(19)
(11) EP 2 575 149 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
24.09.2014 Bulletin 2014/39

(43) Date of publication A2:
03.04.2013 Bulletin 2013/14

(21) Application number: 12179082.8

(22) Date of filing: 02.08.2012
(51) International Patent Classification (IPC): 
H01H 1/02(2006.01)
H01H 33/664(2006.01)
 H01H 11/04(2006.01)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME

(30) Priority: 27.09.2011 JP 2011210080

(71) Applicant: Hitachi Ltd.
Tokyo (JP)

(72) Inventors:
  • Kikuchi, Shigeru
    Tokyo, 100-8220 (JP)
  • Sato, Takashi
    Tokyo, 100-8220 (JP)
  • Morita, Ayumu
    Tokyo, 100-8220 (JP)
  • Okamoto, Kazutaka
    Tokyo, 100-8220 (JP)
  • Yabu, Masato
    Tokyo, 100-8220 (JP)
  • Tsuchiya, Kenji
    Tokyo, 100-8220 (JP)

(74) Representative: Beetz & Partner 
Patentanwälte Steinsdorfstraße 10
80538 München
80538 München (DE)

   


(54) Joining structures, electrical contacts, and their manufacturing means


(57) A joining structure includes plural members and an adhered and deposited layer formed by depositing powder containing metal over the plurality of members. The plural members are joined via coupling with alloying by thermal and mechanical activation between the plural members and the adhered and deposited layer. A substrate is made of a metal of high electrical conductivity. A member to be joined is formed in a cup shape and made of metal of high electrical conductivity. The adhered and deposited layer is a contact layer including fire-resistant metal or compound and metal of high electrical conductivity. One surface of the substrate and a cup-shaped opened end of the member to be joined are joined with the alloying by thermal and mechanical activation.







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