incorporating the capacitor C5 shown in Fig. 9 or the capacitor C6
shown in Fig. 10, the line length of the first transmission line L1 can be effectively
made shorter.
[0044] As described above, according to the present invention, a small composite switch
circuit, which is incorporated with a low pass filter circuit, having a high performance
can be obtained. In addition, a miniaturized composite switch device including the
composite switch circuit can be obtained in a form of an integral multi-layer body
by disposing the composite switch circuit on a plurality of dielectric substrates.
The composite switch circuit and composite switch device of the present invention
exhibit sufficient characteristics in a broad frequency range, much less insertion
loss and a high suppression effect of harmonics.
[0045] While the present invention has been described in connection with a composite switch
circuit operable to alternately connect the transmitting circuit to the antenna and
the receiving circuit to the antenna, it is to be understood that the circuits to
be switched by the composite switch circuit of the present invention are not specifically
limited to the above circuits.
1. A composite switch circuit (30) for alternately and electrically connecting a transmitting
circuit (Tx) or a receiving circuit (Rx) to an antenna (ANT), which comprises:
a first path interconnecting the transmitting circuit (Tx) and the antenna (ANT),
the first path including a first diode (D1) and a first transmission line (L1), the
first diode (D1) having one terminal connected to the antenna (ANT), the first transmission
line (L1) having its one end connected to a node formed between the transmitting circuit
(Tx) and the other terminal of the first diode (D1) and its other end connected to
ground,
a second path interconnecting the receiving circuit (Rx) and the antenna (ANT), the
second path including a second transmission line (L2) and a second diode (D2), one
end of the second transmission line (L2) being connected to the antenna (ANT), the
second diode (D2) having its one terminal connected to a node formed between the other
end of the second transmission line (L2) and the receiving circuit (Rx) and its other
terminal connected to ground, and
a low pass filter circuit (LPF) disposed in the first path and comprising a transmission
line (L3) and capacitors,
characterised in that the low pass filter circuit (LPF) interconnects said other terminal of the first
diode (D1) and said one end of the first transmission line (L1).
2. The circuit of claim 1, wherein said one terminal of the first diode is the anode
thereof, and said one terminal of the second diode is the anode thereof.
3. The circuit of claim 1, wherein said one terminal of the first diode is the cathode
thereof, and said one terminal of the second diode is the cathode thereof.
4. A composite switch device comprising the composite switch circuit (30) of any one
of claims 1 to 3 disposed on a plurality of dielectric substrates of an integral multi-layer
body (2), wherein at least the first transmission line (L1), the second transmission
line (L2) and a part of the low pass filter circuit (LPF) are disposed on at least
one inner dielectric substrate (22-28) in the integral multi-layer body (2).
5. The device of claim 4, wherein the first and second diodes (D1, D2) are disposed on
a top surface of the integral multi-layer body (2).
6. The device of claim 4 or 5, wherein the first and second transmission lines (L1, L2)
disposed on inner dielectric substrates (22-28) in the integral multi-layer body (2)
are positioned between two ground electrodes (31, 32) disposed on respective dielectric
substrates (21, 25), and wherein a capacitor (C2) of the low pass filter circuit (LPF)
is formed by the one (32) of said two ground electrodes (31, 32) sandwiching the first
and second transmission lines (L1, L2) and an electrode (42) disposed on a dielectric
substrate (26) positioned above and opposite said upper ground electrode (32).
7. The device of claim 6, wherein electrodes (32, 42) forming plates of said capacitor
(C2) of the low pass filter circuit (LPF) are respectively disposed on dielectric
substrates (25, 26) positioned on the upper side of the first and second transmission
lines (L1, L2) with respect to a mounting surface of the composite switch device.
8. The device of any one of claims 4 to 7, wherein the first and second transmission
lines (L1, L2) are formed by electrode patterns (11-14) of spiral form.
9. The device of claim 2 or any one of claims 4 to 8 as far as they depend on claim 2,
wherein a control circuit (CONT2) is connected to the anode of the second diode (D2)
and a voltage is applied between the anodes of the first and second diodes (D1, D2).
1. Zusammengesetzter Schalterstromkreis (30) zur abwechselnden und elektrischen Verbindung
einer Übertragungsschaltung (Tx) oder einer Empfangsschaltung (Rx) mit einer Antenne
(ANT), umfassend:
einen die Übertragungsschaltung (Tx) und die Antenne (ANT) verbindenden ersten Pfad,
wobei der erste Pfad eine erste Diode (D1) und eine erste Übertragungsleitung (L1)
enthält, wobei ein Anschluß der ersten Diode (D1) mit der Antenne (ANT) verbunden
ist, ein Ende der ersten Übertragungsleitung (L1) mit einem zwischen der Übertragungsschaltung
(Tx) und dem anderen Anschluß der ersten Diode (D1) gebildeten Knoten verbunden ist
und ihr anderes Ende mit der Masse verbunden ist,
einen die Empfangsschaltung (Rx) und die Antenne (ANT) verbindenden zweiten Pfad,
wobei der zweite Pfad eine zweite Übertragungsleitung (L2) und eine zweite Diode (D2)
enthält, wobei ein Ende der zweiten Übertragungsleitung (L2) mit der Antenne (ANT)
verbunden ist, ein Anschluß der zweiten Diode (D2) mit einem zwischen dem anderen
Ende der Übertragungsleitung (L2) und der Empfangsschaltung (Rx) gebildeten Knoten
verbunden ist und ihr anderer Anschluß mit der Masse verbunden ist, und
eine im ersten Pfad angeordnete Tiefpaßfilterschaltung (LPF), die eine Übertragungsleitung
(L3) und Kondensatoren umfaßt,
dadurch gekennzeichnet, daß die Tiefpaßfilterschaltung (LPF) den anderen Anschluß der ersten Diode (D1) und das
eine Ende der ersten Übertragungsleitung (L1) verbindet.
2. Schalterstromkreis nach Anspruch 1, wobei der eine Anschluß der ersten Diode ihre
Anode ist und der eine Anschluß der zweiten Diode deren Anode ist.
3. Schalterstromkreis nach Anspruch 1, wobei der eine Anschluß der ersten Diode ihre
Kathode ist und der eine Anschluß der zweiten Diode deren Kathode ist.
4. Zusammengesetztes Schaltergerät umfassend den zusammengesetzten Schalterstromkreis
(30) nach einem der Ansprüche 1 bis 3, der auf einer Mehrzahl von dielektrischen Substraten
auf einem einstückigen Mehrschichtkörper (2) angeordnet ist, wobei zumindest die erste
Übertragungsleitung (L1), die zweite Übertragungsleitung (L2) und ein Teil der Tiefpaßfilterschaltung
(LPF) auf mindestens einem inneren dielektrischen Substrat (22-28) im einstückigen
Mehrschichtkörper (2) angeordnet sind.
5. Gerät nach Anspruch 4, wobei die erste und die zweite Diode (D1, D2) auf einer obersten
Oberfläche des einstückigen Mehrschichtkörpers (2) angeordnet sind.
6. Gerät nach Anspruch 4 oder 5, wobei die erste und die zweite Übertragungsleitung (L1,
L2), die auf inneren dielektrischen Substraten (22-28) im einstückigen Mehrschichtkörper
(2) angeordnet sind, zwischen zwei auf den jeweiligen dielektrischen Substraten (21,
25) angeordneten Masseelektroden (31, 32) positioniert sind und wobei ein Kondensator
(C2) der Tiefpaßfilterschaltung (LPF) durch die eine (32) der beiden Masseelektroden
(31, 32), die die erste und die zweite Übertragungsleitung (L1, L2) sandwichartig
einfassen, und eine Elektrode (42) die auf einem oberhalb und entgegengesetzt der
oberen Massenelektrode (32) positionierten dielektrischen Substrat (26) angeordnet
ist, gebildet ist.
7. Gerät nach Anspruch 6, wobei Elektroden (32, 42), die Platten des Kondensators (C2)
der Tiefpaßfilterschaltung (LPF) bilden, jeweils auf dielektrischen Substraten (25,
26) angeordnet sind, die auf der oberen Seite der ersten und der zweiten Übertragungsleitung
(L1, L2) bezüglich einer Montagefläche des zusammengesetzten Schaltergeräts positioniert
sind.
8. Gerät nach einem der Ansprüche 4 bis 7, wobei die erste und die zweite Übertragungsleitung
(L1, L2) durch Elektrodenmuster (11-14) von Spiralenform gebildet sind.
9. Gerät nach Anspruch 2 oder der Ansprüche 4 bis 8, sofern diese von Anspruch 2 abhängen,
wobei eine Steuerungsschaltung (CONT2) mit der Anode der zweiten Diode (T2) verbunden
ist und eine Spannung zwischen den Anoden der ersten und der zweiten Diode (D1, D2)
angelegt wird.
1. Circuit composite de commutation (30) pour relier électriquement et en alternance
un circuit de transmission (Tx) ou un circuit de réception (Rx) à une antenne (ANT),
le circuit comprenant :
un premier chemin interconnectant le circuit de transmission (Tx), et l'antenne (ANT),
le premier chemin comportant une première diode (D1) et une première ligne de transmission
(L1), la première diode (D1) ayant une borne reliée à l'antenne (ANT), la première
ligne de transmission (L1) ayant une extrémité reliée à un noeud formé entre le circuit
de transmission (Tx) et l'autre borne de la première diode (D1), et son autre extrémité
étant reliée à la masse,
un second chemin interconnectant le circuit de réception (Rx) et l'antenne (ANT),
le second chemin comportant une seconde ligne de transmission (L2) et une seconde
diode (D2), une extrémité de la seconde ligne de transmission (L2) étant reliée à
l'antenne (ANT), la seconde diode (D2) ayant une borne reliée à un noeud formé entre
l'autre extrémité de la seconde ligne de transmission (L2) et le circuit de réception
(Rx), et son autre borne étant reliée à la masse, et
un circuit formant filtre passe-bas (LPF) disposé dans le premier chemin et comprenant
une ligne de transmission (L3) et des condensateurs,
caractérisé en ce que le circuit formant filtre passe-bas (LPF) interconnecte ladite autre borne de la
première diode (D1) et ladite une extrémité de la première ligne de transmission (L1).
2. Circuit selon la revendication 1, dans lequel ladite une borne de la première diode
est l'anode de celle-ci, et ladite une borne de la seconde diode est l'anode de celle-ci.
3. Circuit selon la revendication 1, dans lequel ladite une borne de la première diode
est la cathode de celle-ci, et ladite une borne de la seconde diode est la cathode
de celle-ci.
4. Dispositif composite de commutation comprenant le circuit composite de commutation
(30) selon l'une quelconque des revendications 1 à 3, disposé sur une pluralité de
substrats diélectriques d'un corps multicouche intégré (2), dans lequel au moins la
première ligne de transmission (L1), la seconde ligne de transmission (L2) et une
partie du circuit formant filtre passe-bas (LPF) sont disposées sur au moins un substrat
diélectrique intérieur (22 à 28) dans le corps multicouche intégré (2).
5. Dispositif selon la revendication 4, dans lequel les première et seconde diodes (D1,
D2) sont disposées sur une surface supérieure du corps multicouche intégré (2).
6. Dispositif selon la revendication 4 ou 5, dans lequel les première et seconde lignes
de transmission (L1, L2), disposées sur des substrats diélectriques intérieurs (22
à 28) dans le corps multicouche intégré (2), sont placées entre deux électrodes de
masse (31, 32) disposées sur des substrats diélectriques respectifs (21, 25), et dans
lequel un condensateur (C2) du circuit formant filtre passe-bas (LPF) est formé par
une électrode (32) desdites deux électrodes de masse (31, 32), prenant en sandwich
les première et seconde lignes de transmission (L1, L2), et par une électrode (42)
disposée sur un substrat diélectrique (26) placé au-dessus de ladite électrode supérieure
de masse (32), et opposé à celle-ci.
7. Dispositif selon la revendication 6, dans lequel des électrodes (32, 42) formant des
armatures dudit condensateur (C2) du circuit formant filtre passe-bas (LPF) sont disposées
respectivement sur des substrats diélectriques (25, 26) placés sur le côté supérieur
des première et seconde lignes de transmission (L1, L2) par rapport à une surface
de montage du dispositif composite de commutation.
8. Dispositif selon l'une quelconque des revendications 4 à 7, dans lequel les première
et seconde lignes de transmission (L1, L2) sont formées par des motifs d'électrodes
(11 à 14) en forme de spirale.
9. Dispositif selon la revendication 2 ou selon l'une quelconque des revendications 4
à 8 dans la mesure où elles dépendent de la revendication 2, dans lequel un circuit
de commande (CONT2) est relié à l'anode de la seconde diode (D2), et une tension est
appliquée entre les anodes des première et seconde diodes (D1, D2).