PRIORITY
[0001] This application claims priority to an application entitled "JEWELRY SETTING" filed
in the United States Patent and Trademark Office on October 20, 2005 and assigned
Serial
No. 60/728,729, the contents of which are hereby incorporated by reference.
BACKGROUND
[0002] Field. The present disclosure relates to jewelry findings, and more particular, a
jewelry setting which provides maximum exposure of a gemstone, while providing a sturdy
and attractive mounting for the gemstone. The jewelry setting may be incorporated
in a ring, an earring, a pendant, or as a component of a bracelet and the like.
[0003] Description of the Related Art. Jewelry findings are well known in the art and have
been the subject of many issued patents. For example,
U.S. Patent No. 2,835,117 which issued to Lutrario on May 20, 1958 is entitled "GEM SETTING WITH GEM BIASED ORNAMENTAL SADDLE MEMBER", and discloses
a significant and massive gold setting construction, thereby shielding a large portion
of the gemstone. Similarly, the patent to Engel,
U.S. Patent No. 2,510,774 which issued on June 6, 1950 provides a stone mounting for bracelets and other articles wherein a major portion
of the sides of the gemstone are hidden. Other similar findings or settings which
obstruct a portion of the gemstone are disclosed in
U.S. Patent No. 5,433,090 to Santiago which issued on July 18, 1995 and is entitled "VARIABLE FINGER RING WITH BIASED SHANK AND METHOD OF MAKING SAME"
and
U.S. Patent No. 5,800,574 to Ricci et al. which issued on September 1, 1998 and is entitled "V-END SETTINGS AND METHOD OF MAKING SAME".
[0004] Even applicant's
U.S. Patent No. 6,453,701 which issued on September 24, 2002 and is entitled "MULTI-PART JEWELRY SETTING" provides an aesthetically pleasing setting
that appears to be of significant and massive gold construction whereas, in fact,
applicant's patented setting is hollow and relatively inexpensive, as compared to
its appearance which is expensive-looking.
[0005] Although applicant's patented jewelry setting, as well as the other prior art settings
have been well received in the marketplace, it is desirable to provide a setting which
is sturdy, yet of minimal structure, thereby affording full exposure of the gemstone,
not only on the top portion thereof, but along its sides, thereby providing an even
more aesthetically pleasing jewelry.
[0006] Accordingly, it is an object of the subject disclosure to provide a jewelry setting,
which provides maximum exposure of a gemstone disposed in the setting, while at the
same time providing a sturdy mounting for the gemstone.
[0007] It is a further object of the subject disclosure to provide a jewelry setting which
may be used with gemstones that are capable of being subjected to soldering temperatures
in the range of 1,400°F during mounting of the gemstone to the setting, as well as
providing a stone setting which may be readily employed with gemstones that cannot
be subjected to such elevated temperatures.
SUMMARY
[0008] The above and other objects are achieved by a jewelry setting or finding in accordance
with the present disclosure wherein a very thin frame corresponding to a shape of
a gemstone is provided, with an outer diameter of the frame substantially corresponding
to an outer perimeter of the stone, whereby the stone may be placed on an upper peripheral
edge of the frame and centered thereon. Next, prongs of generally square-shaped, cross-section
are soldered to the peripheral sidewalls of the frame so as to extend above the surface
of the gemstone, after which the prongs are bent radially inwardly, thereby establishing
a sturdy setting for the stone, while affording maximum exposure of the stone thereby
resulting in an aesthetically pleasing stone setting.
[0009] According to one aspect of the present disclosure, a jewelry setting is provided.
The jewelry setting includes a frame configured to receive a gemstone, the frame including
a base and at least one sidewall defining a cavity for receiving the gemstone; and
at least two prongs soldered to the at least one sidewall, wherein the at least two
prongs extend above an upper peripheral edge of the at least one sidewall for securing
the gemstone in the frame. Each of the at least two prongs has a generally square
cross-section.
[0010] In another aspect of the present disclosure, the jewelry setting further includes
a retainer member configured to center the received gemstone in the frame, the retainer
member being disposed on the upper peripheral edge of the at least one sidewall. The
retainer member may be flat or configured with an inwardly down-sloping angle.
[0011] In a further aspect, each of the at least two prongs includes a planar generally
rectangular portion for mating with the at least one sidewall and two prong members
extending from the rectangular portion for gripping the received gemstone.
[0012] In another aspect, the frame includes at least one cutout for exposing a lower portion
of the gemstone received by the frame.
[0013] According to another aspect of the present disclosure, a method for manufacturing
a jewelry setting is provided. The method includes the steps providing a frame configured
to receive a gemstone, the frame including a base and at least one sidewall defining
a cavity for receiving the gemstone; providing at least two prongs, each of the at
least two prongs includes a layer of solder disposed thereon; placing the at least
two prongs in contact with the at least one sidewall of the frame; and heating the
frame and the at least two prongs to a predetermined temperature, wherein the solder
will reflow and form a joint between each of the at least two prongs and the at least
one sidewall. The method further includes the steps disposing a gemstone in the frame;
and bending an upper portion of each of the at least two prongs inwardly relative
to the frame to secure the gemstone in the frame.
[0014] In another aspect, the method further includes the steps, before the heating step,
providing a retainer member for centering the received gemstone, the retainer member
including a layer of solder disposed thereon and disposing the retainer member on
an upper peripheral edge of the at least one sidewall.
[0015] In a further aspect of the present disclosure, the method includes, wherein the at
least two prongs include an upper bent portion, the placing step further includes
the step disposing a gemstone in the frame before the heating step, the upper bent
portions contacting an upper portion of the gemstone and a lower portion of the at
least two prongs contacting the at least one sidewall of the frame.
BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The above and other aspects, features, and advantages of the present disclosure will
become more apparent in light of the following detailed description when taken in
conjunction with the accompanying drawings in which:
[0017] FIG. 1 is an exploded perspective view of a finding according to the present disclosure,
along with a round stone which is capable of being heated to a soldering temperature.
[0018] FIG. 2 is a side elevational view of the assembly of the finding and stone as illustrated
in FIG. 1.
[0019] FIG. 3 is a perspective view of the assembly of the subject finding and stone of
FIG. 2.
[0020] FIG. 4 is an exploded perspective view of a finding employing a retainer member according
to the present disclosure.
[0021] FIG. 5 is a side elevational view of the assembly of the finding and stone as illustrated
in FIG. 4.
[0022] FIG. 6 is a perspective view of the assembly of the subject finding and stone of
FIG. 5.
[0023] FIG. 7 is an exploded perspective view of another embodiment of a finding according
to the present disclosure which is designed to hold a round stone that is not capable
of being heated to soldering temperatures.
[0024] FIG. 8 is side elevational view of the finding of FIG. 7 preparatory to receiving
a stone.
[0025] FIG. 9 is a top perspective view of the finding of FIG. 8.
[0026] FIG. 10 is a perspective view of the finding of FIG. 8.
[0027] FIG. 11 is an exploded perspective view of a further embodiment of the present disclosure.
[0028] FIG. 12 is a perspective view of the assembly of the subject finding and stone of
FIG. 11.
[0029] FIG. 13 is an exploded perspective view of a finding according to the present disclosure,
along with a square stone which is capable of being heated to a soldering temperature.
[0030] FIG. 14 a top perspective view of the assembly of the subject finding and stone of
FIG. 13.
[0031] FIG. 15 is a side elevational view of the assembly of the finding and stone as illustrated
in FIG. 14.
[0032] FIG. 16 is a perspective view of the assembly of the subject finding and stone of
FIG. 15.
[0033] FIG. 17 is an exploded perspective view of another embodiment of a finding according
to the present disclosure which is capable of accommodating a square stone.
[0034] FIG. 18 is top perspective view of the assembly of the finding of FIG. 17.
[0035] FIG. 19 is a perspective view of the finding of FIG. 18.
[0036] FIG. 20 is an exploded perspective view of a further embodiment of the present disclosure,
which finding is designed to hold a round stone which is capable of being heated to
soldering temperatures, and where the finding includes a post.
[0037] FIG. 21 is perspective view of the assembly of the finding and stone of FIG. 20.
[0038] FIG. 22 is an exploded perspective view of another embodiment of the present disclosure,
which finding is designed to hold a round stone which is not capable of being heated
to soldering temperatures, and where the finding includes a post.
[0039] FIG. 23 is perspective view of the finding of FIG. 22 preparatory to receiving a
round stone.
[0040] FIG. 24 is an exploded perspective view of a further embodiment of the present disclosure,
which finding is designed to hold a round stone which is not capable of being heated
to soldering temperatures, and where the finding includes a post.
[0041] FIG. 25 is perspective view of the assembly of the finding and stone of FIG. 24.
[0042] FIG. 26 is a side elevational view of an assembly of the finding and cabochon stone
employing a flat retainer member.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0043] Preferred embodiments of the present disclosure will be described hereinbelow with
reference to the accompanying drawings. In the following description, well-known functions
or constructions are not described in detail to avoid obscuring the present disclosure
in unnecessary detail.
[0044] Turning to FIG. 1, the subject setting or finding 1 comprises a cylindrical frame
12 for receiving a gemstone and a plurality of prongs 14 which include bent portions
15 for gripping of the stone 10. The cylindrical frame 12 includes an annular sidewall
16 and an open bottom or base, designated by the numeral 18, defining a cavity for
receiving the gemstone. The aperture defining by the base 18 can be of any size and
may vary in accordance with the stone selected for a particular setting. An upper
peripheral edge 20 of the cylindrical frame substantially corresponds to an outer
diameter of the round stone 10. The prongs 14 are soldered to the sidewall 16 of the
cylindrical frame 12, as shown in FIGS. 2 and 3, with the prongs 14 being equally
spaced about the perimeter of the cylindrical frame 12.
[0045] As shown in FIGS. 2 and 3, the stone 10 rests on the upper peripheral edge 20 of
the cylindrical frame 12 of the setting, with the bent portions 15 of the prongs 14
engaging and tightly holding the stone 10 to the finding.
[0046] As illustrated in FIGS. 2 and 3, the peripheral portion 11 of the stone 10, e.g.
a girdle, is fully exposed, as is the top portion of the stone 10, other than for
the small protrusions of the bent portions 15 of the prongs 14. Accordingly, maximum
exposure of the stone 10 is effected, thereby resulting in an aesthetically pleasing
assembly of the stone and the subject finding.
[0047] The frame 12 may be formed from any precious or non-precious metal by any known metal
forming process, e.g., a stamping process, to correspond to the shape of the gemstone
to be set, e.g., round, oval, square, triangle, emerald, pear, marquise, heart, etc..
[0048] Each prong 14 has a generally square cross-sectional configuration, of approximate
one half millimeter on each side, and is preferably made of the same metal or material
as is the cylindrical frame 12, e.g. gold, silver, platinum, etc.. The prongs are
manufactured as a generally square wire which is cut into desired lengths. The wire
includes a layer of solder around and along an entire length of the wire. Preferably,
the color of solder will approximately match the color of the setting, i.e., the frame
and prongs.
[0049] It is to be appreciated that the wire may be of other shapes to effect different
looks of the setting. For example, the wire may be circular and cut to the desired
length. The cut lengths of the wire will vary and will depend on the size and/or the
shape of the stone to be set.
[0050] In the assembly of the stone and finding as shown in the embodiment of FIGS. 1-3,
the stone 10 is placed on the cylindrical frame 12 so as to engage the upper peripheral
edge 20, and because of this configuration, the stone 10 is essentially self-centered.
Next, the cylindrical frame 12, the stone 10, and the prongs 14 are arranged as shown
in FIG. 2 and placed in a suitable jig for holding the assembly. As shown in FIG.
2, a lower portion 13 of the prong will be placed in contact with the sidewall 16
and the bent portion 15 of the prong will be placed in contact with an upper portion
of the stone above the peripheral portion 11 of the stone 10. The finding assembly
will then be subjected to a sufficient predetermined temperature, e.g., on the order
of 1,400°F, so as to solder the prongs 14 to the frame 12, e.g., to allow the solder
to reflow and form a joint between the prongs and the frame, and to provide a sturdy
grip by the bent portions 15 of the prongs 14 against the upper portion of the stone,
thereby resulting in the assembled stone and finding as shown in FIG. 3. By this arrangement,
the objective of obtaining maximum exposure of the stone is achieved, at a cost less
than the cost of existing findings.
[0051] It is to be appreciated that in assembling the setting of FIGS. 1-3, the gemstone
10 employed must be able to withstand high temperatures without becoming damaged.
The lowest tolerable temperature of the gemstone must be at least a predetermined
amount of degrees higher than the melting point, or reflow temperature, of the solder
being employed. Furthermore, the melting point of the solder must be lower than a
melting point of the metal of frame 12.
[0052] In a further embodiment, a retainer member is employed to center the gemstone received
in the frame. Referring to FIGS. 4-6, a retainer member is generally designated by
reference numeral 22. In this embodiment, the retainer member 22 is annular shaped
and has an outer circumference 24 corresponding to the upper peripheral edge 20 of
the frame 12. The retainer member 22 is formed with a layer of solder for bonding
the retainer member 22 to the frame. The setting shown in FIGS. 4-6 will be assembled
as described above with the further step of disposing the retainer member 22 on the
frame 12 before disposing the stone on the frame. By employing the retainer member
22, a gemstone having a girdle circumference 11 less than the circumference of the
frame may be used in the setting 1 of the present disclosure.
[0053] It is to be appreciated that other shapes and configurations of the retainer member
may be employed depending on the size and/or shape of the stone to be set, i.e., a
shape of the retainer member will substantially correspond to the shape of the stone,
e.g., square, oval, etc.. In the embodiments shown in FIGS. 4-6, the retainer member
is configured with an inwardly down-sloping angle best suited for faceted stones.
Another exemplary retainer member will include a flat annular ring 130 which will
be disposed on the upper peripheral edge 20 of the frame 12 as shown in FIG. 26. In
this embodiment, the stone 132 will rest on the retainer member 130 whereby virtually
no part of the stone 132 will be disposed in the frame 12 to effect full exposure
of the stone. Such a retainer member might be employed with a cabochon stone. The
prongs 134 will securely hold the stone in place as described in the various embodiments.
[0054] In another embodiment of the present disclosure, the setting 30 is designed to be
used with a stone that is not capable of being subjected to elevated temperatures
for soldering the prongs 34 to the frame 32. In the embodiment of FIG. 7, the finding
30 includes a retainer member 36 which is soldered to the upper peripheral edge 38
of the frame 32, at the same time that the prongs 34 are soldered to the frame 32.
The resulting finding 30 is illustrated in FIGS. 8, 9 and 10. In this embodiment,
the prongs 34 are straight and are not formed with bent portions as in the embodiment
of FIG. 1.
[0055] The straight leg prongs 34 are soldered to the frame 32 without the bent portions
so a gemstone may be set in the frame after the soldering has taken place. Since the
prongs 34 have solder on all sides, the prongs may be placed in the jig with any side
of the prong coming into contact with the frame 32, allowing quick and easy placement
of the components into the jig without having to determine which side of the prong
has solder disposed on it. After the retainer ring 36 and the prongs 34 are soldered
to the frame 32 as described above and illustrated in FIGS. 8-10, a stone is placed
on the retainer ring 36, and is self-centered, after which the prongs 34 are bent
inwardly to firmly grip the stone. The prongs may be bent to grip the stone by a modified
drill press such as the DP-30 Drill Press commercially available from The Foredom
Electric Company of Bethel, Connecticut. The resulting setting with gemstone in place
is similar to that shown in FIG. 6.
[0056] Referring to FIGS. 11 and 12, another embodiment of the jewelry setting of present
disclosure is illustrated. Here, the setting 40 includes a cylindrical frame 42 including
a sidewall 44 and a bottom or base 46 with an aperture, a retainer member 48 and two
prongs 50. Each prong 50 includes a generally rectangular portion 52 for mating with
the sidewall 44 and two prong members 54 for securely gripping a gemstone received
in the frame 42. The rectangular portion 52 will be curved to substantially correspond
to the curvature of sidewall 44 so when mated the rectangular portion 52 is in full
contact with sidewall 44 which in turn will form a stronger joint during the soldering
step. In FIG. 11, the prong members 54 include a bent portion 56 and will be utilized
with gemstones that can withstand the high temperatures of the soldering process.
It is to be appreciated the prongs 50 can be manufactured with straight prong members
54 wherein the prongs 50 will be soldered to the frame 42 without the gemstone in
place and, after the gemstone is received in the setting, the prong members 54 will
be bent inward to secure the gemstone. In either case, the resulting setting with
gemstone in place is illustrated in FIG. 12.
[0057] Turning to FIG. 13, a further embodiment of the subject setting 60 is designed to
accommodate square stones, and includes a square-shaped frame 62 and a plurality of
prongs 64. Each of the plurality of prongs 64 includes a bent portion 66. In assembling
the setting 60, a square stone is placed on the upper peripheral rim 68 of the frame
62 so as to be self-centered, after which the frame 62 and the prongs 64 are placed
in a suitable jig. The assembly is subjected to a high temperature for soldering the
prongs 64 to the frame 62. The assembly of the prongs 64 to the frame 62 is illustrated
in FIGS. 14-16.
[0058] In a further related embodiment, the prongs 70 are straight as illustrated in FIGS.
17-19. In this embodiment, a retainer member 72 is employed. Although shown as having
an inwardly down-sloping angle, the retainer member 72 may be flat for a stone with
a flat bottom so no portion of the gemstone is inside the frame and is therefore fully
exposed. In assembling the setting 60, the frame 62, prongs 70 and retainer member
72 are placed in a suitable jig, after which the assembly is subjected to a high temperature
for soldering the prongs 70 and retainer member 72 to the frame 62. Thereafter, a
square stone is placed on the upper peripheral rim 68 of the frame 62 where the retainer
member 72 sits so as to be self-centered and the prongs 70 are bent inwardly to grip
the stone by a suitable drill press as described above.
[0059] Turning to FIG. 20, a further embodiment of the subject setting 80 is designed to
be employed as an earring. The setting 80 includes a generally cylindrically shaped
frame 82, a plurality of prongs 88 and a retainer member 90. The frame 82 includes
a sidewall 84 and a spherical shaped bottom 86. Each of the plurality of prongs 88
includes a bent portion 92. The setting further includes a post 94 which will be soldered
to an underside of the bottom 86 of the frame 82. In assembling the setting 80, the
frame 82 and retainer member 90 are placed in a suitable jig, after which a stone
96 is placed on the upper peripheral rim of the retainer member 90 so as to be self-centered.
The prongs 88 are then placed in the jig, after which the assembly is subjected to
a high temperature for soldering the prongs 88 and retainer member 90 to the frame
82. Next, the post 94 is soldered to the frame 82. The assembly of the prongs 88 to
the frame 82 with stone in place is illustrated in FIG. 21.
[0060] FIGS. 22 and 23 illustrate another embodiment of the setting or finding of the present
disclosure, which embodiment is designated by the numeral 100.
[0061] Setting 100 is also designed to accommodate stones which are not capable of being
subjected to elevated soldering temperatures, with the setting 100 including a frame
102, retaining member or ring 104 and straight leg prongs 106, as well as a post 108.
As described above, the retainer member 104 and prongs 106 will be provided with a
layer of solder colored to match the color of the frame 102. The frame 102, retainer
member 104, prongs 106 and post 108 will be assembled in a suitable jig and subjected
to an elevated temperature to allow the solder to reflow and join the components together.
The assembled setting 100 is illustrated in FIG. 23.
[0062] After the setting 100 is assembled, a stone is placed on the frame 102, and then
the prongs 106 are bent radially inwardly to grip the stone as described above.
[0063] Turning to FIG. 24, a further embodiment of the subject setting 110 is illustrated.
The setting 110 includes a generally cylindrically shaped frame 112, a plurality of
prongs 114 and a retainer member 116. The frame 112 includes at least one sidewall
118 and a spherical shaped bottom 120. The sidewall 118 includes at least two cutouts
122 for exposing a bottom portion of the gemstone. In the illustrated non-limited
embodiment, the frame 112 has three cutouts resulting in three sidewalls 118. It is
to be appreciated the number of cutouts and sidewalls may vary based on the size and
shape of the gemstone.
[0064] The setting further includes a post 126 which will be soldered to an underside of
the bottom 120 of the frame 112.
[0065] In assembling the setting 110, the frame 112, prongs 114, retainer member 116 and
post 126 are placed in a suitable jig, after which the assembly is subjected to a
high temperature for soldering the prongs 114, retainer member 116 and post 126 to
the frame 112. After a gemstone is disposed on the retainer member 116, the prongs
114 will be bent by a suitable drill press at a portion of the prong above the girdle
of the gemstone to secure the gemstone in place. The assembly of the prongs 114 to
the frame 112 is illustrated in FIG. 25. In other embodiments, the assembly could
be made without the post 126 which could be soldered to the frame at a later time
by applying solder paste to one end of the post.
[0066] It is to be appreciated that the setting 110 may employ prongs with an upper bent
portion as described in the various embodiments above. In assembling the setting 110
with bent prongs, the frame 112, retainer member 116 and post 126 are placed in a
suitable jig, after which a stone 128 is placed on the upper peripheral rim of the
retainer member 116 so as to be self-centered. The prongs with upper bent portions
(not shown) are then placed in the jig, after which the assembly is subjected to a
high temperature for soldering the prongs, retainer member 116 and post 126 to the
frame 112. The assembly of the prongs to the frame 112 with stone in place is illustrated
in FIG. 25. As can be seen, whether straight prongs or bent prongs are used, the resulting
setting after gemstone placement is the same.
[0067] In all of the embodiments of the subject disclosure, the resulting finding ensures
maximum exposure of the stone including maximum exposure of the peripheral side edges
of the stone, as well as providing an inexpensive, but sturdy finding for griping
of the stone.
[0068] While the disclosure has been shown and described with reference to certain preferred
embodiments thereof, it will be understood by those skilled in the art that various
changes in form and detail may be made therein without departing from the spirit and
scope of the disclosure as defined by the appended claims.
1. A jewelry setting comprising:
a frame configured to receive a gemstone, the frame including a base and at least
one sidewall defining a cavity for receiving the gemstone; and
at least two prongs soldered to the at least one sidewall, wherein the at least two
prongs extend above an upper peripheral edge of the at least one sidewall for securing
the gemstone in the frame.
2. The jewelry setting as in claim 1, wherein the base of the frame includes at least
one aperture.
3. The jewelry setting as in claim 1, wherein the at least two prongs are bent inwardly
toward a center of the frame at a predetermined distance above the upper peripheral
edge of the at least one sidewall.
4. The jewelry setting as in claim 1, further comprising a retainer member configured
to center the received gemstone in the frame, the retainer member being disposed on
the upper peripheral edge of the at least one sidewall.
5. The jewelry setting as in claim 4, wherein the retainer member is flat.
6. The jewelry setting as in claim 4, wherein the retainer member is configured with
an inwardly down-sloping angle.
7. The jewelry setting as in claim 1, wherein each of the at least two prongs has a generally
square cross-section.
8. The jewelry setting as in claim 1, wherein each of the at least two prongs includes
a generally rectangular portion for mating with the at least one sidewall and two
prong members extending from the rectangular portion for gripping the received gemstone.
9. The jewelry setting as in claim 1, wherein the shape of the frame generally corresponds
to a shape of the gemstone.
10. The jewelry setting as in claim 4, wherein the shape of the retainer member generally
corresponds to a shape of the gemstone.
11. The jewelry setting as in claim 1, further comprising a post soldered to an underside
of the base of the frame.
12. The jewelry setting as in claim 1, wherein the at least one sidewall includes at least
one cutout for exposing a lower portion of the gemstone received by the frame.
13. The jewelry setting as in claim 12, further comprising a retainer member configured
to center the received gemstone, the retainer member being disposed on the upper peripheral
edge of the at least one sidewall.
14. A method for manufacturing a jewelry setting, the method comprising the steps:
providing a frame configured to receive a gemstone, the frame including a base and
at least one sidewall defining a cavity for receiving the gemstone;
providing at least two prongs, each of the at least two prongs includes a layer of
solder disposed thereon;
placing the at least two prongs in contact with the at least one sidewall of the frame;
and
heating the frame and the at least two prongs to a predetermined temperature, wherein
the solder will reflow and form a joint between each of the at least two prongs and
the at least one sidewall.
15. The method as in claim 14, further comprising the steps:
disposing a gemstone in the frame; and
bending an upper portion of each of the at least two prongs inwardly relative to the
frame to secure the gemstone in the frame.
16. The method as in claim 14, further comprising the steps:
before the heating step, providing a retainer member for centering the received gemstone,
the retainer member including a layer of solder disposed thereon and disposing the
retainer member on an upper peripheral edge of the at least one sidewall.
17. The method as in claim 16, further comprising the steps:
after the heating step, disposing a gemstone on the retainer member; and
bending an upper portion of each of the at least two prongs inwardly relative to the
frame to secure the gemstone in the frame.
18. The method as in claim 14, wherein the at least two prongs include an upper bent portion,
the placing step further comprising the step disposing a gemstone in the frame, the
upper bent portions contacting an upper portion of the gemstone and a lower portion
of the at least two prongs contacting the at least one sidewall of the frame.
19. The method as in claim 14, wherein the at least two prongs include an upper bent portion,
further comprising the steps:
providing a retainer member including a layer of solder;
disposing the retainer member on an upper peripheral edge of the at least one sidewall
of the frame;
disposing a gemstone on the retainer member; and
placing the upper bent portions in contact with an upper portion of the gemstone and
a lower portion of the at least two prongs in contact with the at least one sidewall
of the frame.
20. The method as in claim 16, further comprising the step providing a post including
a solder disposed on at least one end and placing the at least one end of the post
in contact with an underside of the base of the frame before the heating step.