(19)
(11) EP 2 966 368 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
13.04.2016 Bulletin 2016/15

(43) Date of publication A2:
13.01.2016 Bulletin 2016/02

(21) Application number: 15174997.5

(22) Date of filing: 02.07.2015
(51) International Patent Classification (IPC): 
F24F 1/24(2011.01)
(84) Designated Contracting States:
AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
Designated Extension States:
BA ME
Designated Validation States:
MA

(30) Priority: 10.07.2014 JP 2014142378

(71) Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
Tokyo 108-8215 (JP)

(72) Inventors:
  • SUMIYA, Atsuyuki
    TOKYO, 108-8215 (JP)
  • OONO, Kenzo
    TOKYO, 108-8215 (JP)
  • SHIMIZU, Kenji
    TOKYO, 108-8215 (JP)

(74) Representative: Intès, Didier Gérard André et al
Cabinet Beau de Loménie 158, rue de l'Université
75340 Paris Cedex 07
75340 Paris Cedex 07 (FR)

   


(54) CONTROLLER PROVIDED WITH HEATING ELECTRONIC COMPONENTS, AND AIR CONDITIONER


(57) An object of the invention is to provide a controller in which the number of mounting holes on a substrate side is reduced to suppress reduction in a pattern width, and workability during substrate installation can be improved, and an air conditioner comprising the same. The controller includes a block 25 made of a heat transfer material; and heating electronic components 22, 23 and 24 that are mounted on a substrate 21, and are fixed in contact with the block 25. The block 25 includes at least two surfaces including a first surface 26 located along the substrate 21, and a second surface 27 intersecting with the first surface 26. One part of the electronic components is dispersed and disposed on the first surface 26. At least one SIP type electronic components 23 and 24 of the electronic components is dispersed and disposed on the second surface 27.







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