Technical Field
[0001] The present invention relates to a transfer mold manufacturing method, a transfer
mold manufactured thereby, and a component produced by the transfer mold. More specifically,
the present invention relates to a method for manufacturing a transfer mold for production
of a component by electroplating, a transfer mold manufactured thereby, and a component
produced thereby, wherein the transfer mold has superior durability and high aspect
ratio.
Background Art
[0002] Electroplating allows formation of a thick film conductor with less restriction in
terms of dimension. It is therefore widely used in production of display components
such as a dial and hands of a watch, machine components such as a small gear, a spring,
a pipe and a diaphragm (pressure sensor) and electronic components such as a wiring
of a semiconductor device and a coil.
[0003] Patent Document 1 discloses manufacturing a cavity insert by: first creating a machined
master mold on which a fine pattern has been formed in advance; subsequently creating
a transfer master mold by hot press from the machined master mold; and then creating
the cavity insert by electroplating from the transfer master mold.
[0004] Patent Document 2 discloses manufacturing a watch dial by the steps of: forming a
mask pattern having openings on a surface of a silicon wafer; performing an anisotropic
etching; forming a common electrode film; forming an electroplated film which grows
on the common electrode film; etching the silicon wafer; and forming a resin watch
dial having protruding portions by using the electroplated film as a transfer mask.
[0005] Fig. 6 shows structural drawings of a component formed by using a conventional transfer
mold. In Fig. 6a, for the purpose of forming a component 95, a photoresist 30 is patterned
on a metal substrate 90 to a shape of the component by partially removing the same.
The metal substrate 90, on which the resist pattern has thus been formed, is used
as a transfer mold for electroplating (hereinafter referred to as "EP") a predetermined
metal (Ag, Cu, Ni, etc.) to form the component 95.
[0006] In Fig. 6b, the component 95 molded by EP is transferred onto an adhesive bond 85
and then adhered to a component substrate 97. In this manner, the component having
a given shape depending on its intended use is produced by EP and transferred onto
the component substrate 97 for use.
[0007] Here, for ease of release and transfer of the component 95, the angles β formed at
sidewalls of the photoresist 30 are each set to be a blunt angle of less than 45°.
In the meantime, when providing an electronic component such as a wiring, a coil,
etc. on a semiconductor substrate, there is a demand for such an aspect ratio that
a line thickness is greater than the line width so that electric resistance is reduced.
The thickness which the photoresist 30 is generally required to have is approximately
10 µm.
[0008] The component 95 is formed by EP in such a manner that it fills up along the sidewalls
of the photoresist 30 having the thickness of approximately 10 µm. As such, in a case
where a wiring pattern, a conductive coil or the like is formed as a long component,
it contacts the sidewalls in large area, resulting in increased release resistance
in the release and transfer of the component. That is, when using a transfer mold
made with patterned photoresist, the transfer of the component onto the component
substrate 97 requires an application of a release force that is comparable to the
increased release resistance. This causes the edge of the pattern of the photoresist
30, which is appressed to the metal substrate 90, to be easily stripped. In fact,
the resist is stripped after a few times of use, and as a result, a problem arises
that the transfer mold can then no longer be in use.
Citation List
Patent Documents
[0009]
Patent Document 1: Japanese Patent Application Laid-Open No. 2004-1535
Patent Document 2: Japanese Patent Application Laid-Open No. 2004-257861
Summary of the Invention
Problems to be solved by the Invention
[0010] The present invention has been made in order to solve the above problem, and its
purpose is to provide a transfer mold having superior durability and high aspect ratio
for production of a component by EP as well as to provide a component produced by
the transfer mold. It is to be noted that there are four types of transfer molds which
are: a master mold, a mother mold, a son mold, and a transfer mold. The master mold
is a mold which serves as a prototype for component production. Usually, it is not
directly used for component production. The mother mold is a mold which is created
by using the master mold so as to have an inverse contour of the master mold. The
mother mold as well is not directly used for the component production. The son mold
is a mold which is created by using the mother mold so as to have an inverse contour
of the mother mold. Therefore, the son mold has a shape that is identical with the
master mold. The transfer mold is generally formed by subjecting the son mold to an
insulation layer formation process, a releasing layer formation process, etc. The
component production is then carried out with use of this transfer mold, and when
it is worn off, a new transfer mold is created again from the master mold by way of
the mother mold and the son mold.
Means for solving the Problems
[0011] A transfer mold manufacturing method of the present invention includes steps of:
forming a resist pattern having a shape of a component with a desired aspect ratio
on a metal substrate, a sidewall of the resist pattern forming a desired angle α;
creating a transfer mold by filling up the resist pattern having the shape of the
component by electroplating to a predetermined thickness; and providing a master mold
by separating the transfer mold from the metal substrate leaving the metal substrate
and the resist pattern.
[0012] A transfer mold manufacturing method of the present invention includes steps of:
forming a resist pattern having a shape of a component with a desired aspect ratio
on a metal substrate, a sidewall of the resist pattern forming a desired angle α;
creating a transfer mold by filling up the resist pattern having the shape of the
component by electroplating to a predetermined thickness; providing a master mold
by separating the transfer mold from the metal substrate leaving the metal substrate
and the resist pattern; creating a son mold by transferring by way of the master mold
and a mother mold; and providing a transfer mold by performing, on the son mold, a
releasing layer formation process for facilitating a release of the component to be
formed by electroplating and an insulation layer formation process for forming an
insulation layer in that portion which is other than a portion in which the component
is to be formed.
[0013] The transfer mold manufacturing method of the present invention includes a step of
forming a roughening layer on a surface of the metal substrate as a first step.
[0014] A transfer mold manufacturing method of the present invention includes steps of:
forming a resist pattern having a shape of a component with a desired aspect ratio
on a metal substrate, a sidewall of the resist pattern forming an angle of approximately
90°; creating a transfer mold by filling up the resist pattern having the shape of
the component by electroplating to a predetermined thickness; separating the transfer
mold from the metal substrate; removing a photoresist partially to leave a resist
pattern layer in that portion of the separated transfer mold which is other than a
portion corresponding to the component to be transferred; and providing a master mold
by treating the sidewall of the shape of the component with beam irradiation using
the resist pattern layer as a protective layer, the beam irradiation being modulated
such that the angle at the sidewall is tailored to form approximately 90° or a given
angle less than 90°
[0015] A transfer mold manufacturing method of the invention of the instant application
includes steps of: forming a resist pattern having a shape of a component with a desired
aspect ratio on a metal substrate, a sidewall of the resist pattern forming an angle
of approximately 90°; creating a transfer mold by filling up the resist pattern having
the shape of the component by electroplating to a predetermined thickness; separating
the transfer mold from the metal substrate; removing a photoresist partially to leave
a resist pattern layer in that portion of the separated transfer mold which is other
than a portion corresponding to the component to be transferred; providing a master
mold by treating the sidewall of the shape of the component with beam irradiation
using the resist pattern layer as a protective layer, the beam irradiation being modulated
such that the angle at the sidewall is tailored to form approximately 90° or a given
angle less than 90°; creating a son mold by transferring by way of the master mold
and a mother mold; and providing a transfer mold by performing, on the son mold, a
releasing layer formation process for facilitating a release of the component to be
formed by electroplating and an insulation layer formation process for forming an
insulation layer in that portion which is other than a portion in which the component
is to be formed.
[0016] The method of the present invention includes a step of forming a roughening layer
on a surface of the metal substrate as a first step.
[0017] A master mold of the present invention is manufactured by the above-described method
and has a cross-sectional surface with a desired aspect ratio, a sidewall of the cross-sectional
surface forming an angle between 45° and 88°.
[0018] A transfer mold of the present invention is provided by subjecting the son mold created
by using the above-described master mold to only an insulation layer formation process
or to the insulation layer formation process and a releasing layer formation process.
[0019] A component produced by electroplating in the present invention is molded by the
electroplating using the above-described transfer mold and transferred.
[0020] Advantageous Effect of the Invention
[0021] The present invention makes it possible to provide a component having superior durability
and high aspect ratio formed by EP in manufacturing display components, machine components
and electronic components by EP.
Brief Description of the Drawings
[0022]
Fig. 1 is a process drawing showing the steps for manufacturing a master mold by electroplating
according to the present invention.
Fig. 2 is a process drawing showing the steps for manufacturing a master mold by beam
treatment according to the present invention.
Fig. 3 is a process drawing showing the steps for manufacturing a son mold according
to the present invention.
Fig. 4 is a process drawing showing the steps for manufacturing a transfer mold according
to the present invention.
Fig. 5 is a process drawing showing the steps for manufacturing a component according
to the present invention.
Fig. 6 is a structural drawing showing a component formed by using a conventional
transfer mold.
Mode for carrying out the Invention
Embodiments
[0023] A first embodiment of the present invention is described with reference to the drawings.
Fig. 1 is a process drawing showing the steps for manufacturing a master mold by electroplating
according to the present invention. In Fig. 1a, a top surface of a metal substrate
10 is provided with a roughening layer 15 for roughening a contact surface of a master
mold to be formed by EP. The roughening layer 15 may be formed by roughening the surface
of the metal substrate 10 directly by hydrochloric acid treatment or the like. Alternatively,
a stripe-like photo resist pattern layer, a lattice-like photo resist pattern layer
or the like, which is suitable for roughening, may be formed as the roughening layer
15 by partially removing the photoresist. In a case where an insulation layer and
others are formed on a son mold 60 described later with reference to Fig. 3, the roughening
layer 15 may be omitted as long as there is no problem of adhesion strength therebetween.
[0024] In Fig. 1b, a photoresist 30 for forming a pattern of a shape of a component to be
produced is applied onto the roughening layer 15 on the metal substrate 10 to a predetermined
thickness. This is for the purpose of obtaining a component having such a shape that
has a desired aspect ratio and desired angles α at sidewalls thereof. For example,
in a case where a wiring of a semiconductor electronic component or a coil with a
line width of 5 µm is to be produced, the photoresist 30 is applied to a thickness
of 10 µm so that the electronic component or the coil has the thickness of 10 µm.
The photoresist 30 is then subjected to an exposure effected from the direction of
the arrows with an intervening photomask 40 having a pattern of a desired component.
Fig. 1c shows the pattern of the component formed by subjecting the resist pattern
to the exposure as shown in Fig. 1b and a development. The angles α formed at the
respective sidewalls of the resist pattern of the component can optionally be determined
depending on the material and film thickness of the applied photoresist 30 as well
as the exposure condition to the irradiation performed with the intervening photomask
40 as shown in Fig. 1b. Where laser light is used, a 3D lens may be employed to vary
the irradiation intensity on the both sidewalls of the resist pattern. The irradiation
intensity on the both sidewalls may also be varied by means of a gray mask.
[0025] In Fig. 1d, a desired metal, e.g., Ni, is electroplated to a predetermined thickness
so as to cover the resist pattern 30 shown in Fig. 1c, thereby creating a master mold
20. In Fig. 1e, the master mold 20 created by EP in Fig. 1d is separated from the
metal substrate 10. Here, the rough surface profile of the roughening layer 15 has
been transferred to a roughened surface layer 17 of the master mold. The angles α
at the both sidewalls remain to be the angles α in Fig. 1d.
[0026] It is intended that the roughened surface layer 17 of the master mold is transferred
to the son mold 60, which is eventually used as the transfer mold and illustrated
in Fig. 3, for the sake of increased adhesion strength to an insulation layer to be
formed thereon. As such, it is not necessarily required. In addition, making the angles
α as acute as 45° to 88° allows the pattern density of an intended device to be improved.
The 10 µm thickness of the photoresist 30 in Fig. 1c is maintained in the inverted
master mold 20 by being transferred.
[0027] Fig. 2 is a process drawing showing the steps for manufacturing a master mold by
beam treatment according to the present invention. This is a second embodiment of
the present invention. Fig. 2a shows the master mold 20 created by the method illustrated
in Fig. 1. Here, the angles α are each approximately 90°. In Fig. 2b, the photoresist
30 for forming a reverse pattern of the shape of the component is applied to a predetermined
thickness. The photoresist 30 is then subjected to an exposure effected from the direction
of the arrows with an intervening photomask 40 having the reverse pattern of the component.
As a result, that portion of the resist which corresponds to the component is developed
and removed, thereby leaving the photoresist 30 only on the flat roughened surface
layer 17 of the master mold.
[0028] In Fig. 2c, the resist pattern formed in Fig. 2b is used as a protective film in
treating the sidewalls of the pattern of the component with beam irradiation. Here,
the irradiation beam is modulated in such a manner that the angles α are tailored
to form predetermined degrees. The arrows show the direction of the beam. The treated
master mold 20 shown in Fig. 2d has not only the same shape but also the same function
and characteristics as the master mold 20 shown in Fig. 1d. The irradiation beam may
be an electron beam, an ion beam, or a FIB (Focused Ion Beam) whose irradiation strength
is variable by focusing the beam with a lens.
[0029] Fig. 3 is a process drawing showing the steps for manufacturing a son mold according
to the present invention. In Fig. 3a, a desired metal, e.g., Ni, is electroplated
to a predetermined thickness on that surface of the master mold 20 manufactured in
Fig. 1 or 2 on which the pattern of the component has been formed. A mother mold 50
created thereby is then separated. In Fig. 3b, a desired metal, e.g., Ni, is electroplated
to a predetermined thickness on that surface of the mother mold 50 on which the pattern
of the component has been formed, so that a son mold 60 is created in the same manner.
In Fig. 3c, the son mold 60 thus created by EP is separated from the mother mold 50.
[0030] In this way, the son mold 60 is created by transferring the mother mold 50 created
by transferring the master mold 20. As such, it takes over the same function and characteristics
as those of the master mold 20. Furthermore, the son mold 60 is integrally formed
of one metal material. This, with the releasing layer formation process and the insulation
layer formation process performed on a roughened surface layer 19 of the son mold
as will be explained next, makes it possible to obtain a transfer mold which has a
desired aspect ratio and angles α, does not break even after repetitive use, and is
highly suitable for quantity production.
[0031] Fig. 4 is a process drawing showing the steps for manufacturing a transfer mold according
to the present invention. Fig. 4a shows the son mold 60 created in Fig. 3c. In Fig.
4b, the son mold 60 is subjected to heat treatment under prescribed conditions for
ease of release and transfer of the component to be produced. This is followed by
the releasing layer formation process for forming a NiOx film 70 having a predetermined
thickness on the surface of the son mold 60. Since the NiOx film 70 is conductive,
it does not hinder EP. Moreover, the low adhesive property thereof to the electroplated
component allows an easy release.
[0032] Subsequently, an insulation layer is formed in order to prevent EP in that portion
of the surface which is other than the portion in which the component is to be formed.
This is accomplished by the insulation layer formation process for forming a SiO
2 film 80 chemically by CVD (Chemical Vapor Deposition) or physically by sputtering
on said portion of the surface. Alternatively, the SiO
2 film 80 is formed by applying polysilazane and treating it with heat. In Fig. 4c,
in order to remove the SiO
2 film 80 formed on the pattern of the component, the photoresist 30 to be patterned
to a predetermined shape is applied on the SiO
2 film 80. After that, the photoresist is partially removed by subjecting the same
to an exposure effected from the direction of the arrows with an intervening photomask
40 having the reverse pattern of the component. Then, in Fig. 4d, with use of the
patterned photoresist 30 as a mask, the SiO
2 film 80 is removed physically by beam irradiation from the direction of the arrows
or chemically by hydrofluoric acid treatment or the like.
[0033] Depending on the shape of the patterned photoresist 30 and the removal conditions
of the SiO
2 film 80, the transfer mold is completed either by removing the SiO
2 film 80 only in the bottom portion so that it is left on the sidewalls as shown in
Fig. 4e or by removing the SiO
2 film 80 both on the sidewalls and in the bottom portion as shown in Fig. 4f. In a
case where polysilazane is used, similar steps as in screen printing are carried out.
That is, following the formation of the NiOx film 70 in Fig. 4b, polysilazane is printed
in that portion of the surface of the NiOx film 70 which is other than the pattern
of the component for forming the component. It is then treated with heat. In this
manner, the same shape as shown in Fig. 4f can be obtained.
[0034] The releasing layer formation process is performed by, as shown in Fig. 4b, depositing
metal oxides (AlOx, TiOx, etc.), nitrides or organic substances (resist) on the son
mold 60 to such a thickness of 1 to 1000 Å that allows the conductivity thereof to
be maintained. For the insulation layer formation process, an insulator such as resist
may be used instead of SiO
2. Note that the releasing layer formation process and the insulation layer formation
process may be performed in reverse order.
[0035] Now, description is made for the component produced by EP with use of the transfer
mold according to the present invention. Fig. 5 is a process drawing showing the steps
for manufacturing a component using the transfer mold according to the present invention.
In Fig. 5a, a desired metal (Ag, Cu, Ni, etc.) is electroplated on the transfer mold
60 to form the component 95. In Fig. 5b, the component 95 molded by EP is, as in the
case shown in Fig. 6b, transferred onto the adhesive bond 85 and then adhered to the
component substrate 97. Alternatively, the component 95 is adhered to a green sheet
98 which is then treated with heat for curing. Where the component 95 is adhered to
the green sheet 98, the use of the adhesive bond 85 is eliminated by such softness
of the green sheet 98 before curing that the component 95 is buried therein. In this
way, the component 95 of an optional shape having a desired aspect ratio and angles
α is provided by EP. It can be repetitively molded and transferred onto the device
substrate 97 or green sheet 98 for diverse intended use.
[0036] As described above, the present invention is able to provide a component having superior
durability and high aspect ratio in production, by EP, of display components such
as a dial and hands of a watch, machine components such as a small gear, a spring,
a pipe and a diaphragm (pressure sensor), and electronic components such as a wiring
of a semiconductor device and a coil.
Description of Reference Numerals
[0037]
- 10
- metal substrate
- 15
- master mold roughening layer
- 17
- roughened surface layer of master mold
- 18
- roughened surface layer of mother mold
- 19
- roughened surface layer of son mold
- 20
- master mold
- 30
- photoresist
- 40
- photomask
- 50
- mother mold
- 60
- son mold
- 70
- NiOx
- 75
- release treatment layer
- 80
- SiO2/polysilazane
- 85
- adhesive bond
- 90
- metal substrate
- 95
- component
- 97
- component substrate
- 98
- green sheet
- α
- angle at sidewall
- β
- angle at sidewall
1. A transfer mold manufacturing method comprising steps of:
forming a resist pattern having a shape of a component with a desired aspect ratio
on a metal substrate, a sidewall of the resist pattern forming a desired angle α;
creating a transfer mold by filling up the resist pattern having the shape of the
component by electroplating to a predetermined thickness; and
providing a master mold by separating the transfer mold from the metal substrate.
2. A transfer mold manufacturing method comprising steps of:
forming a resist pattern having a shape of a component with a desired aspect ratio
on a metal substrate, a sidewall of the resist pattern forming a desired angle α;
creating a transfer mold by filling up the resist pattern having the shape of the
component by electroplating to a predetermined thickness;
providing a master mold by separating the transfer mold from the metal substrate ;
creating a son mold by transferring by way of the master mold and a mother mold; and
providing a transfer mold by performing, on the son mold, a releasing layer formation
process for facilitating a release of the component to be formed by electroplating
and an insulation layer formation process for forming an insulation layer in that
portion which is other than a portion in which the component is to be formed.
3. The method according to claim 1 or 2, comprising a step of forming a roughening layer
on a surface of the metal substrate as a first step.
4. A transfer mold manufacturing method comprising steps of:
forming a resist pattern having a shape of a component with a desired aspect ratio
on a metal substrate, a sidewall of the resist pattern forming an angle of approximately
90°;
creating a transfer mold by filling up the resist pattern having the shape of the
component by electroplating to a predetermined thickness;
separating the transfer mold from the metal substrate;
removing a photoresist partially to leave a resist pattern layer in that portion on
the separated transfer mold which is other than a portion corresponding to the component
to be transferred; and
providing a master mold by treating the sidewall of the shape of the component with
beam irradiation using the resist pattern layer as a protective layer, the beam irradiation
being modulated such that the angle at the sidewall is tailored to form approximately
90° or a given angle less than 90°
5. A transfer mold manufacturing method comprising steps of:
forming a resist pattern having a shape of a component with a desired aspect ratio
on a metal substrate, a sidewall of the resist pattern forming an angle of approximately
90°;
creating a transfer mold by filling up the resist pattern having the shape of the
component by electroplating to a predetermined thickness;
separating the transfer mold from the metal substrate;
removing a photoresist partially to leave a resist pattern layer in that portion on
the separated transfer mold which is other than a portion corresponding to the component
to be transferred;
providing a master mold by treating the sidewall of the shape of the component with
beam irradiation using the resist pattern layer as a protective layer, the beam irradiation
being modulated such that the angle at the sidewall is tailored to form approximately
90° or a given angle less than 90°;
creating a son mold by transferring by way of the master mold and a mother mold; and
providing a transfer mold by performing, on the son mold, a releasing layer formation
process for facilitating a release of the component to be formed by electroplating
and an insulation layer formation process for forming an insulation layer in that
portion which is other than a portion in which the component is to be formed.
6. The method according to claim 4 or 5, comprising a step of forming a roughening layer
on a surface of the metal substrate as a first step.
7. A master mold manufactured by the method according to any one of claims 1, 3, 4 and
6 having a cross-sectional surface with a desired aspect ratio, a sidewall of the
cross-sectional surface forming an angle between 45° and 88°.
8. A transfer mold manufactured by the method according to any one of claims 2, 3, 5
and 6.
9. A component produced by electroplating, the component being molded by the electroplating
using the transfer mold according to claim 8 and transferred.
Amended claims under Art. 19.1 PCT
1. A transfer mold manufacturing method comprising steps of:
forming a resist pattern having a shape of a component with a desired aspect ratio
on a metal substrate, a sidewall of the resist pattern forming a desired angle α;
creating a transfer mold by filling up the resist pattern having the shape of the
component by electroplating to a predetermined thickness; and
providing a master mold by separating the transfer mold from the metal substrate leaving
the metal substrate and the resist pattern.
2. A transfer mold manufacturing method comprising steps of:
forming a resist pattern having a shape of a component with a desired aspect ratio
on a metal substrate, a sidewall of the resist pattern forming a desired angle α;
creating a transfer mold by filling up the resist pattern having the shape of the
component by electroplating to a predetermined thickness;
providing a master mold by separating the transfer mold from the metal substrate leaving
the metal substrate and the resist pattern;
creating a son mold by transferring by way of the master mold and a mother mold; and
providing a transfer mold by performing, on the son mold, a releasing layer formation
process for facilitating a release of the component to be formed by electroplating
and an insulation layer formation process for forming an insulation layer in that
portion which is other than a portion in which the component is to be formed.
3. The method according to claim 1 or 2, comprising a step of forming a roughening layer
on a surface of the metal substrate as a first step.
4. A transfer mold manufacturing method comprising steps of:
forming a resist pattern having a shape of a component with a desired aspect ratio
on a metal substrate, a sidewall of the resist pattern forming an angle of approximately
90°;
creating a transfer mold by filling up the resist pattern having the shape of the
component by electroplating to a predetermined thickness;
separating the transfer mold from the metal substrate;
removing a photoresist partially to leave a resist pattern layer in that portion on
the separated transfer mold which is other than a portion corresponding to the component
to be transferred; and
providing a master mold by treating the sidewall of the shape of the component with
beam irradiation using the resist pattern layer as a protective layer, the beam irradiation
being modulated such that the angle at the sidewall is tailored to form approximately
90° or a given angle less than 90°
5. A transfer mold manufacturing method comprising steps of:
forming a resist pattern having a shape of a component with a desired aspect ratio
on a metal substrate, a sidewall of the resist pattern forming an angle of approximately
90°;
creating a transfer mold by filling up the resist pattern having the shape of the
component by electroplating to a predetermined thickness;
separating the transfer mold from the metal substrate;
removing a photoresist partially to leave a resist pattern layer in that portion on
the separated transfer mold which is other than a portion corresponding to the component
to be transferred;
providing a master mold by treating the sidewall of the shape of the component with
beam irradiation using the resist pattern layer as a protective layer, the beam irradiation
being modulated such that the angle at the sidewall is tailored to form approximately
90° or a given angle less than 90°;
creating a son mold by transferring by way of the master mold and a mother mold; and
providing a transfer mold by performing, on the son mold, a releasing layer formation
process for facilitating a release of the component to be formed by electroplating
and an insulation layer formation process for forming an insulation layer in that
portion which is other than a portion in which the component is to be formed.
6. The method according to claim 4 or 5, comprising a step of forming a roughening layer
on a surface of the metal substrate as a first step.
7. A master mold manufactured by the method according to any one of claims 1, 3, 4 and
6 having a cross-sectional surface with a desired aspect ratio, a sidewall of the
cross-sectional surface forming an angle between 45° and 88°.
8. A transfer mold manufactured by the method according to any one of claims 2, 3, 5
and 6.
9. A component produced by electroplating, the component being molded by the electroplating
using the transfer mold according to claim 8 and transferred.