(19)
(11) EP 2 202 056 A1

(12) EUROPEAN PATENT APPLICATION

(43) Date of publication:
30.06.2010 Bulletin 2010/26

(21) Application number: 08022366.2

(22) Date of filing: 23.12.2008
(51) International Patent Classification (IPC): 
B32B 3/02(2006.01)
B32B 19/04(2006.01)
B32B 27/12(2006.01)
E04F 15/14(2006.01)
B32B 19/02(2006.01)
B32B 27/04(2006.01)
E04F 15/10(2006.01)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR
Designated Extension States:
AL BA MK RS

(71) Applicant: Unilin Industries, BVBA
8710 Wielsbeke (BE)

(72) Inventor:
  • Segaert, Martin
    B-8900 Ieper (BE)

   


(54) Floor panel and methods for manufacturing floor panels


(57) Floor panel of the type comprising at least a substrate (2) and a top layer (3) provided on the substrate (2), wherein the substrate (2) substantially is composed of a composite material comprising at least two components, characterized in that, on the one hand, a first of said two components consists of mineral fibers and, on the other hand, a second of said two components acts as a binding agent for said first component.




Description


[0001] This invention relates to a floor panel and to methods for manufacturing panels, more particularly floor panels.

[0002] More particularly, the invention relates to floor panels of the type comprising at least a substrate and a top layer provided on the substrate, wherein the substrate substantially is composed of a composite material comprising at least two components, on the one hand, a first component, which is fiber-shaped, and, on the other hand, a second component acting as a binding agent for said first component.

[0003] Such floor panels as such are widely known, for example, from WO 97/47834, wherein a wood-based fiberboard is applied for the substrate, more particularly MDF or HDF (Medium Density Fiberboard or High Density Fiberboard), and for the top layer one or more paper layers provided on this substrate are applied. Traditionally, such fiberboard consists of pressed wood fibers, which are interconnected, for example, by means of melamine formaldehyde glue (MF) or melamine urea formaldehyde glue (MUF). However, these boards show the disadvantage that they are very sensitive to moisture penetration, as they are porous and as the wood fibers absorb moisture. The intake of moisture by the wood fibers leads to a swelling of the substrate first manifesting itself at the edges of the panels concerned. As a result thereof, accelerated wear of said top layer may occur at the location of the edges. Moreover, wood fiber promotes the growth of fungus and bacteria.

[0004] Moisture penetration also plays an important role in the production of such floor panels. Namely, when the semi-finished panels take up moisture at one or more of their edges, they may bend or warp in the plane, such that subsequent treatments of the edge are tolerance-sensitive. For example, when realizing profiled edge regions comprising, for example, coupling means, by means of milling tools, relatively much material must be removed in order to obtain straight panels again after the machining treatment. Due to this large material removal, it is possible that edge finishing, such as chamfers, which are provided before milling, will disappear over a portion of the edge concerned. Therefore, it is difficult, if not impossible, with the existing substrates to form chamfers at one or more edges of the floor panels prior to the milling process. It is noted that warping of panels poses a problem in particular with narrow panels having, for example, a width of less than 20 cm, and pose an even larger problem with panels having a width of less than 12 cm. It is clear that warped panels also lead to problems when interconnecting or installing them.

[0005] In order to restrict the effects of moisture penetration, it is known to apply other or more binding agents and/or to treat the wood fibers. For example, it is known from US 6,376,582 to apply for this purpose acetylated fibers and/or so-called MDI glue (methane diphenyl diisocyanate glue). Although with such components, the effects of moisture penetration can be limited indeed, this still is not sufficient, as the board has to be resistant against prolonged exposure to water, as may be the case in humid rooms, such as a bathroom, or outdoors.

[0006] The present invention relates to offering a floor panel or a panel with an alternative substrate, whereby preferably new possibilities can be offered for applications of such panels. According to preferred embodiments of the invention, it also aims at a panel with a substrate which is better resistant against moisture penetration than traditional MDF or HDF, and/or can offer a remedy for one or more disadvantages of the state of the art. To this aim, the invention according to its first aspect relates to a floor panel of the type comprising at least a substrate and a top layer provided on the substrate, wherein the substrate substantially is composed of a composite material comprising at least two components, with the characteristic that, on the one hand, a first of said two components consists of mineral fibers, and, on the other hand, a second of said two components acts as a binding agent for said first component.

[0007] Said mineral fibers show less absorption of water or other moisture than this is the case with wood fibers or other organic fibers. Hereby, the damaging consequences of moisture penetration in the substrate can be avoided to an important extent. Preferably, said composite material consists for at least 80 percent of said two components, such that the positive effect of the presence of mineral fibers can be maximized.

[0008] Preferably, for the first component a fiber is applied consisting for at least 20 weight percent of Si02, and preferably consists for at least 10 weight percent of Al2O3. Such fiber is excellently resistant against the occurrence of fungus or bacteria growth and hardly takes up moisture or water.

[0009] For the first component, a fiber can be applied which is spun from rock, such as volcanic rock. Such fiber is known as such because it is already applied, for example, in insulation wool, such as rockwool.

[0010] Preferably, for the second component a polycondensation glue is applied. Preferably, this relates to a thermo-hardening synthetic material and still better this synthetic material is chosen from the series of urea formaldehyde glue, melamine glue, melamine formaldehyde glue, methane diphenyl diisocyanate glue, phenol formaldehyde glue, resorcinol formaldehyde glue, resorcinol phenol formaldehyde glue and a mixture of one or more of the aforementioned glues. The inventors have found that thermo-hardening binding agents lead to obtaining a board which is easier to provide with a top layer. Namely, it is simpler to provide such board with a top layer by means of a press treatment under increased temperature, as such board is resistant against a higher temperature without losing strength to a considerable extent. This provides for that at an increased temperature, for example, of more than 150°C, it is still possible to apply reasonable pressures, for example, of more than 20 bars. A combination of more than 175°C with more than 40 bars is not excluded.

[0011] Preferably, for the first component a fiber is applied, which is covered with an agent promoting the adherence to the second component, such as silane.

[0012] Preferably, said substrate shows a density of more than 500 kg/m3, or even of more than 750 kg/m3. In such case, it is obtained that the substrate concerned also is sufficiently resistant against impact damages. Such substrate can be obtained by pressing the respective mineral fibers and the respective binding agent to a board in a similar manner as it is the case with MDF or HDF. Herein, prior to the press treatment, the fibers are provided with binding agent and strewn to form a mat, the thickness of which is at least 30 times larger than the thickness of the final board to be obtained. In a first step, during a so-called pre-pressing, this mat is de-aired, wherein also the thickness of the mat already is reduced to a certain extent. In a second, subsequent step, the mat then is increasingly pressed and heated until approximately the final thickness of the board remains. After possible cooling of the board, it may or may not be ground at one or both flat sides. The production process of the boards, in particular said press treatments, preferably is performed in a continuous manner. However, it is not excluded that one works with presses which open and close or so-called cycle presses. It is clear that by such production process preferably larger boards are obtained, from which, by dividing them, substrates for several final panels can be obtained. Such dividing may take place prior or subsequently to applying said top layer.

[0013] Preferably, said top layer shows a printed motif, such as a wood motif or a stone motif. For example, this motif depicts only one wooden plank, only one stone or tile, respectively, per panel.

[0014] A printed motif can have been obtained in a variety of possible manners.

[0015] According to a first possibility, the printed motif is applied on a material sheet taken up into said top layer. To this aim, for example, use can be made of a printing process by means of printing cylinders, which, for example, is performed on a paper web, wherein said material sheet then is obtained by dividing this paper web and subsequently is taken up into the top layer as a decor layer. For taking up the material sheet in the top layer, for example, use can be made of a process of the so-called DPL type (Direct Pressure Laminate), wherein at least the respective printed material sheet, whether or not provided with synthetic material, together with the substrate is brought into a press device, where they are commonly pressed under increased temperature. Possibly, in the same press treatment also a wear-resistant layer can be provided above the decor layer, wherein this wear-resistant layer, apart from hard particles, then preferably also comprises a material layer provided with resin, such as a paper layer. For performing a DPL process, it is advantageous when said substrate comprises a thermo-hardening synthetic material as a second component.

[0016] According to a second possibility, the printed motif is obtained at least partially by means of a print performed directly on the substrate, whether or not by the intermediary of primer layers. Directly performing a print on a substrate for forming panels showing a motif is known as such, for example, from US 1,971,067, US 3,173,804, US 3,554,827, US 3,811,915, WO 01/48333, WO 01/47724, US 2004/0026017, WO 2004/042168, EP 1 872 959 or DE 195 32 819 A1. However, it is not known to perform such technique on the particular substrates of the present invention. Prior to printing, one or more primer layers can be provided on the substrate, and/or one or more finishing layers can be provided above the print. Such finishing layers may comprise, for example, transparent or translucent layers of synthetic material forming a protective layer above the, whether or not printed, motif and may comprise, for example, wear-resistant particles, such as aluminum oxide. It is not excluded that this protective layer contains a material sheet, such as a paper sheet, which, for example, is provided with a synthetic material, such as amino resin. In principle, any printing technique can be applied for forming the print, such as a printing technique, wherein one or more printing cylinders are applied, or a digital printing technique, wherein one or more inkjet print heads are applied.

[0017] In the most preferred embodiment of the present invention, the floor panel is rectangular and, at least at two opposite edges, is provided with coupling means allowing that two of such floor panels can be connected to each other. For example, such coupling means substantially may be performed as a tongue in groove connection, which can effect a locking in a vertical direction perpendicular to the plane of the connected floor panels. Preferably, the coupling means also are provided with additional locking elements, by which also a locking can be obtained in a horizontal direction perpendicular to the connected edges and in the plane of the connected floor panels. Coupling means of the type allowing that between said floor panels a connection is obtained in a vertical direction perpendicular to the plane of the connected floor panels as well as in a horizontal direction perpendicular to the connected edges and in the plane of the connected floor panels, are known as such, for example, from WO 97/47834. However, it was not known that they could also be applied in floor panels with a substrate comprising mineral fibers. Preferably, said coupling means consist of profiles milled directly into the substrate. The inventors have found that a substrate which comprises mineral fibers most surprisingly can be milled with a high quality without an adaptation of the usual milling tools which are applied when processing wood fiberboard. Herein, competitive milling speeds can be obtained, even of more than 100 m/min or more than 150 m/min.

[0018] Preferably, the floor panel of the invention has a width of less than 20 cm and still better of less than 12 cm. From the preceding, it is clear that the floor panel of the invention has particular advantages in these embodiments. As the floor panel of the invention can be made less sensitive to moisture penetration, this floor panel in fact may show a lesser tendency to warping in its plane, such that the advantages, which may be created thereby, are not present or only present to a lesser extent. The length of the floor panels can vary between 40 cm and 140 cm. It is clear that the invention is not restricted to these dimensions. The floor panels also may be made longer, such as up to 250 cm, and/or wider, such as up to 35 cm.

[0019] Preferably, the floor panel of the invention has a chamfer at one or more edges. This can be realized in various possible manners. For example, the chamfer may be realized, according to a first possibility, by removing a material portion at the edge concerned, such as is known as such from EP 1 290 291. It is clear that exposing a portion of the substrate by this material removal at the edge does not induce particular problems in the floor panel of the invention as a result of possible moisture penetration. The obtained surface of the chamfer may or may not be provided with a separate covering. According to a second possibility, the chamfer can be realized by deforming the substrate and/or the upper surface of the panel, or the larger board from which the panel is obtained, for example, by means of a press treatment. In the floor panel of the invention, such impressed chamfer can be formed before further edge treatment, for example, by means of milling tools, is applied. The floor panel of the invention in fact can show a smaller risk of warping by moisture penetration, such that the risk that the already formed chamfer is removed by a subsequent milling process, for example, for forming at least a portion of the coupling means, can be minimized.

[0020] According to a second aspect, the invention further, in an independent manner, relates to a method for manufacturing covered panels, more particularly floor panels, wherein it is started from a basic board or a basic panel upon which a top layer with a printed motif is provided, wherein the method for forming the top layer comprises at least a step wherein, by means of a press treatment under increased temperature, a material sheet is provided on the substrate, with the characteristic that for said basic board or basic panel, a composite material is applied comprising at least two components, on the one hand, a first component consisting of mineral fibers, and, on the other hand, a second component consisting of a thermo-hardening polycondensation glue and acting as a binding agent for said first component. It is clear that this method can be applied for manufacturing the floor panels of the first aspect or the preferred embodiments thereof and that the method possibly can also show one or more of the following steps:
  • the step of forming a chamfer at one or more edges of the panel, preferably according to one of the possibilities therefor mentioned in the first aspect;
  • the step of realizing profiled edge regions at least at two opposite edges and still better at all opposite edges thereof, wherein these profiled edge regions show coupling means, preferably with the characteristics of the possibilities therefor discussed in the first aspect.


[0021] The inventors have found that the composite material of the invention is excellently suitable for applying thereon a top layer by means of a press treatment and heat. This suitability can be explained, on the one hand, in that the presence of thermo-hardening material as a binding agent minimizes a possible softening of the substrate, and, on the other hand, in that the composite material can be provided with an almost smooth surface, as a consequence of which possible unevennesses hardly exert an influence on the quality of the provided top layer.

[0022] According to a third aspect, the invention further independently relates to a method for manufacturing panels, more particularly floor panels, of the type comprising at least a substrate and a top layer provided on the substrate, wherein these panels are rectangular and profiled edge regions are formed at least at two opposite edges, wherein the method for forming said profiled edge regions comprises at least a step wherein the substrate is processed at the edges concerned by means of a milling process, with the characteristic that for said basic board or basic panel, a composite material is applied comprising at least two components, on the one hand, a first component consisting of mineral fibers, and, on the other hand, a second component consisting of a polycondensation glue and acting as a binding agent for said first component. It is clear that this method can be applied for forming the floor panels of the first aspect or the preferred embodiments thereof and that the method possibly can comprise still one or more of the following steps:
  • the step of forming a chamfer at one or more edges of the panel, preferably according to any of the possibilities therefor mentioned in the first aspect;
  • the step of the previous paragraph, wherein said milling process is applied for forming said chamfer;
  • the step of realizing profiled edge regions at least at two opposite edges and still better at all opposite edges thereof, wherein these profiled edge regions show coupling means, preferably with the characteristics of the possibilities therefor discussed in the first aspect;
  • the step of the previous paragraph, wherein said milling process is applied for forming at least a portion of the coupling means;
  • one or more steps of the method of the second aspect and/or the preferred embodiments thereof.


[0023] From the above, the advantages of a method with the characteristics of the third aspect are clear.

[0024] With the intention of better showing the characteristics of the invention, hereafter, as an example without any limitative character, several preferred embodiments are described, with reference to the accompanying drawings, wherein:

Figure 1 represents a floor panel according to the invention;

Figure 2, at a larger scale, represents a cross-section according to the line II-II represented in figure 1;

Figure 3 represents a step in a method according to the invention;

Figure 4, in a view similar to that of figure 1, represents a variant;

Figure 5, at a larger scale, represents a cross-section according to the line IV-IV represented in figure 4; and

Figures 6 and 7, in a similar view as that of figure 5, represent variants.



[0025] Figure 1 represents an oblong and rectangular floor panel 1, which, as becomes clear from figure 2, is of the type comprising a substrate 2 and a top layer 3 provided on the substrate 2. The top layer 3 shows a wood motif, the nerves 4 of which extend in the longitudinal direction of the floor panel 1. The floor panel 1 forms an imitation of a single wood part or wooden plank. Of course, it is not excluded that the floor panel 1 should imitate several wood parts, as may be the case with the design of a so-called two- or three-plank.

[0026] The floor panel 1, at the pair of long opposite edges 5-6 as well as at the pair of short opposite edges 7-8, is provided with coupling means allowing that two of such floor panels 1 can be connected to each other, either in a vertical direction V1 or in a horizontal direction H1 or in both directions V1 and H1, as it is the case here at both pairs of edges 5-6 and 7-8. To this aim, each time two opposite edges 5-6-7-8 are provided with coupling means 9 substantially having the form of a tongue 10 and a groove 11, wherein this tongue 10 and groove 11, in coupled condition of two of such floor panels 1, realize a locking or connection in vertical direction V1. Said coupling means 9 are also provided with locking elements 12, wherein these locking elements 12 in coupled condition of two of such floor panels 1 realize a locking or connection in horizontal direction H1. As aforementioned, the represented coupling means 9 can be realized as profiles directly milled into the substrate 2.

[0027] Figure 2 represents that the coupling means 9 and locking elements 12 of the example allow that two of such floor panels 1 can be coupled at their edges at choice by means of a turning movement W around the edge 5-6 concerned or by a horizontal shifting movement T of the floor panels 1 towards each other. Of course, the invention is not restricted to this kind of coupling means 9 and locking elements 12. It is also possible to apply coupling means 9 allowing that two of such floor panels 1 can be coupled only in one of the above-mentioned manners or allowing that two of such floor panels 1 can also be coupled to each other in still another manner, for example, by means of a substantially downward movement. For examples of floor panels 1 which can be connected at their edges 5-6 and/or 7-8 by means of a substantially downward movement, reference is made to DE 20 2008 008597 U1.

[0028] The particularity of the floor panel 1 from figures 1 and 2 is that this panel 1 comprises a substrate 2 which substantially is composed of a composite material comprising at least two components, amongst which a first component consisting of mineral fibers. In this case, this relates to a substrate 2 in which the mineral fibers are distributed homogenously or at least quasi-homogenously. Figure 2 clearly shows that the coupling means 9 can be made in one piece with this substrate 2 and that on this substrate 2, a top layer 3 consisting of one or more material layers 13 can be provided, wherein this top layer 3 represents a motif, in this case, a wood motif. As mentioned in the introduction, the floor panel 1 of the invention can be provided with lowered edges or chamfers 14 at one or more edges 5-6-7-8. Such chamfers 14 are represented in figure 2 in dashed line and here show the form of bevels. It is noted that the quality of a chamfer surface of the substrate 2, said surface possibly being obtained by milling, allows covering this surface with a separate decorative layer consisting of a transfer film. Other decorative layers, such as lacquer or ink layers, are not excluded, either.

[0029] Figure 3 represents that for manufacturing the floor panels 1 of figure 1 or 2, it may be started from larger basic boards 15, which, in a press device 16, are provided with a top layer 3 and possibly an underlay 17. Herein, the basic board 15 concerned, which as such substantially is constructed of a composite material comprising at least two components, amongst which a component consisting of mineral fibers, is brought, together with the material layers 13 to be provided thereon and/or there below, between a lower press plate 18 and upper press plate 19, where they will be connected to each other under the influence of increased temperature and pressure. In this case, at the upper side of the basic board 15 a top layer 3 is formed on the basis of a decor paper 21 provided with resin 20, which forms a decor layer 22, and a paper layer 23 provided with resin 20, which extends as a protective layer 24 above the decor layer 22. On the decor paper 21, a motif is provided by means of a print 25, for example, performed by means of printing cylinders. At the underside, as a balancing layer or backing layer 17, also a paper layer 23 provided with resin 20 is provided, which compensates possibly created residual tensions in the top layer 3 and/or the substrate 2.

[0030] As represented in figure 3, it is possible that by means of the upper press plate 19 simultaneously a structure is provided in the top layer 3. This structure possibly can be realized corresponding to the motif of the decor paper 21. It is also possible that this structure comprises impressions for imitating chamfers, joints or bevels, which are present at one or more edges 5-6-7-8 of the final floor panels 1.

[0031] In the top layer 3, either in the protective layer 24 or in the decor layer 22 or in both, further also hard particles can be present imparting a certain wear resistance to the floor panel 1. As a result, ceramic particles, such as aluminum oxide granules, with an average grain size of less than 200 µm can be applied. Such particles are not represented here. For examples of top layers with hard particles and possibilities for manufacturing panels with such top layers, reference is made to WO 2007/144718.

[0032] It is clear that the final floor panels 1 or semi-finished products for manufacturing such floor panels 1 then can be obtained at least by subdivision from the larger basic boards 15. Further, it is clear that other covered panels than floor panels 1 can be obtained in a similar manner. Examples of such other covered panels are furniture panels, ceiling panels, wall panels and the like.

[0033] Figure 4 represents a variant wherein the mineral fibers are concentrated in the material zones 26 situated at one or more edges 5-6-7-8 of the final floor panels 1, whereas the remaining material of the substrate 2 is composed differently, for example, shows the usual composition of a MDF or HDF board. It is clear that the presence of the mineral fibers on the edges 5-6-7-8 of the floor panel 1 is advantageous, for example, for counteracting the effects of moisture penetration. In fact, at the flat bottom side and top side of such floor panels 1, already a vapour-tight layer can be present in the form of a laminate layer or top layer 3 on the basis of one or more material layers 13 containing amino resin. Thus, with the embodiment of figure 4 a practically entirely waterproof floor panel 1 can be obtained, whereas the cost price thereof is limited. It is noted that according to the invention, this is also possible vice versa, namely, that the mineral fibers are concentrated in the bulk of the final floor panel 1.

[0034] Figure 5 shows that the material zone 26 comprising the material fibers preferably extends so deep in the substrate 2 that the entire coupling means 9 can be formed therein.

[0035] Figure 6 represents a variant, wherein the mineral fibers are situated in a material zone 26 which, in the final floor panel 1, concentrates at one or more upper edges 27 of the floor panel 1. As the upper edges 27 are the most sensitive for the effects of possible moisture penetration, a considerable improvement may already be obtained with the embodiment of figure 6.

[0036] Figure 7 in its turn represents a variant wherein the mineral fibers are situated in a material zone 26 which, in the final floor panel 1, concentrates at the height of the actual coupling means 9, in other words, at the height of the aforementioned tongue 10 and groove 11. Such embodiment may be combined, for example, with a separate sealing of the upper edges, said sealing preferably being simple to apply, in order to obtain a good result. Such separate sealing is not represented here, however, may consist, for example, of a hardened substance. For examples of such substances and possibilities for applying them thereon, reference is made to WO 2008/078181 and WO 2007/113676.

[0037] According to a not represented variant, it is possible that the mineral fibers are concentrated in a material zone 26 extending in layers over substantially the entire substrate 2. When this layer extends, for example, close enough to the surface of the substrate 2, a similar embodiment as that from figure 6 can be obtained in a simple manner, namely, wherein the mineral fibers are concentrated at least at the upper edges 26 of the panels 1.

[0038] It is clear that the method represented in figure 3 also forms an example of said second aspect and that the floor panels represented in all figures can be obtained by means of a method conform to the second and/or the third aspect of the invention. Herein, it is noted that the profiled edge regions, which are mentioned, amongst others, in the third aspect, in the examples correspond to those regions of the edge where, amongst others, said coupling means 9 are situated.

[0039] The present invention is in no way limited to the above-described embodiments, however, such floor panels and methods can be realized according to various variants, without leaving the scope of the present invention.


Claims

1. Floor panel of the type comprising at least a substrate (2) and a top layer (3) provided on the substrate (2), wherein the substrate (2) substantially is composed of a composite material comprising at least two components, characterized in that, on the one hand, a first of said two components consists of mineral fibers and, on the other hand, a second of said two components acts as a binding agent for said first component.
 
2. Floor panel according to claim 1, characterized in that a polycondensation glue is applied for the second component.
 
3. Floor panel according to claim 2, characterized in that for the second component a thermo-hardening synthetic material is applied, such as a synthetic material selected from the series of urea formaldehyde glue, melamine glue, melamine formaldehyde glue, methane diphenyl diisocyanate glue, phenol formaldehyde glue, resorcinol formaldehyde glue and resorcinol phenol formaldehyde glue.
 
4. Floor panel according to any of the preceding claims, characterized in that for the first component, a fiber is applied which is spun from a volcanic rock.
 
5. Floor panel according to any of the preceding claims, characterized in that for the first component, a fiber is applied consisting for at least 20 weight percent of Si02, and preferably at least 10 weight percent A1203.
 
6. Floor panel according to any of the preceding claims, characterized in that for the first component, a fiber is applied which is covered with an agent promoting the adherence to the second component.
 
7. Floor panel according to any of the preceding claims, characterized in that said substrate (2) has a density of more than 500kg/m3.
 
8. Floor panel according to any of the claims 1 to 8, characterized in that said top layer (3) shows a printed motif.
 
9. Floor panel according to claim 8, characterized in that the printed motif is provided on a material sheet (23) which is taken up in said top layer (3).
 
10. Floor panel according to claim 8, characterized in that the printed pattern is obtained at least partially by means of a print (25) performed directly on the substrate (2), whether or not by the intermediary of primer layers.
 
11. Floor panel according to any of the preceding claims, characterized in that the floor panel (1) is rectangular and, at least at two opposite edges (5-6), is provided with coupling means (9) allowing that two of such floor panels. (1) can be connected to each other.
 
12. Floor panel according to claim 11, characterized in that said coupling means (9) are of the type allowing that among said two floor panels (1) a connection is obtained in a vertical direction (V1) perpendicular to the plane of the connected floor panels (1), as well as in a horizontal direction (H1) perpendicular to the connected edges (5-6) and in the plane of the connected floor panels (1).
 
13. Floor panel according to claim 11 or 12, characterized in that said coupling means (9) consist of profiles milled directly into the substrate (2).
 
14. Method for manufacturing covered panels, more particularly floor panels (1), wherein it is started from a basic board or a basic panel upon which a top layer (3) with a printed motif is provided, wherein the method for forming the top layer (3) comprises at least a step wherein, by means of a press treatment under increased temperature, a material sheet (23) is provided on the substrate (2), characterized in that for said basic board or basic panel, a composite material is applied comprising at least two components, on the one hand, a first component consisting of mineral fibers and, on the other hand, a second component consisting of a thermo-hardening polycondensation glue and acting as a binding agent for said first component.
 
15. Method for manufacturing panels, more particularly floor panels (1), of the type comprising at least a substrate (2) and a top layer (3) provided on the substrate (2), wherein these panels (1) are rectangular and profiled edge regions are formed at least at two opposite edges (5-6), wherein the method for forming said profiled edge regions comprises at least a step wherein the substrate (2) is processed at the edges (5-6) concerned by means of a milling process, characterized in that for said basic board or basic panel, a composite material is applied comprising at least two components, on the one hand, a first component consisting of mineral fibers and, on the other hand, a second component consisting of a polycondensation glue and acting as a binding agent for said first component.
 




Drawing










Search report
















Cited references

REFERENCES CITED IN THE DESCRIPTION



This list of references cited by the applicant is for the reader's convenience only. It does not form part of the European patent document. Even though great care has been taken in compiling the references, errors or omissions cannot be excluded and the EPO disclaims all liability in this regard.

Patent documents cited in the description