| (19) |
 |
|
(11) |
EP 1 777 741 A3 |
| (12) |
EUROPEAN PATENT APPLICATION |
| (88) |
Date of publication A3: |
|
01.09.2010 Bulletin 2010/35 |
| (43) |
Date of publication A2: |
|
25.04.2007 Bulletin 2007/17 |
| (22) |
Date of filing: 05.10.2006 |
|
| (51) |
International Patent Classification (IPC):
|
|
| (84) |
Designated Contracting States: |
|
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE
SI SK TR |
|
Designated Extension States: |
|
AL BA HR MK RS |
| (30) |
Priority: |
19.10.2005 US 253858
|
| (71) |
Applicant: Delphi Technologies, Inc. |
|
Troy, Michigan 48007 (US) |
|
| (72) |
Inventors: |
|
- Taylor, Ralph S.
Noblesville, IN 46060 (US)
- Degenkolb, Thomas A.
Noblesville, IN 46060 (US)
- Rasmussen, Loren H.
Kokomo, IN 46901 (US)
|
| (74) |
Representative: Denton, Michael John et al |
|
Delphi France SAS
64 Avenue de la Plaine de France
ZAC Paris Nord II
B.P. 65059, Tremblay en France
95972 Roissy Charles de Gaulle Cedex
95972 Roissy Charles de Gaulle Cedex (FR) |
|
| |
|
| (54) |
Electronics assembly and electronics package carrier therefor |
(57) An electronics assembly (10) is provided having a carrier (30) that provides a controlled
height variability between electronics packages (50) and a heat sink device (12).
The electronics assembly (10) includes a substrate (20) and electronics packages (50)
connected to the substrate (20). The assembly (10) also includes a heat sink device
(12) positioned in thermal communication with a first side of the electronics packages
(50). The assembly (10) further includes a carrier (30) disposed between the substrate
(20) and the heat sink device (12). The carrier (30) has a resilient wall (42) that
biases the electronics packages (50) towards the heat sink device (12) such that a
controlled bond line is provided between the first side of the electronics packages
(50) and the heat sink device (12).