TECHNICAL FIELD
[0001] The present invention relates to a heat-receiving member and an exhaust pipe heat-releasing
system.
BACKGROUND ART
[0002] An exhaust pipe connected to a vehicle engine becomes significantly hot in driving
operation because combustion gases (exhaust gases) flow therethrough. In a high-load
and high-revolution area of the engine, fuel is increased so as to avoid a rise in
temperature of exhaust gases. In such a case, however, a problem arises that the fuel
efficiency is lowered and the concentration of exhaust gases is raised, so that the
discharge amount of contaminants is increased.
Further, when the temperature of the exhaust pipe is raised by a flow of exhaust gases,
it causes heat degradation of the exhaust pipe.
[0003] Inside an exhaust pipe, a catalyst is provided for converting exhaust gases discharged
from a vehicle engine. For example, a three-way catalyst can convert contaminants
such as hydrocarbon (HC), carbon monoxide (CO), and nitrogen oxide (NOx) which are
contained in exhaust gases.
In order to convert these contaminants by a three-way catalyst more efficiently, it
is necessary to maintain the three-way catalyst at a predetermined activation temperature.
[0004] However, in a high-speed operation of a vehicle engine, exhaust gases become very
hot and there may be a case where the temperature of a three-way catalyst becomes
out of the effective range for conversion of exhaust gases and the three-way catalyst
fails to convert contaminants properly. Moreover, there may be a case where the three-way
catalyst is thermally deteriorated due to high-temperature exhaust gases.
[0005] Accordingly, it is desirable that, in the high-speed operation of the vehicle engine,
the temperature of the exhaust pipe connected to a vehicle engine not rise too high
and the exhaust pipe be appropriately cooled.
Patent Document 1 discloses a heat insulator that can appropriately cool an exhaust
pipe connected to a vehicle engine.
[0006] Patent Document 1:
JP-A 6-336923
DE 42 06 247 discloses an exhaust pipe for an internal combustion engine. It is described that
a housing for a water-cooling is provided with an anodized oxide layer as a corrosion
protection.
JP 58-19654 describes the formation of a selective absorber film for solar energy wherein pores
are formed by anodic oxidation of aluminum and that metal is precipitated in the pores
fully and uniformly by electrolytic coloring treatment.
DISCLOSURE OF THE INVENTION
PROBLEMS TO BE SOLVED BY THE INVENTION
[0007] Fig. 1 is an exploded perspective view which illustrates a vehicle engine and a vicinity
of an exhaust pipe connected to the vehicle engine.
In Fig. 1, "110" indicates an engine and a cylinder head 117 is mounted on a top of
a cylinder block 116 of the vehicle engine 110. Further, an exhaust manifold 111,
which contains cast iron with high heat resistance, is attached on one side face of
the cylinder head 117.
[0008] The exhaust manifold 111 has a function of gathering exhaust gases from respective
cylinders and transferring the exhaust gases to a not-shown catalyst converter and
the like. That is, the exhaust manifold 111 functions as an exhaust pipe through which
exhaust gases from the engine flow.
Part of the outer peripheral face of the exhaust manifold 111 is covered with a heat
insulator 118. The heat insulator 118 is arranged over the outer peripheral face of
the exhaust manifold 111 with a predetermined space therebetween.
[0009] Patent Document 1 sets the emissivity of the heat insulator to be more than the emissivity
of the exhaust manifold. Patent Document 1 describes that setting the relationships
of the emissivities as such increases the amount of radiation heat transferred between
the exhaust manifold and the heat insulator, and thus improves the cooling ability
of the exhaust manifold.
[0010] Patent Document 1 also describes that a black, heat-resistant coating is applied
to the heat insulator that is made of cast iron so as to improve the emissivity of
the heat insulator.
[0011] Recently, aluminum or an aluminum alloy (hereinafter referred also to simply as aluminum)
has often been used as a material for a heat insulator in order to reduce the vehicle
body weight, and the like.
However, when a heat insulator made of aluminum is arranged so as to cover the peripheries
of an exhaust manifold, the amount of heat for the heat insulator to receive from
an exhaust pipe by radiation heat transfer is not so large because aluminum is a material
with low emissivity.
Hence, there has been a problem in which the temperature of the exhaust pipe, when
aluminum is used as a material for a heat insulator, cannot be decreased by radiation
heat transfer and therefore the temperature of the exhaust pipe rises too high.
[0012] In view of such a problem, the inventors of the present invention studied a method
of applying to aluminum a black, heat-resistant coating which is similar to the coating
disclosed in Patent Document 1 so as to increase the emissivity of aluminum. However,
sufficient adhesion was not obtained between aluminum and the heat-resistant coating,
and the heat-resistant coating peeled off from aluminum. Thus, the inventors were
not able to increase the emissivity of aluminum by this method.
[0013] The present invention was made in view of the above problem, and an object thereof
is to provide a heat-receiving member which demonstrates excellent performance in
receiving,
by radiation heat transfer, heat energy that is released from a heat source such as
an exhaust pipe; and an exhaust pipe heat-releasing system that can prevent the temperature
of the exhaust pipe from rising too high.
MEANS FOR SOLVING THE PROBLEMS
[0014] That is, a heat-receiving member according to claim 1 receives heat energy released
from an internal combustion engine, and comprises: a base that contains aluminum or
an aluminum alloy; and a surface layer that is formed by anodizing a surface of the
base, and a plurality of crocks formed in the surface layer.
[0015] The heat-receiving member according to claim 1 has the surface layer formed by anodizing
the surface of the base that contains aluminum or an aluminum alloy.
The emissivity of the surface layer formed by anodizing the surface of aluminum is
higher than the emissivity of aluminum. High emissivity of the surface of the surface
layer allows the surface layer to receive by radiation heat transfer a large amount
of heat released from the heat source, when the heat-receiving member of the present
invention is arranged with the surface layer thereof facing the heat source such as
an exhaust pipe. That is, the heat-receiving member of the present invention is excellent
at receiving, by radiation heat transfer, heat released from a heat source. Further,
use of such a heat-receiving member makes it possible to promote heat release from
the heat source.
The interface between aluminum and a surface layer formed by anodization is chemically
stable and the adhesion between aluminum and the surface layer is strong. Therefore,
the surface layer does not peel off from aluminum.
[0016] In the heat-receiving member according to claim 2, the heat-receiving member has
a first region and a second region, the first region is located farther from a high-temperature
part of the heat source than the second region, and the first region has emissivity
higher than emissivity of the second region.
The first region herein also means a region far from the high-temperature part of
the heat source. The second region herein means another region or a region close to
the high-temperature part of the heat source.
Now, the variation of temperature distribution inside the heat-receiving member adjacent
to the heat source is considered. With regard to the temperatures of respective regions
in the heat-receiving member, much heat is transferred to the region close to the
high-temperature part of the heat source, and thus the temperature of the region tends
to rise. On the other hand, not much heat is transferred to the region far from the
high-temperature part of the heat source, and thus the temperature of the region tends
not to rise. As a result, a high-temperature region and a low-temperature region generate
inside the heat-receiving member. This temperature difference inside the heat-receiving
member leads to generation of thermal stress in the heat-receiving member, which might
distort the heat-receiving member.
[0017] The region having higher emissivity than the another region in the heat-receiving
member according to claim 2 receives a large amount of heat per unit area because
the region easily receives heat by radiation heat transfer. The region having higher
emissivity than the another region is thus a region in which the temperature tends
to rise due to heat reception. Accordingly, placing the region having higher emissivity
than the another region at a location far from the high-temperature part of the adjacent
heat source makes it more likely for the temperature of the heat-receiving member
to rise even if the region is located far from the high-temperature part of the heat
source; hence, generation of a low-temperature region inside the heat-receiving member
can be prevented.
That is, generation of a temperature difference inside the heat-receiving member can
be prevented. Further, generation of thermal stress and distortion in the heat-receiving
member can be prevented.
[0018] In the heat-receiving member according to claim 3, a micropore is formed in the surface
layer in the first region, and a metal is deposited in the micropore.
Deposition of a metal in the micropore in the surface layer makes it possible to increase
the emissivity of the region. That is, placing the region with a metal deposited in
the micropore formed in the surface layer thereof at a location far from the high-temperature
part of the heat source makes it possible to more effectively prevent generation of
a low-temperature region inside the heat-receiving member.
[0019] In the heat-receiving member according to claim 4, the second region includes a region
in which the surface of the base is unanodized and exposed.
In this case, the emissivity of the region with the surface of the base exposed thereon
is low. Placing the region with the surface of the base exposed thereon at a location
close to the high-temperature part of the heat source makes it possible to prevent
the temperature of the heat-receiving member from rising too high even if the region
is located close to the high-temperature part of the heat source; hence, generation
of a high-temperature region inside the heat-receiving member can be prevented. That
is, generation of a temperature difference inside the heat-receiving member can be
prevented.
[0020] In the heat-receiving member according to claim 1, a plurality of cracks are formed
in the surface layer.
Here, a coefficient of thermal expansion of the surface layer formed by anodization
is different from a coefficient of thermal expansion of aluminum or an aluminum alloy
used as the base. Thus, a rise in the temperature of the heat-receiving member leads
to application of thermal stress between the base and the surface layer. When the
thermal stress applied between the base and the surface layer is large or the thickness
of the base is small, a fissure might be generated in the base (the base might split).
[0021] Since the plurality of cracks are formed in the surface layer of the heat-receiving
member according to claim 1, part of the thermal stress applied between the base and
the surface layer is absorbed at the cracked parts, whereby an increase in the thermal
stress applied between the base and the surface layer is prevented. As a result, generation
of a fissure in the base due to the thermal stress can be prevented.
[0022] In the heat-receiving member according to claim 5, the cracks are separated from
each other.
The cracks separated from each other absorb the thermal stress and grow upon application
of the thermal stress to the surface layer. As a result, generation of a fissure in
the base is effectively prevented. Further, the continuous surface layer increases
the rigidity and thus makes it easier for the heat-receiving member to maintain the
shape.
[0023] In the heat-receiving member according to claim 1, at least one of the cracks has
a zigzag shape.
When the cracks each have a zigzag shape, resistance to the force applied in a direction
parallel to the cracks is generated. Hence, generation of a fissure in the base can
be more effectively prevented.
[0024] In the heat-receiving member according to claim 6, a surface layer is also formed
on a surface on the reverse side of the surface of the base.
In this case, surface layers are formed by anodizing both respective surfaces of the
heat-receiving member, and therefore the emissivity of the both surfaces of the heat-receiving
member becomes high. Then, the heat-receiving member can receive much heat on one
surface and release much heat from the other surface. Accordingly, the temperature
of the heat-receiving member tends not to rise, whereby the thermal stress to be generated
in the heat-receiving member can be reduced.
The lower the temperature of the heat-receiving member, the larger the amount of heat
that the heat-receiving member can receive. For this reason, the temperature of the
heat-receiving member is prevented from easily rising even when the heat-receiving
member has received heat, and thus the heat-receiving member of the present invention
can demonstrate better performance in receiving heat by radiation heat transfer.
[0025] An exhaust pipe heat-releasing system according to claim 7 comprises: an exhaust
pipe including a cylindrical base that contains a metal; and a heat-receiving member
arranged over the exhaust pipe, the heat-receiving member being a heat-receiving member
according to any one of claims 1 to 6.
The heat-receiving member of the present invention demonstrates excellent performance
in receiving heat by radiation heat transfer. Hence, such a heat-receiving member
arranged over the exhaust pipe can receive much radiation heat from the outer peripheral
face of the exhaust pipe when the temperature of the exhaust pipe is increased by
high-temperature exhaust gasses flowing through the exhaust pipe. Therefore, it is
possible to prevent the temperature of the exhaust pipe from rising too high.
[0026] The exhaust pipe heat-releasing system according to claim 7 is provided with a surface-coating
layer that is formed on the outer peripheral face of the base included in the exhaust
pipe, and that contains a crystalline inorganic material and an amorphous binder.
Since provision of the surface-coating layer that contains a crystalline inorganic
material and an amorphous binder leads to an increase in the emissivity of the outer
peripheral face of the exhaust pipe, the amount of radiation heat from the outer peripheral
face of the exhaust pipe is increased. The radiation heat from the outer peripheral
face of the exhaust pipe is received by the heat-receiving member of the present invention
which demonstrates excellent performance in receiving heat.
That is, improvement in the amount of radiation heat from the outer peripheral face
of the exhaust pipe is combined with improvement in the amount of heat received by
the heat-receiving member. As a result, it is possible to more effectively prevent
the temperature of the exhaust pipe from rising too high.
[0027] In the exhaust pipe heat-releasing system according to claim 8, the exhaust pipe
has an emissivity of 0.78 or more. The emissivity falling in such a range leads to
improvement in the amount of radiation heat from the outer peripheral face of the
exhaust pipe, thereby even more effectively preventing the temperature of the exhaust
pipe from rising too high.
BEST MODE FOR CARRYING OUT THE INVENTION
(First Embodiment, not as such claimed)
[0028] Hereinafter, a first embodiment, which is one embodiment of a heat-receiving member
and an exhaust pipe heat-releasing system, illustrative for aspects of the present
invention but not claimed as such, is described with reference to drawings.
First, the heat-receiving member is described.
Fig. 2 is a cross-sectional view schematically illustrating an exemplary heat-receiving
member.
A heat-receiving member 1 illustrated in Fig. 2 includes a base 20 that contains aluminum
or an aluminum alloy, and a surface layer 30 formed by anodizing the surface of the
base 20.
[0029] The surface layer formed by anodizing the base has emissivity higher than the emissivity
of aluminum. The emissivity (infrared emissivity) at a wavelength of 3 to 30 µm is,
for example, 0.7 or more. The infrared emissivity can be measured by a radiometer
(for example, an AERD produced by Kyoto Electronics Manufacturing Co., Ltd.).
[0030] The kind of aluminum or an aluminum alloy to be used as the base is not particularly
limited so long as it can be anodized. For example, pure aluminum (1000 series), Al-Cu-Mg
alloys (2000 series), Al-Mn alloys (3000 series), Al-Si alloys (4000 series), Al-Mg
alloys (5000 series), Al-Mg-Si alloys (6000 series), Al-Zn-Mg alloys (7000 series),
or the like can be used.
[0031] The shape of the base is not particularly limited, and can be, for example, a plate
such as a flat plate, a curved plate, and a flexed plate. The shape can be set to
any shape according to the shape of the place in which the heat-receiving member is
to be used. The base may be formed by laminating a plurality of bases.
Further, the thickness of the base is not particularly limited either, and can be
set to any thickness according to the amount of heat to be received by the heat-receiving
member and the expected operating temperature of the heat-receiving member.
In the case where a heat-receiving member is to be provided in the exhaust pipe heat-releasing
system of the present invention, the thickness of the base to be used in production
of the heat-receiving member is desirably from 0.1 to 1.5 mm, more desirably from
0.3 to 1.0 mm, and even more desirably from 0.4 to 0.8 mm.
A thickness of less than 0.1 mm of the base may lead to insufficient strength. On
the other hand, a thickness of more than 1.5 mm may lead to application of large compressive
strain and large tensile strain to the surface layer upon deformation of the base.
In the case where the base is formed by laminating a plurality of bases, the thickness
of the base is the sum of thicknesses of the laminated bases.
[0032] The thickness of the base is different before and after the anodization. Suppose
that the surface of the base is taken as the reference position. When an oxide film
with a thickness of ΔZ is formed on the upper side of the reference position by anodization,
an oxide film with a thickness of ΔZ is to be simultaneously formed on the under side
of the reference position by anodization, and thus the thickness of the base is to
be decreased by Δ Z.
Accordingly, the thickness of the base used in production of the heat-receiving member
can be presumed to be a thickness (ΔZ + T). The thickness (ΔZ + T) is obtained by
measuring the thickness (2 × ΔZ) of the surface layer and the thickness (T) of the
base in the heat-receiving member after the anodization, and by adding a half of the
thickness of the surface layer, which is (ΔZ), to the measured thickness (T) of the
base.
[0033] The surface layer is formed by anodizing the base, that is, by passing an electric
current through an electrolytic bath with the base serving as the anode.
In the case of anodizing only one surface of the base, it is desirable that a masking
tape or the like be put on the surface not to be anodized, for protection.
The thickness of the surface layer is desirably from 5 to 25 µm.
A thickness of less than 5 µm of the surface layer may decrease the emissivity. On
the other hand, a thickness of more than 25 µm of the surface layer may increase the
rigidity of the surface layer and thus increase the thermal stress applied to the
adjacent base, thereby tending to generate a fissure in the base. Also, a thickness
of more than 25 µm of the surface layer makes it difficult to perform electrolytic
coloring. Further, a thickness of more than 25 µm of the surface layer is inefficient
because it requires a longer time for anodization but does not lead to achievement
of much effect of improving the emissivity.
The thickness of the base and the thickness of the surface layer can be measured by
observing the cross-section of the heat-receiving member with a SEM or the like.
[0034] The electrolytic bath includes an acidic bath, an alkaline bath, and a bath of a
non-aqueous solution such as a formamide series and a boric acid series. The acidic
bath includes a bath of an aqueous solution in which one kind or two kinds or more
of the following is/are dissolved: sulfuric acid, phosphoric acid, chromic acid, oxalic
acid, sulfosalicylic acid, pyrophoric acid, sulfamic acid, phosphomolybdic acid, boric
acid, malonic acid, succinic acid, maleic acid, citrate, tartaric acid, phthalic acid,
itaconic acid, malic acid, glycolic acid, and the like.
The alkaline bath includes a bath of an aqueous solution in which one kind or two
kinds or more of the following is/are dissolved: sodium hydroxide, potassium hydroxide,
sodium carbonate, potassium phosphate, ammonia water, and the like.
[0035] The current waveform at the time of electrolysis includes waveforms of direct current
(DC), alternate current (AC), a superposition of AC and DC, a combination of AC and
DC, an imperfectly-rectified wave, a pulse wave, a rectangle wave, or the like.
The electrolytic method includes a constant current method; a constant voltage method;
a constant power method; a high-speed anodizing method based on a continuous current,
an intermittent current, or current recovery; and the like.
[0036] The heat-receiving member of the present embodiment may have a micropore formed in
the surface layer.
Fig. 3 is a cross-sectional view schematically illustrating an exemplary heat-receiving
member.
A heat-receiving member 2 illustrated in Fig. 3 has a large number of micropores 40
formed in the surface layer 30.
The micropores 40 are generated in the surface layer 30 when the thickness of the
surface layer 30 formed by anodization becomes 10 to 20 nm. Further, as the anodization
is continued on, the thickness of the surface layer 30 is increased and the depth
of the micropores 40 is increased, whereby the plurality of deep micropores 40 are
formed in the surface layer 30.
[0037] The heat-receiving member of the present embodiment may have a metal deposited in
the micropores.
Fig. 4 is a cross-sectional view schematically illustrating an exemplary heat-receiving
member.
A heat-receiving member 3 illustrated in Fig. 4 has a metal 50 precipitated and deposited
in the micropores 40 illustrated in Fig. 3 by electrolytic coloring.
Deposition of a metal in the micropores by electrolytic coloring further increases
the emissivity of the surface layer.
Examples of the metal to be deposited in the micropores include metals such as Ni,
Cu, Co, Pd, Sn, Pb, and Cd. A particularly desirable metal among these is Ni or Co
because they can increase the emissivity of the surface layer.
Further, since use of Ni makes it easy to block the pore, Ni is more desirable.
[0038] Examples of a method of depositing a metal in the micropores include a method of
passing an electric current through an electrolytic bath, which includes a metal,
with the surface layer formed by anodization serving as the cathode, and the like.
The kind of electrolytic bath to be used to deposit a metal is not particularly limited.
For example, in the case of depositing Ni, an electrolytic bath containing nickel
sulfate can be used.
[0039] Further, silicate or zirconium hydroxide may be deposited in the micropores by alternately
immersing a heat-receiving member in acid or alkali and in a silicate aqueous solution
or zirconium salt bath.
[0040] In the heat-receiving members as illustrated in Figs. 3 and 4, the micropores formed
in the surface layer may be blocked by a general method such as a method of immersing
a heat-receiving member in boiling water, a method of immersing a heat-receiving member
in hot water that contains a metal salt, or the like.
[0041] Next, the exhaust pipe heat-releasing is described.
Fig. 5 is a cross-sectional view schematically illustrating an exemplary exhaust pipe
heat-releasing system.
An exhaust pipe heat-releasing system 100 illustrated in Fig. 5 includes an exhaust
pipe 101 having a cylindrical base 102 that contains a metal, and the heat-receiving
member 1 arranged over the exhaust pipe 101.
The heat-receiving member 1 is arranged such that the surface layer 30 formed by anodizing
the surface of the base 20 faces the outer peripheral face of the exhaust pipe 101.
In Fig. 5, the heat transferred from the outer peripheral face of the exhaust pipe
101 to the surface layer 30 of the heat-receiving member 1 is schematically shown
by arrows.
[0042] The exhaust pipe 101 is a member that is connected to an internal combustion engine
such as an engine and that allows high-temperature exhaust gases to flow therethrough.
Examples of the material of a base 102 that forms the exhaust pipe 101 include metals
such as stainless steel, steel, iron, and copper, and nickel-based alloys such as
Inconel, Hastelloy, and Invar. These metal materials have high heat conductivity,
and therefore can contribute to improvement in heat-releasing properties of the exhaust
pipe 101.
[0043] Further, these metal materials have high heat resistance, and thus can be suitably
used in high-temperature conditions. By using these metal materials as the base of
the exhaust pipe, the exhaust pipe is allowed to have excellent resistance to thermal
shock, excellent processability, excellent mechanical properties, and the like.
[0044] The shape of the base 102 is not particularly limited as long as it is a cylindrical
shape. The cross-sectional shape thereof may be a circular shape, or may be any other
shape such as an elliptical shape and a polygonal shape.
[0045] The heat-receiving member 1 has the surface layer 30 with high emissivity, as described
above. Hence, the heat-receiving member 1 can receive on the surface of the surface
layer 30 much heat that is radiated from the outer peripheral surface of the exhaust
pipe 101 upon an increase of the temperature of the exhaust pipe 101.
[0046] The shape of the heat-receiving member is not particularly limited as long as it
does not disturb arrangement of the heat-receiving member over the exhaust pipe included
in the exhaust pipe heat-releasing system. A shape may be acceptable for example in
the case where the heat-receiving member corresponds to the heat insulator illustrated
in Fig. 1 and the surface of the surface layer of the heat-receiving member faces
the outer peripheral face of the exhaust pipe.
[0047] In the following, effects achieved by the heat-receiving member and the exhaust pipe
heat-releasing system in the present embodiment are described.
(1) The heat-receiving member of the present embodiment has a surface layer formed
by anodizing a surface of a base that contains aluminum or an aluminum alloy. The
emissivity of the surface of the surface layer formed by anodization is higher than
the emissivity of aluminum. When the emissivity of the surface of the surface layer
is high, the heat-receiving member of the present embodiment, arranged with the surface
layer thereof facing the heat source such as an exhaust pipe, can receive by radiation
heat transfer a large amount of heat released from the heat source. That is, the heat-receiving
member of the present embodiment demonstrates excellent performance in receiving,
by radiation heat transfer, heat released from a heat source. Further, use of such
a heat-receiving member makes it possible to promote heat release from the heat source.
(2) The heat-receiving members of the present embodiment may have micropores in the
surface layer thereof, and a metal may be deposited in the micropores. When a metal
is deposited in the micropores in the surface layer, the emissivity of that region
can be more increased.
(3) The exhaust pipe heat-releasing system of the present embodiment includes an exhaust
pipe having a cylindrical base that contains a metal, and a heat-receiving member
arranged over the exhaust pipe.
The heat-receiving member demonstrates excellent performance in receiving heat by
radiation heat transfer. Such a heat-receiving member arranged over the exhaust pipe
can receive much radiation heat from the outer peripheral surface of the exhaust pipe
when the temperature of the exhaust pipe is increased by high-temperature gasses flowing
therethrough. Thus, it is possible to prevent the temperature of the exhaust pipe
from rising too high.
[0048] Hereinafter, Examples are described which more specifically disclose the first embodiment.
However, the present embodiment is not limited to these Examples.
(Example 1)
[0049] A plate (150 mm × 70 mm × 0.5 mm (thickness)) made of aluminum (A1050) was prepared
as the base, and the surface thereof not to be anodized was protected by sticking
a masking tape. Next, the plate was anodized so that a surface layer was formed on
the surface of the plate. As a result, a heat-receiving member was produced.
At the time of anodization, the electrolytic bath used was a sulfuric acid bath with
a concentration of 200 g/L, and the electrolyte temperature was set to 15°C. The electrolytic
method used was a multistep electrolytic method in which a low voltage (20 V) was
applied in the first half of the process and a high voltage (40 V) was applied in
the second half of the process. Thereafter, the plate was washed to remove the electrolytic
solution.
Part of the heat-receiving member after anodization was cut and the thickness of the
surface layer formed by anodization was measured at five locations by SEM. The thicknesses
thereof were in the range of 15 to 20 µm.
Also, micropores were formed in the surface layer.
(Example 2)
[0050] The surface layer of the heat-receiving member produced in Example 1 was then electrolytically
colored, that is, nickel was deposited in the micropores in the surface layer.
The electrolytic bath used was a nickel sulfate bath. The electrolytic bath had a
pH of within the range of 4 to 6, and a temperature of within the range of 5 to 30°C.
The electrolytic treatment was performed by an alternate current of 5 to 60 V, with
the surface layer of the heat-receiving member serving as the cathode and with a carbon
rod serving as the anode. Then, blocking of the micropores was performed by immersing
the heat-receiving member in deionized water and boiling the water for 15 minutes.
(Examples 3 to 5)
[0051] Heat-receiving members were produced by performing anodization, electrolytic coloring,
and blocking in the same way as in Example 2 except that the thicknesses of the respective
bases were set to 1.0, 2.0, and 5.0 mm.
(Comparative Example 1)
[0052] A base made of the same aluminum as in Example 1 without anodization and electrolytic
coloring performed thereon was used as the heat-receiving member.
[0053] The heat-receiving members produced in the respective Examples and Comparative Example
were each evaluated for the following points.
(i) Measurement of Emissivity
[0054] The emissivity of the base before anodization, the emissivity of the surface layer
of the heat-receiving member after anodization, and the emissivity of the surface
layer of the heat-receiving member after electrolytic coloring were each measured
by a radiometer (AERD produced by Kyoto Electronics Manufacturing Co., Ltd., wavelength:
3 to 30 µm).
(ii) Measurement of Heat-receiving Performance
[0055] Fig. 6 is a cross-sectional view schematically illustrating a method of measuring
heat-receiving performance of the heat-receiving member.
A heat-receiving performance measuring machine 200 illustrated in Fig. 6 includes
a heater 201 that is surrounded by a heat insulating material 202. The heater 201
is connected to a not-shown power source through a power source cable 203, and the
temperature of the heater 201 can be increased by turning the power on. The upper
face of the heat-receiving performance measuring machine 200 is open so that putting
the heat-receiving member 1, the effect of which is to be measured, on the open face
forms a closed space around the heater 201.
The length shown by an arrow A in Fig. 6 indicates the long side (150 mm) of the heat-receiving
member 1, and the length shown by an arrow B indicates the width (120 mm) of the closed
space.
[0056] In measurement of the heat-receiving performance, the heat-receiving member 1 was
placed on the upper face of the heat-receiving performance measuring machine 200 with
the surface layer 30 facing the heater 201 side, and then the heater 201 was powered
on.
Next, the amount of electricity was adjusted so that the amounts of the radiation
heat and the input electricity would be equal when the temperature of the heater was
500°C, and the amount of electricity at this time was recorded.
The recorded amount of electricity was set to be the amount of heat received by the
heat-receiving member.
It should be noted that the heat-receiving member of Comparative Example 1, which
has no surface layer formed therein, was placed with the surface of the base facing
the heater side.
[0057] Further, the temperature of the heat-receiving member was measured at five locations
when the amounts of the radiation heat and the input electricity were equalized with
the temperature of the heater being 500°C.
The measuring locations were the points shown by arrows C, D, E, F, and G, which were
set by dividing at 30 mm intervals the width of 120 mm shown by the arrow B in Fig.
6.
Here, the measuring locations are aligned at the midpoint (35 mm) of the short side
(70 mm) of the heat-receiving member, and therefore the location E in Fig. 6 corresponds
to the center of the heat-receiving member.
Thereafter, the largest value and the smallest value among the temperatures measured
at the five locations were derived, and then a value resulting from "the largest value
- the smallest value" was used as an index that shows the variation of the temperature
distribution inside the heat-receiving member.
(iii) Measurement of Thermal Distortion
[0058] Displacement of the location E in Fig. 6 in the measurement test of the heat-receiving
performance in (ii) was measured by a non-contact type displacement meter.
(iv) Measurement of Fissures in Base
[0059] The heat-receiving members produced in the respective Examples and Comparative Example
were tested by 500 cycles of a temperature cycle test in which a cycle of heating
up to 250°C and cooling down to 25°C by water immersion was repeated. Then, the base
after the temperature cycle test was visually observed to see whether a fissure was
generated therein.
[0060] The evaluation results of the points (i) to (iv) with respect to the heat-receiving
members produced in the respective Examples and Comparative Example are shown together
in Table 1.
Table 1 shows the temperatures of the location E in Fig. 6. In Examples 1 to 5 and
Comparative Example 1, the temperature was highest at the location E, namely at the
center of the heat-receiving member.
With respect to generation of fissures, a heat-receiving member with a very small
fissure generated therein is shown as "+", and a heat-receiving member with a large
fissure generated therein is shown as "-".
[0061]
[Table 1]
|
Heat-receiving member |
Evaluation result |
Thickness of base |
Anodization |
Electrolytic coloring |
Emissivity |
Temperature at location E |
Highest temperature |
Lowest temperature |
Tempereature difference |
Amount of heat reception |
Amount of distortion |
Fissure |
(mm) |
(°C) |
(°C) |
(°C) |
(°C) |
(W/m2) |
(mm) |
Example 1 |
0.5 |
performed |
not performed |
0.780 |
448 |
448 |
418 |
30 |
2798 |
2.5 |
+ |
Example 2 |
0.5 |
performed |
performed |
0.814 |
452 |
452 |
423 |
29 |
2817 |
2.6 |
+ |
Example 3 |
1.0 |
performed |
performed |
0.814 |
452 |
452 |
421 |
31 |
2810 |
0.6 |
+ |
Example 4 |
2.0 |
performed |
performed |
0.814 |
43.8 |
438 |
419 |
19 |
2747 |
0.3 |
+ |
Example 5 |
5.0 |
performed |
performed |
0.814 |
418 |
418 |
407 |
11 |
2617 |
0.3 |
+ |
Comparative Example 1 |
0.5 |
not performed |
not performed |
0.050 |
315 |
315 |
299 |
16 |
1755 |
1.9 |
- |
[0062] Here, the emissivity of the surface layer formed by anodization in Example 1 was
considerably higher than the emissivity of the unanodized base in Comparative Example
1. Further, the amount of heat received by the heat-receiving member in Example 1
was larger than the amount of heat received by the heat-receiving member in Comparative
Example 1.
Since the amount of electricity, which was measured as the amount of heat received,
is equal to the amount of radiation heat from the heater as the heat source, the heat
release from the heat source was found to be accelerated by use of a heat-receiving
member with high emissivity as in Example 1.
[0063] Further, electrolytic coloring as in Example 2 made it possible to further increase
the emissivity of the heat-receiving member, and in this case, the amount of heat
received was further increased.
[0064] Example 2 and Examples 3 to 5 were compared to find out the effect of thickness of
the base. In every Example, the emissivity of the surface of the heat-receiving member
with a surface layer formed thereon was 0.814.
The highest temperature was observed at the location E in every Example, and when
the thickness of the base was increased to 2.0 mm or to 5.0 mm, the highest temperature
was decreased according to the increase thereof. Further, when the thickness of the
base was increased to 2.0 mm or to 5.0 mm, the temperature difference between the
highest temperature and the lowest temperature was decreased according to the increase
of the thickness of the base.
The reason for a decrease in the temperature difference according to the increase
of the thickness of the base has not been revealed. However, the reason is considered
to be that the amount of heat transferred within the base by heat conduction is increased
when the thickness of the base is large, and that the temperatures within the heat-receiving
member thus tend to be equalized.
[0065] Furthermore, the amount of distortion in the heat-receiving member was decreased
according to the increase of the thickness of the base. This is presumably because
a large thickness of the base enhances the strength of the base and thereby tends
not to generate a deformation of the base due to the thermal stress.
[0066] With respect to generation of fissures in the base, a very small fissure was observed
in the base of the heat-receiving members in Examples 1 to 5.
On the other hand, a large fissure was generated in the base in Comparative Example
1. The large fissure in the base was presumably caused by the heat resistance of an
unanodized aluminum base which is lower than the heat resistance of an anodized aluminum
base.
(Second Embodiment, not as such claimed)
[0067] Next, a second embodiment, which is one embodiment of the heat-receiving member,
illustrative for aspects of the present invention but not claimed as such, is described
with reference to the drawings.
In the heat-receiving member of the second embodiment, the emissivity of one region
far from the high-temperature part of the heat source is higher than the emissivity
of another region.
Fig. 7 is a cross-sectional view schematically illustrating an exemplary heat-receiving
member.
A heat-receiving member 4 illustrated in Fig. 7 has the surface layer 30 that is formed
by anodizing the surface of the base 20, and the surface layer 30 has a large number
of the micropores 40 formed therein.
Part of one region in the surface layer 30 is electrolytically colored, and thus the
micropores 40 in the region have the metal 50 deposited therein. Another region in
the surface layer 30 is not electrolytically colored, and thus the micropores 40 in
these regions do not have the metal 50 deposited therein.
[0068] In the heat-receiving member 4, the region on which electrolytic coloring was performed
(high-emissivity region) has emissivity higher than the emissivity of the region on
which electrolytic coloring was not performed, and the region on which electrolytic
coloring was not performed (low-emissivity region) has emissivity lower than the emissivity
of the region on which electrolytic coloring was performed.
[0069] Examples of the method of producing the heat-receiving member 4 include a method
in which, after the surface layer has been formed by anodization in the same way as
in the method of producing the heat-receiving member in the first embodiment, the
region not to be electrolytically colored is masked at the time of the electrolytic
coloring.
The masking can be carried out by a method such as sticking a masking tape on the
region.
As a result, the masking allows the unmasked region to be a high-emissivity region,
and allows the masked region to be a low-emissivity region.
[0070] Fig. 8 is a cross-sectional view schematically illustrating an exemplary heat-receiving
member.
A heat-receiving member 5 illustrated in Fig. 8 has the surface layer 30 formed by
anodizing a part of the base 20. Another part of the base 20 is unanodized, and thus
the surface of the base 20 is exposed.
[0071] In the heat-receiving member 5, the region with the surface layer 30 formed therein
by anodization (high-emissivity region) has emissivity higher than that of the region
with the surface of the base 20 exposed thereon. On the other hand, the region with
the surface of the base 20 exposed thereon (low-emissivity region) has emissivity
lower than that of the region with the surface layer 30 formed therein. The region
with the surface of the base exposed thereon is arranged at a location close to the
high-temperature part of the heat source.
[0072] Examples of the method of producing the heat-receiving member 5 include a method
in which a region not to be anodized is masked and then anodized upon production of
a heat-receiving member in the first embodiment.
The masking can be carried out by a method such as sticking a masking tape on the
region.
As a result, the masking allows the unmasked region to be a high-emissivity region,
and allows the masked region to be a low-emissivity region.
[0073] Fig. 9 is a cross-sectional view schematically illustrating an exemplary heat-receiving
member.
A heat-receiving member 6 illustrated in Fig. 9 has the surface layer 30 formed by
anodizing a part of the base 20. Further, the surface layer 30 is electrolytically
colored, and thus the micropores 40 have the metal 50 deposited therein. Another part
of the base 20 is not anodized and thus the surface of the base 20 is exposed.
[0074] In the heat-receiving member 6, the anodized and electrolytically colored region
(high-emissivity region) has emissivity higher than that of the region with the surface
of the base 20 exposed thereon. On the other hand, the region with the surface of
the base 20 exposed thereon (low-emissivity region) has emissivity lower than that
of the anodized and electrolytically colored region.
In the heat-receiving member 6, the difference in the emissivity between the high-emissivity
region and the low-emissivity region is larger than the difference in the emissivity
between the high-emissivity region and the low-emissivity region in the heat-receiving
member 4 and the heat-receiving member 5.
[0075] Examples of the method of producing the heat-receiving member 6 include a method
in which a region not to be anodized is masked before anodization, and with the region
being masked, the micropores are formed and the surface layer is then electrolytically
colored.
More specifically, further anodizing the produced heat-receiving member 5 so as to
form micropores in the surface layer and then further electrolytically coloring the
surface layer results in production of the heat-receiving member 6.
[0076] In the heat-receiving member of the second embodiment, the size of the region with
emissivity lower than that of the another region is desirably from 5 to 95% of the
total surface area.
Further, the size of the area with emissivity lower than that of the another region
is desirably larger than a size of 10 mm × 10 mm when the shape of the region is rectangular.
Also, the difference in the emissivity between the high-emissivity region and the
low-emissivity region is desirably from 0.01 to 0.90.
Furthermore, a ratio (Y / X) of a length (Y) of the short side of the region with
emissivity lower than that of the another region to a thickness (X) of the base is
desirably 2 or more.
[0077] In the following, effects of the heat-receiving member of the present embodiment
are described.
In the present embodiment, in addition to the effects (1) and (2) described in the
first embodiment, the following effects can be achieved.
(4) In the heat-receiving member of the present embodiment, there is a region with
emissivity higher than that of another region. Since the region having higher emissivity
than emissivity of the another region is more likely to receive heat by radiation
heat transfer, the amount of heat to be received per unit area is large. The region
having higher emissivity than that of the another region is thus a region in which
the temperature tends to rise due to reception of heat. Accordingly, placing the region
having higher emissivity than the another region at a location far from the high-temperature
part of the adjacent heat source makes it more likely for the temperature of the heat-receiving
member to rise even if the region is located far from the high-temperature part of
the heat source; hence, generation of a low-temperature region inside the heat-receiving
member can be prevented.
That is, generation of a temperature difference inside the heat-receiving member can
be prevented. Further, generation of thermal stress and distortion in the heat-receiving
member can be prevented.
[0078] (5) In the heat-receiving member of the present embodiment, micropores may be formed
in the surface layer in the region far from the high-temperature part of the heat
source, and a metal may be deposited in the micropores.
Deposition of a metal in the micropores in the surface layer makes it possible to
increase the emissivity of the region. That is, placing the region with a metal deposited
in the micropores formed in the surface layer thereof at a location far from the high-temperature
part of the heat source makes it possible to more effectively prevent generation of
a low-temperature region inside the heat-receiving member.
[0079] (6) In the heat-receiving member of the present embodiment, a region close to the
high-temperature part of the heat source may include a region in which the surface
of the base is unanodized and exposed.
Since the base is made of aluminum or an aluminum alloy, the emissivity of the region
with the surface of the base exposed thereon is low. Placing the region with the surface
of the base exposed thereon at a location close to the high-temperature part of the
heat source makes it possible to prevent the temperature of the heat-receiving member
from rising too high even if the region is located close to the high-temperature part
of the heat source; hence, generation of a high-temperature region inside the heat-receiving
member can be prevented. That is, generation of a temperature difference inside the
heat-receiving member can be prevented.
[0080] Hereinafter, Examples are described which more specifically disclose the second embodiment.
However, the present embodiment is not limited to these Examples.
(Example 6)
[0081] A base made of aluminum was anodized to form a surface layer on the base and to form
micropores in the surface layer, in the same way as in Example 1.
Next, at the center (the location E in Fig. 6) of the anodized surface, a masking
tape (851T, produced by Sumitomo 3M Limited.) with a size of 20 mm × 20 mm was stuck.
Subsequently, the surface layer was electrolytically colored in the same way as in
Example 2, and thereby nickel was deposited in the micropores in the region without
the masking tape stuck thereon.
Thereafter, the masking tape was removed, and then blocking was carried out in the
same way as in Example 2.
A heat-receiving member produced thereby has a region on which electrolytic coloring
was not performed, which is a "low-emissivity region", and a region on which electrolytic
coloring was performed, which is a "high-emissivity region".
(Example 7)
[0082] At the center (the location E in Fig. 6) of the to-be anodized surface of the base
that is of the same kind as the base used in Example 1, a masking tape with a size
of 10 mm × 10 mm was stuck.
Then, the base was anodized in the same way as in Example 1, and a surface layer was
formed by anodization on a region without a masking tape stuck thereon, and further,
micropores were formed in the surface layer.
Subsequently, the surface layer was electrolytically colored in the same way as in
Example 2, and thereby nickel was deposited in the micropores in the region without
the masking tape stuck thereon.
Thereafter, the masking tape was removed, and then blocking was carried out in the
same way as in Example 2.
A heat-receiving member produced thereby has a region on which anodization and electrolytic
coloring were not performed, which is a "low-emissivity region", and a region on which
anodization and electrolytic coloring were performed, which is a "high-emissivity
region".
(Examples 8 and 9)
[0083] Heat-receiving members were produced by the same method as in Example 7 except that
the respective masking tapes had a size of 20 mm × 20 mm and a size of 50 mm × 50
mm.
(Examples 10 to 12)
[0084] Heat-receiving members were produced by the same method as in Example 7 except that
the bases each had a thickness of 1.0 mm and the respective masking tapes had a size
of 10 mm × 10 mm, a size of 20 mm × 20 mm, and a size of 50 mm × 50 mm.
(Examples 13 to 15)
[0085] Heat-receiving members were produced by the same method as in Example 7 except that
the bases each had a thickness of 2.0 mm and the respective masking tapes had a size
of 10 mm × 10 mm, a size of 20 mm × 20 mm, and a size of 50 mm × 50 mm.
(Examples 16 to 18)
[0086] Heat-receiving members were produced by the same method as in Example 7 except that
the bases each had a thickness of 5.0 mm and the respective masking tapes had a size
of 10 mm × 10 mm, a size of 20 mm × 20 mm, and a size of 50 mm × 50 mm.
[0087] The heat-receiving members produced in the respective Examples were evaluated for
the same points (i) to (iv) as in Example 1.
[0088] First, evaluation results of the heat-receiving members of Examples 6 to 9 each with
the base having a thickness of 0.5 mm are shown together in Table 2. For comparison,
the result of the heat-receiving member of Example 2 which had uniform emissivity
on the surface thereof is also shown.
[0089]
[Table 2]
|
Heat-receiving member |
Evaluation result |
|
Thickness of base |
Low-emissivity region |
Highest temperature |
Lowest temperature |
Temperature difference |
Temperature at location E |
Temperature decrease at location E |
Amount of heat reception |
Amount of distortion |
Fissure |
|
Anodization |
Electrolytic coloring |
Emissivity |
Size |
|
(mm) |
(mm × mm) |
(°C) |
(°C) |
(°C) |
(°C) |
(°C) |
(W/m2) |
(mm) |
Example 2 |
0.5 |
N/A |
N/A |
N/A |
N/A |
452 |
423 |
29 |
452 |
0 |
2817 |
2.6 |
+ |
Example 6 |
0.5 |
performed |
not performed |
0.780 |
20 × 20 |
424 |
418 |
6 |
424 |
28 |
2674 |
2.3 |
+ |
Example 7 |
0.5 |
not performed |
not performed |
0.050 |
10 × 10 |
439 |
409 |
30 |
439 |
13 |
2709 |
1.2 |
+ |
Examples 8 |
0.6 |
not performed |
not performed |
0.050 |
20 × 20 |
402 |
379 |
23 |
379 |
73 |
2452 |
2.0 |
+ |
Example 9 |
0.5 |
not performed |
not performed |
0.050 |
50 × 50 |
392 |
359 |
33 |
359 |
93 |
2302 |
1.3 |
+ |
[0090] Table 2 shows the emissivities of the low-emissivity regions in the respective Examples.
In Example 6 in which the heat-receiving members were anodized and the low-emissivity
region thereof was not electrolytically colored, the emissivity was 0.780. In Examples
7 to 9 in which the low-emissivity regions in the heat-receiving members were not
anodized nor electrolytically colored, the emissivity was 0.050, the same as that
of the base.
Although Table 2 does not show the emissivities of the high-emissivity regions and
the emissivity in Example 2, those emissivities correspond to the emissivities of
the anodized and electrolytically colored regions, and thus those emissivities are
all 0.814.
[0091] The heat-receiving member of Example 2 with uniform emissivity on the surface thereof
had the highest temperature of 452°C at the location E in the heat-receiving member
shown in Fig. 6, that is, at the center of the heat-receiving member.
On the other hand, the heat-receiving members of Examples 6 to 9, each of which had
a low-emissivity region at the location E, had a temperature lower than the temperature
of the heat-receiving member of Example 2 at the location E. Table 2 shows as "temperature
decrease at location E" how many degrees the temperature dropped from the temperature
at the location E in Example 2.
[0092] Further, Table 3 shows the temperatures measured at the locations C, D, E, F, and
G shown in Fig. 6, for Example 2 and Examples 6 to 9. Furthermore, Fig. 10 shows the
relationships between the locations of temperature measurement and the temperatures
of the respective heat-receiving members, which were measured in Example 2 and Examples
6 to 9.
[0093]
[Table 3]
|
Heat-receiving member |
Evaluation result |
Thickness of base |
Low-emissivity region |
Location C |
Location D |
Location E |
Location F |
Location G |
Anodization |
Electrolytic coloring |
Emissivity |
Size |
(mm) |
(mm × mm) |
(°C) |
(°C) |
(°C) |
(°C) |
(°C) |
Example 2 |
0.5 |
N/A |
N/A |
N/A |
N/A |
423 |
439 |
452 |
447 |
423 |
Examples 6 |
0.5 |
performed |
not performed |
0.780 |
20 × 20 |
418 |
419 |
424 |
418 |
418 |
Example 7 |
0.5 |
not performed |
not performed, |
0.050 |
10 × 10 |
410 |
426 |
439 |
434 |
409 |
Example 8 |
0.5 |
not performed |
not performed |
0.050 |
20 × 20 |
400 |
392 |
379 |
389 |
402 |
Example 9 |
0.5 |
not performed |
not performed |
0.050 |
50 × 50 |
390 |
367 |
359 |
363 |
392 |
[0094] Hereinafter, the evaluation results are described with reference to Table 2, Table
3, and Fig. 10.
In Example 6, the emissivity of the low-emissivity region is 0.780, and the difference
between this emissivity and the emissivity of 0.814 of the high-emissivity region
is 0.034. Such provision of a high-emissivity region and a low-emissivity region in
the heat-receiving member decreases the temperature at the location E by 28°C; thus,
the temperature difference between the highest temperature and the lowest temperature
became 6°C, which made it possible to bring the temperature distribution within the
heat-receiving member closer to the uniform distribution.
[0095] In Example 8, the emissivity of the low-emissivity region was 0.05, which led to
a large decrease in the temperature at the location E by 73°C. Comparison with Example
6 in which the area of the low-emissivity region is 20 mm × 20 mm, the same area as
in Example 8, reveals that lower emissivity in the low-emissivity region more greatly
increases temperature-decrease effects.
[0096] Comparison among Examples 7 to 9 each having the same emissivity of 0.05 in the low-emissivity
region and having a different area of the low-emissivity region reveals that a larger
area of the low-emissivity region leads to a larger temperature decrease at the location
E.
Also, in each of Examples 8 and 9 in which the temperature decrease was large, the
temperature was lowest at the location E within the heat-receiving member, and thus
the line of the line chart of Examples 8 and 9 in Fig. 10 had a reverse shape of the
line for Example 2.
[0097] Those results revealed that provision of a high-emissivity region and a low-emissivity
region in the heat-receiving member makes it possible to prevent the temperature from
rising too high in a certain region within the heat-receiving member, and to prevent
the temperature from falling too low in a certain region. The results also revealed
that appropriately adjusting the emissivities and sizes in the high-emissivity region
and in the low-emissivity region makes it possible to adjust the temperature distribution
inside the heat-receiving member.
[0098] Next, the evaluation results of Examples 10 to 12 in which the bases each had a thickness
of 1.0 mm, Examples 13 to 15 in which the bases each had a thickness of 2.0 mm, and
Examples 16 to 18 in which the bases each had a thickness of 5.0 mm are respectively
shown in Table 4, 5, or 6.
For comparison, the result of the heat-receiving member of Example 3, 4, or 5 with
uniform emissivity on the surface thereof is also shown. The respective values of
"temperature decrease at location E" were calculated based on the temperature at the
location E in Example 3, 4, or 5.
[0099]
[Table 4]
|
Heat-receiving member |
Evaluation result |
Thickness of base |
Low-emissivity region |
Highest temperature |
Lowest temperature |
Temperature difference |
Temperature at location E |
Temperature decrease at location E |
Amount of heat reception |
Amount of distortion |
Fissure |
Anodization |
Electrolytic coloring |
Emissivity |
Size |
(mm) |
(mm × mm) |
(°C) |
(°C) |
(°C) |
(°C) |
(°C) |
(W/m2) |
(mm) |
Example 3 |
1.0 |
N/A |
N/A |
N/A |
N/A |
452 |
421 |
31 |
452 |
0 |
2810 |
0.6 |
+ |
Example 10 |
1.0 |
not performed |
not performed |
0.050 |
10 × 10 |
443 |
410 |
33 |
443 |
9 |
2738 |
0.5 |
+ |
Example 11 |
1.0 |
not performed |
not performed |
0.050 |
20 × 20 |
405 |
387 |
18 |
387 |
65 |
2486 |
0.5 |
+ |
Example 12 |
1.0 |
not performed |
not performed |
0.050 |
50 × 50 |
394 |
362 |
32 |
362 |
90 |
2332 |
0.8 |
+ |
[0100]
[Table 5]
|
Heat-receiving member |
Evaluation result |
Thickness of base |
Low-emissivity region |
Highest temperature |
Lowest temperature |
Temperature difference |
Temperature at location E |
Temperature decrease at loation E |
Amount of heat reception |
Amount of distortion |
Fissure |
Anodization |
Electrolytic coloring |
Emissivity |
Size |
(mm) |
(mm × mm) |
(°C) |
(°C) |
(°C) |
(°C) |
(°C) |
(W/m2) |
(mm) |
Example 4 |
2.0 |
N/A |
N/A |
N/A |
N/A |
438 |
419 |
19 |
438 |
0 |
2747 |
0.3 |
+ |
Example 13 |
2.0 |
not performed |
not performed |
0.050 |
10 × 10 |
426 |
412 |
14 |
426 |
12 |
2669 |
0.4 |
+ |
Example 14 |
2.0 |
not performed |
not performed |
0.050 |
20 × 20 |
404 |
393 |
11 |
393 |
45 |
2495 |
0.4 |
+ |
Example 15 |
2.0 |
not performed |
not performed |
0.050 |
50 × 50 |
394 |
373 |
21 |
373 |
65 |
2363 |
0.4 |
+ |
[0101]
[Table 6]
|
Heat-receiving member |
Evaluation result |
Thickness of base |
Low-emissivity region |
Highest temperature |
Lowest temperature |
Temperature difference |
Temperature at location E |
Temperature decrease at location E |
Amount of heat reception |
Amount of distortion |
Fissure |
Anodization |
Electrolytic coloring |
Emissivity |
Size |
(mm) |
(mm × mm) |
(°C) |
(°C) |
(°C) |
(°C) |
(°C) |
(W/m2) |
(mm) |
Example 5 |
5.0 |
N/A |
N/A |
N/A |
N/A |
418 |
407 |
11 |
418 |
0 |
2617 |
0.3 |
+ |
Example 16 |
5.0 |
not performed |
not performed |
0.050 |
10 × 10 |
412 |
407 |
7 |
412 |
6 |
2585 |
0.3 |
+ |
Example 17 |
5.0 |
not performed |
not performed |
0.050 |
20 × 20 |
402 |
391 |
11 |
391 |
27 |
2480 |
0.3 |
+ |
Example 18 |
5.0 |
not performed |
not performed |
0.050 |
50 × 50 |
395 |
387 |
8 |
387 |
31 |
2440 |
0.4 |
+ |
[0102] From the results shown in Table 2 and Tables 4 to 6, effects exerted on the characteristics
of the heat-receiving member by the thickness of the base were studied.
When the heat-receiving members of Examples with the respective bases having the same
thickness are compared, the larger the size of the low-emissivity region, the larger
the temperature decrease at the location E.
[0103] Comparison of the results of the heat-receiving members of Examples with the same
sizes of the low emissivity regions and with different thicknesses of the bases showed
that the larger the thickness of the base, the smaller the temperature decrease tended
to be.
Although the reason for this has not been revealed, it is assumed that, since a larger
thickness of the base leads to a larger amount of heat transferred inside the base
by heat conduction, influences of an increase/decrease of the emissivity are thereby
small.
[0104] Also, the larger the thickness of the base, the smaller the amount of distortion
tended to be. The reason for this is considered to be that the mechanical strength
of the base is increased as the thickness of the base is increased.
[0105] These results revealed that appropriately adjusting the emissivities and sizes of
the high-emissivity region and the low-emissivity region according to the thickness
of the base makes it possible to adjust the temperature distribution inside the heat-receiving
member.
(Third Embodiment)
[0106] Now, a third embodiment, which is one embodiment of the heat-receiving member of
the present invention, is described with reference to the drawings.
The heat-receiving member in the third embodiment has a plurality of cracks formed
in the surface layer thereof.
Fig. 11 is a cross-sectional view schematically illustrating an exemplary heat-receiving
member of the present invention.
A heat-receiving member 7 illustrated in Fig. 11 has the surface layer 30 formed by
anodizing the surface of the base 20, and the surface layer 30 has a plurality of
cracks 60 formed therein.
[0107] Fig. 12, Fig. 13, and Fig. 14 each are a scanning electron microscope photograph
that shows a surface of a surface layer of an exemplary heat-receiving member of the
present invention which has cracks in the surface layer.
In the surface layer shown in Fig. 12, a crack 61 has a zigzag shape as shown in the
encircled region.
In the surface layer shown in Fig. 13, a crack 62 is in a state where at least one
end thereof has stopped growing and thus is not connected to another crack, as shown
in the encircled region; the cracks are separated from each other.
In the surface layer shown in Fig. 14, cracks 63 are formed as straight lines substantially
parallel to each other in one direction, as shown by arrows.
[0108] The width of each crack is desirably from 0.01 to 15 µm.
A width of more than 15 µm might generate a fissure in the base.
[0109] Examples of the method of forming cracks in the surface layer include a method in
which the heat-receiving member after anodization is bent so that it is distorted,
and then the heat-receiving member is bent again so that it restores the original
shape.
[0110] In the following, effects of the heat-receiving member of the present embodiment
are described. In the present embodiment, the following effects can be exerted in
addition to the effects (1) and (2) that have been described in the first embodiment.
(7) The plurality of cracks are formed in the surface layer of the heat-receiving
member of the present embodiment. Therefore, part of thermal stress, which is applied
between the base and the surface layer, is absorbed at the cracked part. As a result,
the thermal stress applied between the base and the surface layer is prevented from
becoming large. As a result, generation of a fissure in the base due to the thermal
stress can be prevented.
[0111] (8) In the heat-receiving member of the present embodiment, the cracks may be separated
from each other.
In the case where the cracks are separated from each other, the cracks absorb the
thermal stress and grow upon application of the thermal stress to the surface layer,
and thus make it possible to effectively prevent generation of a fissure in the base.
Further, the continuous surface layer increases the rigidity and thus makes it easier
for the heat-receiving member to maintain the shape.
[0112] (9) In the heat-receiving member of the present embodiment, at least one of the cracks
may have a zigzag shape.
A zigzag shape of the crack generates resistance to the force applied in the direction
parallel to the crack, and therefore makes it possible to effectively prevent generation
of a fissure in the base.
[0113] Hereinafter, Examples are described which more specifically disclose the third embodiment
of the present invention. However, the present embodiment is not limited to these
Examples.
(Example 19)
[0114] A heat-receiving member was produced in the same way as in Example 2. Thereafter,
the produced heat-receiving member was bended by hand to add distortion to the heat-receiving
member. Then, cracks attributed from the distortion were observed.
The cracks had a zigzag shape, and had widths of 0.01 to 15 µm at five locations when
measured by SEM.
[0115] The heat-receiving member produced in Example 19 was evaluated for the same points
(i) to (iv) as in Example 1. The results thereof are shown together in Table 7. For
comparison, the result of the heat-receiving member of Example 2 with no crack formed
in the surface layer thereof is also shown.
[0116]
[Table 7]
|
Heat-receiving member |
Evaluation result |
Thickness of base |
Anodization |
Electrolytic coloring |
Crack |
Emissivity |
Temperature at location E |
Highest temperature |
Lowest temperature |
Temperature difference |
Amount of heat reception |
Amount of distortion |
Fissure |
(mm) |
(°C) |
(°C) |
(°C) |
(°C) |
(W/m2) |
(mm) |
Example 2 |
0.5 |
performed |
performed |
not formed |
0.814 |
452 |
452 |
423 |
29 |
2817 |
2.6 |
+ |
Example 19 |
0.5 |
performed |
performed |
formed |
0.806 |
449 |
449 |
421 |
28 |
2784 |
1.9 |
++ |
[0117] The heat-receiving member produced in Example 19 had emissivity slightly lower than
that of the heat-receiving member of Example 2. This decrease is considered to be
due to inclusion of the surface of the base, which appeared at the cracked part, in
the region the emissivity of which was measured.
In the heat-receiving member produced in Example 19, no fissure was observed in the
base because of the cracks.
This result is shown as "++" in Table 7.
(Fourth Embodiment, not as such claimed)
[0118] Now, a fourth embodiment, which is one embodiment of the heat-receiving member, illustrative
for aspects of the present invention but not claimed as such, is described with reference
to the drawings.
The heat-receiving member of the fourth embodiment has surface layers formed by anodizing
both respective surfaces of the base thereof.
Fig. 15 is a cross-sectional view schematically illustrating an exemplary heat-receiving
member.
A heat-receiving member 11 illustrated in Fig. 15 has the base 20 both surfaces of
which are anodized, and the base 20 has a surface layer 30a on the upper surface,
and has a surface layer 30b on the lower surface.
The surface layer 30a and the surface layer 30b respectively have micropores 40a and
micropores 40b formed therein, and the micropores 40a and the micropores 40b respectively
have a metal 50a and a metal 50b deposited therein.
That is, the structure of one side of the heat-receiving member is the same as that
of the heat-receiving member illustrated in Fig. 4.
[0119] The heat-receiving member illustrated in Fig. 15 is an exemplary heat-receiving member
of the present embodiment. As the surface layer of the heat-receiving member of the
present embodiment, any of the surface layers of the heat-receiving members that have
been described thus far can be employed.
Further, the conditions of the surface layer on the upper surface and lower surface
may be different. Examples of such a structure include a structure in which the surface
layer on the upper surface is electrolytically colored and the surface layer on the
lower surface is not electrolytically colored, and the like.
[0120] Examples of a method of forming surface layers by anodizing both respective surfaces
of the base include a method in which the base without masking performed thereon is
immersed into an electrolytic bath such that both surfaces of the base touch the electrolytic
bath, and the like. Alternatively, one surface of the base may be anodized at one
time.
[0121] In the following, effects of the heat-receiving member of the present embodiment
are described. In the present embodiment, changing the structure of the surface layer
makes it possible to achieve the following effects on the respective surfaces in addition
to achievement of the respective effects (1) and (2) and effects (4) to (9), the effects
having been described in the first to third embodiments.
(10) In the heat-receiving member of the present embodiment, surface layers are formed
by anodizing both respective surfaces of the heat-receiving member, and thus the emissivity
of the both surfaces of the heat-receiving member is high. As a result, it becomes
possible for the heat-receiving member to receive much heat on one surface and release
much heat from the other surface. Therefore, the temperature of the heat-receiving
member tends not to rise, which makes it possible to decrease the thermal stress generated
in the heat-receiving member.
Further, the lower the temperature of the heat-receiving member, the larger the amount
of heat that the heat-receiving member can receive; hence, the temperature of the
heat-receiving member tends not to rise even at the time of heat reception, which
makes it possible to produce a heat-receiving member that demonstrates excellent performance
in receiving heat by radiation heat transfer.
[0122] In the following, Examples are described which more specifically disclose the fourth
embodiment. However, the present embodiment is not limited to these Examples.
(Example 20)
[0123] A same base as the base used in Example 1 was immersed in an electrolytic bath without
a masking tape being stuck on the base, and then both surfaces of the base were anodized
to form respective surface layers on the both surfaces of the base. Then, micropores
were further formed in the surface layers.
Other conditions of anodization were same as those in Example 1.
[0124] Next, a masking tape was stuck for protection on the surface layer formed on a surface
of the base which was to be a heat-releasing face when the base is used as a heat-receiving
member. Then, the surface layer was electrolytically colored in the same way as in
Example 2 so that nickel was deposited in the micropores.
Thereafter, the masking tape was removed and blocking was carried out in the same
way as in Example 2.
In a heat-receiving member produced as thus described, one of the surfaces was anodized
and electrolytically colored and the other surface was only anodized.
(Example 21)
[0125] A heat-receiving member was produced in the same way as in Example 20 except that
a masking tape was not stuck on the surface layer before electrolytic coloring in
Example 20.
In a heat-receiving member produced as thus described, both faces were anodized and
electrolytically colored.
[0126] The heat-receiving members produced in Examples 20 and 21 were evaluated for the
same points (i) to (iv) as in Example 1. In Example 20, the heat-receiving member
was placed such that the anodized and electrolytically colored surface faced the heaters
and thus was used as a heat-receiving face. Further, the surface, which was only anodized,
was arranged on the other side and set to be the heat-releasing face. In Example 21,
the sides that the surfaces of the heat-receiving member would face were optionally
determined.
Furthermore, Example 22 and Example 23 as described below were carried out.
(Example 22)
[0127] In Example 22, a same heat-receiving member as that produced in Example 20 was used
in measurement of heat-receiving performance. However, unlike in Example 20, the heat-receiving
member was placed in reverse, that is, the surface on which only anodization was performed
was used as the heat-receiving face, and the surface on which anodization and electrolytic
coloring were performed was used as the heat-releasing face.
(Example 23)
[0128] In Example 23, a same heat-receiving member as that produced in Example 2 was used
in measurement of heat-receiving performance. However, unlike in Example 2, the heat-receiving
member was placed in reverse, that is, the surface layer of the heat-receiving member
was arranged on the farther side from the heaters and thus was used as the heat-releasing
face, and the surface on which anodization was not performed was used as the heat-receiving
face.
The results of evaluation of Examples 20 to 23 are shown together in Table 8. For
comparison, the result of the heat-receiving member of Example 2 is also shown.
[0129] In each of Examples 20 to 22, since the emissivity is high both on the heat-receiving
face and the heat-releasing face of the heat-receiving member, the amount of heat
reception is more than 8700 W/m
2. This amount of heat reception is very large compared to the result of the heat-receiving
member of Example 2 which has high emissivity only on the heat-receiving face.
That is, Examples 20 to 22 show that a large amount of heat release from the heat-receiving
face by radiation heat transfer considerably increases the amount of heat reception
of the heat-receiving member.
Further, the highest temperature of the heat-receiving member is low despite the large
amount of heat reception, which shows that heat release from the heat-receiving member
was promoted.
It should be noted that the amount of heat reception was small in Example 23 in which
the heat-receiving member had high emissivity only on the heat-releasing face and
had low emissivity on the heat-receiving face.
These results show that providing respective surface layers on both surfaces of the
heat-receiving member by anodization so as to increase the emissivity on a heat-receiving
face and a heat-releasing face makes it possible to produce a heat-receiving member
which demonstrates excellent performance in receiving heat by radiation heat transfer.
(Fifth Embodiment)
[0130] Next, a fifth embodiment, which is one embodiment of the exhaust pipe heat-releasing
system of the present invention, is described with reference to the drawings.
In the exhaust pipe heat-releasing system of the present embodiment, a surface-coating
layer containing a crystalline inorganic material and an amorphous binder is formed
on the outer peripheral face of the exhaust pipe described in the exhaust pipe heat-releasing
system of the first embodiment.
[0131] Fig. 16 is a cross-sectional view schematically illustrating an exemplary exhaust
pipe heat-releasing system of the present invention.
An exhaust pipe 151 that forms an exhaust pipe heat-releasing system 150 illustrated
in Fig. 16 has a cylindrical base 102 that contains a metal; and a surface-coating
layer 103 containing a crystalline inorganic material and an amorphous binder, which
is formed on the outer peripheral face of the base 102.
Further, the heat-receiving member 1 is placed such that the surface layer 30 formed
by anodization faces the surface-coating layer 103 of the exhaust pipe 151.
Arrows illustrated in Fig. 16 schematically show heat transferred from the surface-coating
layer 103, which is formed on the outer peripheral face of the exhaust pipe 151, to
the surface layer 30 of the heat-receiving member 1.
[0132] The surface-coating layer 103 has an emissivity of 0.78 or more at a wavelength of
3 to 30 µm. Provision of the surface-coating layer 103 with high emissivity on the
outer peripheral face of the exhaust pipe 151 makes it possible to effectively release
heat in the exhaust pipe 151 to the outside of the exhaust pipe 151 by radiation heat
transfer.
[0133] The material of the crystalline inorganic material contained in the surface-coating
layer 103 is not particularly limited. An oxide of a transition metal is desirably
used, and specific examples thereof include manganese dioxide, manganese oxide, iron
oxide, cobalt oxide, copper oxide, chrome oxide and nickel oxide. Each of these may
be used alone or two or more kinds of these may be used in combination.
These oxides of transition metals are suitably used for producing crystalline inorganic
materials having high emissivity.
[0134] Examples of the amorphous binder include barium glass, boron glass, strontium glass,
alumina-silicate glass, soda-zinc glass and soda-barium glass. Each of these may be
used alone or two or more kinds of these may be used in combination.
[0135] Such an amorphous binder is a low-melting-point glass and its softening temperature
is in the range of 400 to 1100°C. Accordingly, melting the amorphous inorganic binder
to coat the outer peripheral face of the base of the exhaust pipe and then firing
the base make it possible to easily form a robust surface-coating layer on the outer
peripheral face of the base.
[0136] When the amorphous binder is a low-melting-point glass, the melting point thereof
is desirably in the range of 400 to 1100°C.
When the low-melting-point glass has a melting point of less than 400°C, there is
a case where the glass easily softens during use and extraneous matters adhere to
the glass. On the other hand, when the melting point exceeds 1100°C, there is a case
where the heating in formation of a surface-coating layer deteriorates the base.
[0137] In the surface-coating layer containing the crystalline inorganic material and the
amorphous binder, with respect to a compounding amount of the crystalline inorganic
material, a desirable lower limit is 10% by weight and a desirable upper limit is
90% by weight.
When the compounding amount of the crystalline inorganic material is less than 10%
by weight, there is a case where the infrared emissivity is insufficient and the heat-releasing
property in a high-temperature region is inferior. On the other hand, when the compounding
ratio exceeds 90% by weight, there is a case where the adhesion between the heat-releasing
layer and the base of the exhaust pipe is lowered.
With respect to the compounding amount of the crystalline inorganic material, a more
desirable lower limit is 30% by weight and a more desirable upper limit is 70% by
weight.
[0138] It is desirable that the surface-coating layer have a thickness of 0.5 to 10 µm.
When the surface-coating layer has a thickness of less than 0.5 µm, a sufficient heat-releasing
property might not be ensured. On the other hand, when the surface-coating layer has
a thickness exceeding 10 µm, cracks might appear on the surface-coating layer or the
exhaust pipe might be deformed.
[0139] It is desirable that the surface-coating layer is formed on the entire outer peripheral
face of the exhaust pipe because, in this case, the area of the surface-coating layer
will be largest and the surface-coating layer will have a particularly excellent heat-releasing
property. However, a surface-coating layer may be formed only on a part of the outer
peripheral face of the exhaust pipe; particularly when the surface-coating layer is
formed on the surface that faces the heat-receiving member, it may not be formed on
other parts on the exhaust pipe.
[0140] Hereinafter, a method of producing an exhaust pipe to be used in the exhaust pipe
heat-releasing system of the present embodiment is described in accordance with the
order of processes.
[0141] (I) Using a cylindrical exhaust pipe processed into a predetermined shape as a starting
material, cleaning is performed so as to remove impurities on a surface of the base
of the exhaust pipe.
The cleaning is not particularly limited, and conventionally known cleaning may be
used. More specifically, ultrasonic cleaning in alcohol solvent, and the like may
be used.
[0142] Further, after the cleaning, roughening may be optionally performed on the surface
of the base of the exhaust pipe in order to enlarge a specific surface area of the
outer peripheral face of the base of the exhaust pipe or to adjust the maximum height
Rz of the inner face of the base of the exhaust pipe. More specifically, roughening
such as sandblasting, etching and high-temperature oxidation may be performed. Each
of the treatments may be used alone or two or more kinds of these may be used in combination.
[0143] (II) Separately, a crystalline inorganic material and an amorphous binder are wet-mixed
so as to prepare a raw material composition for a surface-coating layer.
More specifically, a powder of a crystalline inorganic material and a powder of an
amorphous binder are prepared so that each has a predetermined particle size, a predetermined
shape, and the like. Respective powders are dry-mixed at a predetermined compounding
ratio to obtain a mixed powder. Then, water is added thereto and the mixture is wet-mixed
by ball milling so as to prepare a raw material composition for a surface-coating
layer.
The compounding ratio of the mixed powder and water is not particularly limited. However,
around 100 parts by weight of water with respect to 100 parts by weight of a mixed
powder is desirable. The reason for this is that a viscosity suitable for applying
to the base of the exhaust pipe can be obtained. According to need, an inorganic fiber
or an organic solvent may be blended to the raw material composition for a surface-coating
layer.
[0144] (III) The outer peripheral face of the base of the exhaust pipe is coated with the
raw material composition for a surface-coating layer.
As a method for coating with the raw material composition for a surface-coating layer,
for example, spray coating; electrostatic coating; ink jet; transfer using a stamp,
a roller or the like; brush coating and the like may be used.
In addition, the base of the exhaust pipe may be immersed in the raw material composition
for a surface-coating layer so as to be coated with the raw material composition for
a surface-coating layer.
[0145] At least one of plating such as nickel plating and chrome plating, oxidation of the
outer peripheral face of the metal base, and the like may be performed before the
coating of the outer peripheral face of a base of the exhaust pipe with a raw material
composition for a surface-coating layer.
The reason for this is that there is a case where an adhesion property between a base
of the exhaust pipe and a surface-coating layer is improved.
[0146] (IV) The exhaust pipe coated with the raw material composition for a surface-coating
layer is fired.
More specifically, after the exhaust pipe coated with the raw material composition
for a surface-coating layer is dried, a surface-coating layer is formed by firing.
The firing temperature is desirably set to the melting point of the amorphous binder
or higher, and it is desirably 700 to 1100°C. The firing temperature depends on the
kind of the blended amorphous binder. By setting the firing temperature to the melting
point of the amorphous binder or higher, the exhaust pipe and the amorphous binder
can be adhered solidly, so that a surface-coating layer solidly adhered to the base
can be formed.
Through such processes, an exhaust pipe to be used in the exhaust pipe heat-releasing
system of the present embodiment can be produced.
[0147] In the following, effects of the exhaust pipe heat-releasing system of the present
embodiment are described. The exhaust pipe heat-releasing system of the present embodiment
can achieve the following effects in addition to the effect (3) described in the first
embodiment.
(11) The exhaust pipe heat-releasing system of the present embodiment is provided
with a surface-coating layer that contains a crystalline inorganic material and an
amorphous binder on the outer peripheral face of the base of the exhaust pipe.
Provision of a surface-coating layer containing a crystalline inorganic material and
an amorphous binder increases the emissivity of the outer peripheral face of the exhaust
pipe, thereby increasing the amount of radiation heat from the outer peripheral face
of the exhaust pipe. Then, the radiation heat from the outer peripheral face of the
exhaust pipe is received by the heat-receiving member of the present invention which
demonstrates excellent performance in receiving heat.
That is, improvement in the amount of radiation heat from the outer peripheral face
of the exhaust pipe is combined with improvement in the amount of heat received by
the heat-receiving member, which more effectively prevents the temperature of the
exhaust pipe from rising too high.
[0148] (12) The exhaust pipe of the exhaust pipe heat-releasing system of the present embodiment
has an emissivity (emissivity of the surface-coating layer) of 0.78 or more. Emissivity
of the exhaust pipe in such a range increases the amount of radiation heat from the
outer peripheral face of the exhaust pipe. As a result, it is possible to still more
effectively prevent the temperature of the exhaust pipe from rising too high.
(Other Embodiments)
[0149] In the case where the heat-receiving member of the present invention is used as a
heat-receiving member for receiving heat from an exhaust manifold of an engine, the
heat-receiving member may be arranged as a different member from a heat insulator.
Fig. 17 is an exploded perspective view schematically illustrating exemplary arrangement
of the heat-receiving member of the present invention as a different member from the
heat insulator.
In Fig. 17, the heat-receiving member 1 of the present invention is arranged between
the exhaust manifold 111 and the heat insulator 118, with the surface layer 30 of
the heat-receiving member 1 being on the exhaust manifold 111 side.
Even such arrangement of a heat-receiving member makes it possible to increase the
cooling ability of an exhaust manifold.
BRIEF DESCRIPTION OF THE DRAWINGS
[0150]
Fig. 1 is an exploded perspective view which illustrates a vehicle engine and a vicinity
of an exhaust pipe connected to the vehicle engine.
Fig. 2 is a cross-sectional view schematically illustrating an exemplary heat-receiving
member.
Fig. 3 is a cross-sectional view schematically illustrating an exemplary heat-receiving
member.
Fig. 4 is a cross-sectional view schematically illustrating an exemplary heat-receiving
member.
Fig. 5 is a cross-sectional view schematically illustrating an exemplary exhaust pipe
heat-releasing system.
Fig. 6 is a cross-sectional view schematically illustrating a method of measuring
heat receiving performance of a heat-receiving member.
Fig. 7 is a cross-sectional view schematically illustrating an exemplary heat-receiving
member.
Fig. 8 is a cross-sectional view schematically illustrating an exemplary heat-receiving
member.
Fig. 9 is a cross-sectional view schematically illustrating an exemplary heat-receiving
member.
Fig. 10 is a view showing the relationships between the locations of temperature measurement
and the temperatures of the respective heat-receiving members which were measured
in Example 2 and Examples 6 to 9.
Fig. 11 is a cross-sectional view schematically illustrating an exemplary heat-receiving
member of the present invention.
Fig. 12 is a scanning electron microscope photograph that shows a surface of a surface
layer of an exemplary heat-receiving member of the present invention which has cracks
in the surface layer.
Fig. 13 is a scanning electron microscope photograph that shows a surface of a surface
layer of an exemplary heat-receiving member of the present invention which has cracks
in the surface layer.
Fig. 14 is a scanning electron microscope photograph that shows a surface of a surface
layer of an exemplary heat-receiving member of the present invention which has cracks
in the surface layer.
Fig. 15 is a cross-sectional view schematically illustrating an exemplary heat-receiving
member.
Fig. 16 is a cross-sectional view schematically illustrating an exemplary exhaust
pipe heat-releasing system of the present invention.
Fig. 17 is an exploded perspective view schematically illustrating exemplary arrangement
of a heat-receiving member of the present invention as a different member from a heat
insulator.
EXPLANATION OF SYMBOLS
[0151]
- 1 to 11
- Heat-receiving member
- 20
- Base (base of heat-receiving member)
- 30, 30a, 30b
- Surface layer
- 40, 40a, 40b
- Micropore
- 50, 50a, 50b
- Metal
- 60, 61, 62, 63
- Crack
- 100, 150
- Exhaust pipe heat-releasing system
- 101, 151
- Exhaust pipe
- 102
- Base (base of exhaust pipe)
- 103
- Surface-coating layer
- 110
- Engine
- 111
- Exhaust manifold (exhaust pipe)
- 118
- Heat insulator