(19)
(11) EP 2 713 393 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
24.12.2014 Bulletin 2014/52

(43) Date of publication A2:
02.04.2014 Bulletin 2014/14

(21) Application number: 13186884.6

(22) Date of filing: 01.10.2013
(51) International Patent Classification (IPC): 
H01L 23/473(2006.01)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME

(30) Priority: 01.10.2012 US 201213632332
02.10.2012 US 201213633167

(71) Applicant: Hamilton Sundstrand Corporation
Windsor Locks, CT 06096-1010 (US)

(72) Inventors:
  • Pearson, Matthew Robert
    Hartford, CT 06103 (US)
  • St.Rock, Brian
    Andover, CT 06232 (US)

(74) Representative: Leckey, David Herbert 
Dehns St Bride's House 10 Salisbury Square
London EC4Y 8JD
London EC4Y 8JD (GB)

   


(54) Dielectrophoretic cooling solution for electronics


(57) At least one cooling channel (134) is positioned adjacent to an electronic component. The cooling channel (134) communicates with plenums (36,38) at each of two opposed axial ends. A dielectric fluid is received in the cooling channel (134). The cooling channel is provided with at least one electrode (50,56,62,64,66). A potential is applied to the at least one electrode (50,56,62,64,66) such that an electric field magnitude at the downstream end of the channel (134) is less than an upstream electric field magnitude, and such that a dielectrophoretic force on a bubble in the cooling channel (134) will force it downstream.







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Search report