Organic light emitting display

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

[0001] Embodiments relate to organic light emitting displays. More particularly, embodiments relate to organic light emitting displays including electrostatic discharge (ESD) protection such that the organic light emitting display may be protected against ESD.

2. Description of the Related Art

[0002] US 2005/258769 A1 discloses electro-optical device and method of effectively checking a plurality of unit circuits, each including an electro-optical element and a control circuit.

[0003] JP 2005 346982 A discloses a display device having excellent display characteristics with degradation of a resistor alleviated, and a manufacturing method of the display device.

[0004] JP 11 233777 A discloses a dummy terminal formed in an end portion on which input terminals are arranged is connected with the adjacent input terminal via a resistance part to prevent electrostatic breakdown in a driver integral type LCD.

[0005] US 2004/100608 A1 provides a circuit substrate including an electrostatic breakdown-protection circuit efficient for an EL display panel or the like.

[0006] JP 2002 214635 A discloses a liquid crystal display wherein the terminal for connection is formed having its tip extended to the end side of the outer periphery of a TFT substrate and a high-resistance area of high electric resistance is formed from the tip to the inside of the TFT substrate by specific length.

[0007] Document JP04100270 describes a static electricity protective circuit using an input resistor.

[0008] Document JP02054894 describes a thin film EL display element wherein back plates are connected to terminal electrodes through resistors having resistance values higher than those of the back plates.

[0009] In general, an organic light emitting display has a self-emission characteristic, larger viewing angle, improved contrast, improved response speed, and lower power consumption than liquid crystal displays (LCDs). Organic light emitting displays do not require a back light, and may be lighter and thinner than LCDs.

[0010] Organic light emitting displays generally include a substrate having a pixel region and a non-pixel region, and a container or an encapsulation substrate. The container or the encapsulation substrate may face the substrate so as to encapsulate the substrate, and may be attached to the substrate by a sealant, e.g., epoxy.

[0011] A plurality of organic light emitting diodes (OLEDs) coupled between scan lines and data lines, and arranged in a matrix manner, form pixels in the pixel region of the substrate. Portions of scan lines and data lines extending from the scan lines and the data lines of the pixel region, power source supply lines for operating the OLEDs, and a scan driver and a data driver for processing external signals supplied through input pads and supplying the processed signals to the scan lines and the data lines are formed in the non-pixel region.

[0012] A film-shaped flexible printed circuit (FPC) (not shown) is electrically coupled with the pad of the organic light emitting display having the above structure. Signals, e.g., power source voltages, scan signals, and data signals, are input from the outside through the FPC.

[0013] When the signals are input, via the input pads, to the power source supply lines, the scan driver, and the data driver, the scan driver and the data driver respectively supply the scan signals and the data signals to the scan lines and the data lines. The OLEDs of the pixels selected by the scan signals emit light corresponding to the data signals.

[0014] Since the substrate of the organic light emitting display is formed of glass, a relatively large amount of electrostatic discharge (ESD) is generated during manufacturing and/or operation of the organic light emitting display. If the OLEDs and/or driving circuits, which operate at high speed and at a low voltage, are subjected to such ESD, the OLEDs and/or the driving circuits can erroneously operate and/or can be damaged due to the electric influence. When the driving circuits are subjected to the externally generated ESD through internal signal lines, operation of the driving circuits can be instantaneously stopped. As an amount and/or number of occurrences of ESD generation and/or the voltage increases, circuit wiring lines are more likely to be broken or shorted. In general, the driving circuits are more severely damaged by such ESD as the driving circuits are highly integrated (minimized).

SUMMARY OF THE INVENTION

[0015] Embodiments of the invention are therefore directed to organic light emitting displays, which substantially overcome one or more of the problems due to the limitations and disadvantages of the related art.

[0016] It is therefore a feature of an embodiment of the invention to provide organic light emitting displays capable of effectively preventing and/or reducing electrostatic discharge (ESD) from being received through input pads.

[0017] At least one of the above and other features and advantages of the invention may be realized by providing an organic light emitting display as set out in Claim 1. Preferred features of the invention are set out in Claims 2-11.

BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and other features and advantages of the present invention will become more apparent to those of ordinary skill in the art by describing in detail exemplary embodiments thereof with reference to the attached drawings, in which:

FIG. 1 illustrates a plan view of an organic light emitting display according to an embodiment of the present invention;

FIG. 2 illustrates a cross-sectional view of the organic light emitting diode (OLED) of FIG. 1;

FIG. 3 illustrates a plan view of exemplary input pads of FIG. 1;

FIG. 4 illustrates a cross-sectional view taken along line I1-I2 of FIG. 3;

FIG. 5 illustrates a plan view of the exemplary input pads of FIGS. 1 and 3 in a state in which a circuit board contacts respective contact units of the input pads;

FIG. 6 illustrates a cross-sectional view taken along line I11-I12 of FIG. 5; and

FIG. 7 illustrates a plan view of the exemplary input pads of FIGS. 1 and 3 in a state in which a circuit board contacts contact units and lead units of the input pads.

DETAILED DESCRIPTION OF THE INVENTION

[0019] Exemplary embodiments will now be described more fully hereinafter with reference to the accompanying drawings; however, they may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0020] In the drawing figures, the dimensions of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when an element is referred to as being "between" two elements, it can be the only element between the two layers, or one or more intervening elements may also be present. Like reference numerals refer to like elements throughout the specification.

[0021] FIG. 1 illustrates a plan view of an organic light emitting display according to an embodiment the invention.

[0022] Referring to FIG. 1, the organic light emitting display may include a substrate 100, scan lines 122, data lines 124, and organic light emitting diodes (OLEDs) 120, coupled between the scan lines 122 and the data lines 124, in a matrix arrangement. Each of the OLEDs 120, and respective portions of corresponding ones of the scan lines 122, and the data lines 124, may form pixels.

[0023] The substrate 100 may include a pixel region 114 and a non-pixel region 116. The scan lines 122 and the data lines 124 may extend across the pixel region 114 and the non-pixel region 116. In the non-pixel region 116, respective portions of the scan lines 122 and the data lines 124, power source supply lines (not shown) for operating the OLEDs 120, a scan driver 130, and a data driver 140 may be formed. The scan driver 130 and the data driver 140 may process external signals supplied through input pads 126, and may supply the processed signals to the scan lines 122 and the data lines 124, respectively.

[0024] In a passive matrix type organic light emitting display, the OLEDs 120 may be coupled between the scan lines 122 and the data lines 124 in a matrix arrangement. In an active matrix type organic light emitting display, the OLEDs 120 may be coupled between the scan lines 122 and the data lines 124 in a matrix arrangement together with thin film transistors (TFTs) (not shown) and capacitors (not shown). The TFTs may control operations of the OLEDs 120 and the capacitors may function to maintain signals.

[0025] The scan driver 130 and the data driver 140 may be formed on the non-pixel region 116 of the substrate 100. In some embodiments, the scan driver 120 and the data driver 140 may be manufactured during processing of the OLEDs 120. In some embodiments, the scan driver 120 and the data driver 140 may be manufactured as an additional integrated circuit semiconductor chip to be attached to the substrate 100, e.g., via a chip on glass (COG) method or a wire bonding method, and electrically coupled with the scan lines 122 and the data lines 124.

[0026] FIG. 2 illustrates a cross-sectional view of the OLED 120 of FIG. 1, in which an example of the active matrix type OLED is schematically illustrated.

[0027] Referring to FIG. 2, the OLED may include a buffer layer 101, a semiconductor layer 102, a gate insulating layer 103, a gate electrode 104, an interlayer insulating layer 105, source and drain electrodes 106a and 106b, a planarizing layer 107, an anode electrode 108, a pixel defining layer 109, an organic thin layer 110, and a cathode electrode 111.

[0028] The buffer layer 101 may be formed on the substrate 100. The semiconductor layer 102 may be formed on the buffer layer 101. The semiconductor layer 102 may provide an active layer. More particularly, the semiconductor layer 102 may provide source, drain, and channel regions of the TFTs. The gate insulating layer 103 may be formed on a top surface of the buffer layer 101 and may cover the semiconductor layer 102.

[0029] The gate electrode 104 may be formed on the gate insulating layer 103 formed on the semiconductor layer 102. The interlayer insulating layer 105 may be formed on the gate insulating layer 103 and may cover the gate electrode 104. Contact holes may be formed in the interlayer insulating layer 105 and the gate insulating layer 103 to expose predetermined parts of the semiconductor layer 102. The source and drain electrodes 106a and 106b may be coupled with the semiconductor layer 102 through the contact holes formed on the interlayer insulating layer 105.

[0030] The planarizing layer 107 may be formed on the interlayer insulating layer 105 to cover the source and drain electrodes 106a and 106b. A via hole may be formed in the planarizing layer 107 so that the source or drain electrode 106a or 106b may be exposed. The anode electrode 108 may be coupled with the source or drain electrode 106a or 106b through the via hole and may be formed on the planarizing layer 107. The pixel defining layer 109 may be formed on the planarizing layer 107. The pixel defining layer 109 may be patterned to expose the anode electrode 108 in this embodiment.

[0031] The organic thin layer 110 and the cathode electrode 111 may be formed on the anode electrode 108. More particularly, the organic thin layer 110 and the cathode electrode 111 may be formed on the exposed portion of the anode electrode 108. The organic thin layer 110 may be formed to have a structure in which a hole transport layer, an organic light emitting layer, and an electron transport layer are laminated together. The organic thin layer 110 may further include a hole injection layer and an electron injection layer.

[0032] FIG. 3 illustrates an enlarged plan view of a portion of the organic light emitting display including the input pads 126. FIG. 4 illustrates a cross-sectional view taken along line I1-I2 of FIG. 3. FIG. 5 illustrates a plan view of input pads 126 of FIG. 3 in a state in which the external circuit board 300 overlaps and contacts contact portions 126b of the input pads 126, and FIG. 6 illustrates a cross-sectional view taken along line 111-I12 of FIG. 5.

[0033] Referring to FIG. 3, the input pads 126 may be arranged on the substrate 100 by a predetermined distance. The input pads 126 may be coupled with driving circuits of the scan driver 130 and the data driver 140 through wiring lines 128.

[0034] As discussed above, in organic light emitting displays, the input pads 126 may be formed at an edge portion of the substrate 100, and may be vulnerable to electrostatic discharge (ESD).

[0035] According to the invention, resistors 200 for preventing and/or reducing over-current from instantaneously flowing due to the ESD are included in the input pads 126 and the input pads 126 include a plurality of portions, e.g., lead units 126a and contact units 126b. More particularly, the input pads 126 include lead units 126a that extend from the wiring lines 128 and contact units 126b. The contact units 126b may contact pads of an external circuit board 300 (shown in FIGs. 5 and 7). Corresponding pairs of the lead and contact units 126a, 126b may correspond to a respective one of the input pads 126. Further, the lead unit 126a and the corresponding contact unit 126b are spaced apart from each other, as shown, e.g., in FIGS. 3 and 4.

[0036] The resistors 200 are coupled between the lead units 126a and the contact units 126b. The resistors 200 may be formed of a conductive material, e.g., polysilicon. The resistors 200 are coupled with the lead units 126a and the contact units 126b through contact holes 240.

[0037] Referring to FIG. 4, the resistor 200 may be formed on the substrate 100. The resistor 200 may be formed of, e.g., polysilicon doped to have a predetermined resistance value. An insulating layer 220 is formed on the substrate 100 where the resistor 200 is formed. The lead units 126a and the contact units 126b are formed to be coupled with respective ends of the resistor 200 through contact holes 240 formed in the insulating layer 220.

[0038] Referring to FIGS. 2 and 4, the resistor 200 may be formed of the same material as the semiconductor layer 102, and may be formed during the process of forming the semiconductor layer 102. The insulating layer 220 may be formed of the same material as the gate insulating layer 103 and/or the interlayer insulating layer 105. The lead units 126a and the contact units 126b may be formed of a same electrode material as and during the process of forming the source and drain electrodes 106a and 106b, the anode electrode 108 and/or the cathode electrode 111.

[0039] In the embodiment illustrated in FIG. 5, the external circuit board 300 does not overlap and/or contact the lead units 126a of the input pads 126. However, embodiments are not limited thereto.

[0040] Referring to FIGS. 5 and 6, the circuit board 300, e.g., an external circuit board, may be coupled with the input pads 126 of the organic light emitting display having the structure illustrated in FIG. 3. The circuit board 300 may be formed of a film-shaped FPC. The circuit board 300 include pads 320. The pads 320 of the circuit board 300 may contact the contact units 126b so that signals, e.g., power source voltages, scan signals, and data signals, may be input from the outside.

[0041] When the signals are input to the power source voltage supply lines, the scan driver 130, and the data driver 140 through the input pads 126, the scan driver 130 and the data driver 140 may supply the scan signals and the data signals to the scan lines 122 and the data lines 124, respectively. Therefore, the OLEDs 120 of the pixels selected by the scan signals may emit light corresponding to the data signals. That is, when a predetermined voltage is applied to the anode electrode 108 and the cathode electrode 111 of the OLEDs 120 selected by the scan signals, holes injected through the anode electrode 108 and electrons injected through the cathode electrode 111 may be recombined in the organic thin layer 110 to emit light based on a difference in energy generated by this process. Red, green, or blue light may be emitted from each of the pixels in accordance with materials that form the organic light emitting layer of the respective pixel to realize colors of multi-gray scales.

[0042] As described above, in organic light emitting displays according to the invention, the resistors 200 are formed in the input pads 126, which may be vulnerable to ESD. Over-current caused by ESD may be reduced and/or prevented from flowing by the resistors 200. In some embodiments, all or substantially all of the over-current caused by ESD may be prevented from flowing by the resistors 200. Only driving signals may be supplied to the organic light emitting display so that the driving circuits and the OLEDs may be safely protected.

[0043] In the embodiment illustrated in FIGS. 3 and 4, the resistors 200 are included in all of the input pads 126. However, embodiments are not limited thereto. For example, in some embodiments, the resistors 200 may be formed only in some of the input pads 126.

[0044] Some embodiments may provide organic light emitting displays that may effectively reduce and/or prevent all and/or substantially all ESD from being received to the input pads 126 through the edge of the substrate 100 in a state where the circuit board 300 is not coupled with the input pads 126.

[0045] Some embodiments may reduce and/or prevent ESD from being received by the substrate 100, from the outside, including from the circuit board 300, through the input pads 126 or from being received by the circuit board 300 from the substrate 100 through the input pads 126 in a state where the circuit board 300 is coupled with the input pads 126.

[0046] FIG. 7 illustrates a plan view of the input pads 126 of FIGS. 1 and 3 in a state in which the circuit board 300 contacts and overlaps respective contact units 126b and lead units 126a of the input pads 126.

[0047] Although the resistors 200 are included in the embodiment illustrated in FIG. 7, in examples in which the pads 320 of the circuit board overlap and/or contact the lead units 126a and the contact units 126b of the input pads 126, as shown in FIG. 7, the resistors 200 may be omitted. In such examples, not forming part of the invention, in which the resistors 200 are omitted, it is possible to prevent wiring line resistance from increasing as a result of the resistors 200.

[0048] In conventional cases in which resistors may be formed between input pads and driving circuits, it is possible to protect the driving circuit from the ESD. However, in such cases, the input pads and the external circuit board may be damaged by the ESD.

[0049] According to the invention, resistors are formed in input pads of an organic light emitting display so that it is possible to prevent and/or reduce over-current caused by ESD received through the substrate or the external circuit board from flowing to the other. More particularly, input pads include lead units and contact units, and resistors are coupled between the respective lead units and the contact units so that it is possible to effectively prevent and/or reduce ESD from being received by the organic light emitting display and/or the external circuit board. In some embodiments, e.g., it is possible to effectively prevent and/or reduce ESD from being received by the input pads at an edge of the substrate in the state where the circuit board is not coupled with the input pads.

[0050] Exemplary embodiments of the present invention have been disclosed herein, and although specific terms are employed, they are used and are to be interpreted in a generic and descriptive sense only and not for purpose of limitation. Accordingly, it will be understood by those of ordinary skill in the art that various changes in form and details may be made without departing from the scope of the present invention as set forth in the following claims.

Claims

1. An organic light emitting display adapted to be connectable to an external circuit board (300), the organic light emitting display comprising:

a substrate (100);

a plurality of organic light emitting diodes (OLEDs) (120) on the substrate (100); and

a plurality of input pads (126) coupled with the plurality of OLEDs (120) through wiring lines (128), the plurality of input pads (126) being connectable to pads of the external circuit board (300),

wherein at least one of the plurality of input pads (126) includes:

a lead unit (126a) forming a first portion of the input pad extending from a respective one of the wiring lines, (128) and

a contact unit (126b) forming a second portion of the input pad spaced apart from the lead unit (126a), wherein the lead unit (126a) and the contact unit (126b) of the at least one input pad (126) are suitable for contacting and overlapping a pad of the external circuit board (300), and

a resistor (200) coupled between the lead unit (126a) and the contact unit (126b) of the at least one input pad (126) including the lead unit (126a) and the contact unit (126b),

wherein an insulating layer (220) is arranged between the at least one input pad (126) and the resistor (200), and
wherein the resistor (200) is coupled with the contact unit (126b) and the lead unit (126a) through contact holes (240) formed in the insulating layer (220).

2. An organic light emitting display according to claim 1, further comprising driving circuits coupled between the wiring lines (128) and the organic light emitting diodes (120).

3. An organic light emitting display according to claim 2, further comprising thin film transistors (TFT) coupled between the driving circuits and the OLEDs (120).

4. An organic light emitting display according to any one of claims 1 to 3, wherein the resistor (200) includes polysilicon.

5. An organic light emitting display according to any one of claims 1 to 4, wherein the circuit board (300) is a flexible printed circuit (FPC).

6. An organic light emitting display according to any one of claims 1 to 5, wherein, when the organic light emitting display is connected to the external circuit board (300), the contact unit (126b) is arranged to contact the external circuit board (300).

7. An organic light emitting display according to any one of claims 1 to 6, wherein, when the organic light emitting display is connected to the external circuit board (300), the contact unit (126b) and the lead unit (126a) are arranged to contact the external circuit board (300).

8. An organic light emitting display according to any one of claims 1 to 7, wherein the resistor (200) is directly coupled between and directly contacts the lead unit (126a) and the contact unit (126b) of the at least one of the plurality of input pads (126).

9. An organic light emitting display according to any one of claims 1 to 8, further comprising thin film transistors (TFT) coupled to the OLEDs (120), wherein the resistor (200) includes a same material as and corresponds to a same layer as source and/or drain regions of the TFTs.

10. An organic light emitting display according to any one of claims 1 to 9, further comprising thin film transistors (TFT) coupled to the OLEDs (120), wherein the lead units (126a) and the contact units (126b) include a same material and correspond to a same layer as source (106a) and drain (106b) electrodes of the TFTs, anode electrodes of the OLEDs and/or cathode electrodes (108, 111) of the OLEDs (120).

11. An organic light emitting display according to any one of claims 1 to 10, wherein the input pads (126) are arranged along an edge portion of the substrate (100).

Ansprüche

1. Organische lichtemittierende Anzeige, welche zum Verbinden mit einer äußeren Schaltkreisplatine (300) ausgebildet ist, wobei die organische lichtemittierende Anzeige umfasst:

ein Substrat (100);

eine Mehrzahl von organischen lichtemittierenden Dioden (OLEDs) (120) auf dem Substrat (100); und

eine Mehrzahl von Eingangsplatten (126), welche mit der Mehrzahl von OLEDs (120) über Verdrahtungsleitungen (128) gekoppelt sind, wobei die Mehrzahl von Eingangsplatten (126) mit Platten der äußeren Schaltkreisplatine (300) verbunden werden kann,

wobei zumindest eine der Mehrzahl von Eingangsplatten (126) umfasst:

eine Anschlusseinheit (126a), welche einen ersten Teil der Eingangsplatte bildet, welches sich aus einer entsprechenden Verdrahtungsleitung (128) erstreckt, und

eine Kontakteinheit (126b), welche einen zweiten Teil der Eingangsplatte bildet, welches von der Anschlusseinheit (126a) entfernt ist, wobei die Anschlusseinheit (126a) und die Kontakteinheit (126b) der zumindest einen Eingangsplatte (126) zum Kontaktieren und Überlappen einer Platte der äußeren Schaltkreisplatine (300) geeignet sind, und

einen Widerstand (200), welcher zwischen der Anschlusseinheit (126a) und der Kontakteinheit (126b) der zumindest einen Eingangsplatte (126), welche die Anschlusseinheit (126a) und die Kontakteinheit (126b) umfasst, gekoppelt ist,

wobei eine Isolierschicht (220) zwischen der zumindest einen Eingangsplatte (126) und dem Widerstand (200) angeordnet ist, und
wobei der Widerstand (200) mit der Kontakteinheit (126b) und der Anschlusseinheit (126a) über in der Isolierschicht (220) gebildete Kontaktlöcher (240) gekoppelt ist.

2. Organische lichtemittierende Anzeige nach Anspruch 1, ferner umfassend Treiberschaltungen, welche zwischen den Verdrahtungsleitungen (128) und den organischen lichtemittierenden Dioden (120) gekoppelt sind.

3. Organische lichtemittierende Anzeige nach Anspruch 2, ferner umfassend Dünnfilmtransistoren (TFT), welche zwischen den Treiberschaltungen und den OLEDs (120) geschaltet sind.

4. Organische lichtemittierende Anzeige nach einem der Ansprüche 1 bis 3, wobei der Widerstand (200) Polysilikon umfasst.

5. Organische lichtemittierende Anzeige nach einem der Ansprüche 1 bis 4, wobei die Schaltkreisplatine (300) eine flexible Schaltkreisplatine (FPC) ist.

6. Organische lichtemittierende Anzeige nach einem der Ansprüche 1 bis 5, wobei, wenn die organische lichtemittierende Anzeige mit der äußeren Schaltkreisplatine (300) verbunden ist, die Kontakteinheit (126b) so angeordnet ist, dass sie die äußere Schaltkreisplatine (300) kontaktiert.

7. Organische lichtemittierende Anzeige nach einem der Ansprüche 1 bis 6, wobei, wenn die organische lichtemittierende Anzeige mit der äußeren Schaltkreisplatine (300) verbunden ist, die Kontakteinheit (126b) und die Anschlusseinheit (126a) zum Kontaktieren der äußeren Schaltkreisplatine (300) konfiguriert sind.

8. Organische lichtemittierende Anzeige nach einem der Ansprüche 1 bis 7, wobei der Widerstand (200) unmittelbar in direktem Kontakt zwischen der Anschlusseinheit (126a) und der Kontakteinheit (126b) der zumindest einen der Mehrzahl von Eingangsplatten (126) angeschlossen ist.

9. Organische lichtemittierende Anzeige nach einem der Ansprüche 1 bis 8, ferner umfassend Dünnschichttransistoren (TFT), welche mit den OLEDs (120) verbunden sind, wobei der Widerstand (200) das selbe Material umfasst und einer selben Schicht von Sourcebereich und/oder Drainbereich der TFT entspricht.

10. Organische lichtemittierende Anzeige nach einem der Ansprüche 1 bis 9, ferner umfassend mit den OLEDs (120) verbundenen Dünnfilmtransistoren (TFT), wobei die Anschlusseinheiten (126a) und die Kontakteinheiten (126b) ein selbes Material umfassen und einer selben Schicht der Source- (106a) und Drain- (106b) Elektroden der TFT, Anodenelektroden der OLEDs und/oder Kathodenelektroden (108, 111) der OLEDs (120) entsprechen.

11. Organische lichtemittierende Anzeige nach einem der Ansprüche 1 bis 10, wobei die Eingangsplatten (126) entlang eines Randbereiches des Substrats (100) angeordnet sind.

Revendications

1. Affichage électroluminescent organique conçu pour pouvoir être raccordé à une carte de circuit externe (300), l'affichage électroluminescent organique comprenant :

un substrat (100) ;

une pluralité de diodes électroluminescentes organiques (OLED) (120) sur le substrat (100) ; et

une pluralité de plots d'entrée (126) couplés à la pluralité d'OLED (120) par l'intermédiaire de pistes de câblage (128), la pluralité de plots d'entrée (126) pouvant être raccordés à des plots de la carte de circuit externe (300),

dans lequel au moins un parmi la pluralité de plots d'entrée (126) comprend :

une unité de raccordement (126a) formant une première partie du plot d'entrée s'étendant à partir d'une respective parmi les pistes de câblage (128), et

une unité de contact (126b) formant une deuxième partie du plot d'entrée espacée par rapport à l'unité de raccordement (126a), dans lequel l'unité de raccordement (126a) et l'unité de contact (126b) du au moins un plot d'entrée (126) sont appropriées pour venir en contact avec, et chevaucher, un plot de la carte de circuit externe (300), et

une résistance (200) couplée entre l'unité de raccordement (126a) et l'unité de contact (126b) du au moins un plot d'entrée (126) comprenant l'unité de raccordement (126a) et l'unité de contact (126b),

dans lequel une couche isolante (220) est agencée entre le au moins un plot d'entrée (126) et la résistance (200), et
dans lequel la résistance (200) est couplée à l'unité de contact (126b) et l'unité de raccordement (126a) par l'intermédiaire de trous de contact (240) formés dans la couche isolante (220).

2. Affichage électroluminescent organique selon la revendication 1, comprenant en outre des circuits d'attaque couplés entre les pistes de câblage (128) et les diodes électroluminescentes organiques (120).

3. Affichage électroluminescent organique selon la revendication 2, comprenant en outre des transistors en couche mince (TFT) couplés entre les circuits d'attaque et les OLED (120).

4. Affichage électroluminescent organique selon l'une quelconque des revendications 1 à 3, dans lequel la résistance (200) comprend du silicium polycristallin.

5. Affichage électroluminescent organique selon l'une quelconque des revendications 1 à 4, dans lequel la carte de circuit (300) est un circuit imprimé flexible (FPC).

6. Affichage électroluminescent organique selon l'une quelconque des revendications 1 à 5, dans lequel, lorsque l'affichage électroluminescent organique est raccordé à la carte de circuit externe (300), l'unité de contact (126b) est agencée pour venir en contact avec la carte de circuit externe (300).

7. Affichage électroluminescent organique selon l'une quelconque des revendications 1 à 6, dans lequel, lorsque l'affichage électroluminescent organique est raccordé à la carte de circuit externe (300), l'unité de contact (126b) et l'unité de raccordement (126a) sont agencées pour venir en contact avec la carte de circuit externe (300).

8. Affichage électroluminescent organique selon l'une quelconque des revendications 1 à 7, dans lequel la résistance (200) est directement couplée entre, et vient directement en contact avec, l'unité de raccordement (126a) et l'unité de contact (126b) du au moins un parmi la pluralité de plots d'entrée (126).

9. Affichage électroluminescent organique selon l'une quelconque des revendications 1 à 8, comprenant en outre des transistors en couche mince (TFT) couplés aux OLED (120), dans lequel la résistance (200) comprend un même matériau et correspond à une même couche que des régions de source et/ou de drain des TFT.

10. Affichage électroluminescent organique selon l'une quelconque des revendications 1 à 9, comprenant en outre des transistors en couche mince (TFT) couplés aux OLED (120), dans lequel les unités de raccordement (126a) et les unités de contact (126b) comprennent un même matériau et correspondent à une même couche que des électrodes de source (106a) et de drain (106b) des TFT, des électrodes formant anode et/ou des électrodes formant cathode (108, 111) des OLED (120).

11. Affichage électroluminescent organique selon l'une quelconque des revendications 1 à 10, dans lequel les plots d'entrée (126) sont agencés le long d'une partie bord du substrat (100).

Drawing