RELATED APPLICATIONS
FIELD OF THE INVENTION
[0002] The following disclosure is directed generally to hybrid heat pipe assemblies.
BACKGROUND OF THE INVENTION
[0003] US 2005/094375 A1 discloses an integrated heat dissipating device has a heat sink, a first set of fins,
a second set of fins and at least one heat pipe. The heat sink has a thermal conductive
block embedded therein and a through hole exposing the thermal conductive block from
a top surface of the heat sink. The first set of fins has a plurality of horizontally
extending fins stacked with each other along a vertical direction over the heat sink.
The second set of fins is integrated by a plurality of vertically extending fins arranged
in a curved shape between the heat sink and the first set of fins. The heat pipe has
a vertical extension across the first set of fins and a horizontal extension underneath
a bottom of the first set of fins. The horizontal extension is inserted into the through
hole in contact with the thermal conductive block.
[0004] EP 1 387 139 A1 discloses a heat pipe unit comprised of a tank a plurality of pipes provided upright
and jointed to a side of the tank to be in communication with the tank, and a plurality
of fins fitted over and assembled to the plurality of pipes.
[0005] US 6,779,595 B1 discloses a first heat dissipating element mounted to the thermal conductive surface
of the thermal conductive heat sink and a heat pipe and a second heat dissipating
element comprising a plurality of fins with holes through which a heat pipe is mounted.
[0006] A device usually generates heat as a result of losses in efficiency. A heat sink
is a passive heat exchanger that can cool a device by transferring heat generated
by the device into a surrounding cooling medium, such as air. A heat sink may have
a baseplate that can extract heat from a device that is in contact with the baseplate.
A heat sink may also include an assembly of fins bonded to the baseplate that can
transfer the extracted heat from the baseplate to the surrounding cooling medium.
Thus, there is a flow of heat from the device through the baseplate and the fins to
the surrounding cooling medium, thereby serving to cool the device in contact with
the baseplate.
[0007] Since the heat sink is a passive heat transfer mechanism, there may be situations
in which the heat sink is not able to adequately cool a device in contact therewith.
In such cases, a heat pipe apparatus might be applied. A heat pipe apparatus is also
a heat exchanger than can cool a device by transferring heat generated by the device
into a surrounding cooling medium. The heat pipe apparatus may include an evaporator
plate that can extract heat from a device that is in contact with the evaporator plate.
The apparatus may also include a plurality of heat pipes in contact with the evaporator
plate that can transfer heat from the evaporator plate to another location using liquid-to-vapor
phase changes.
[0008] Each of the heat pipes includes a working fluid, such as water, sealed in a long
thin walled cavity under vacuum. The cavity may be cylindrical or rectangular, but
is not limited thereto. When heat is applied to a portion of the heat pipe, the working
fluid boils and is converted into vapor. The vapor moves from the heated portion,
or an evaporating area, of the pipe to a lower temperature area, or a condensing area,
of the heat pipe via an adiabatic portion of the pipe where no phase change takes
place. The lower temperature area of the heat pipe is at an opposite end of the heat
pipe from the end of the heat pipe in contact with the evaporator plate. In the lower
temperature area of the heat pipe, the vapor will condense back into a liquid. The
liquid will move back to the heated area of the heat pipe via the adiabatic portion
of the pipe to be heated and evaporated again. Thus, a two-phase flow cycle is created.
[0009] The condensed liquid moves from the lower temperature area of the heat pipe to the
heated area of the heat pipe using gravity or a wicking structure. If the liquid moves
back to the heated area as a result of gravity, the heat pipe has been oriented in
such a way that gravity can draw the condensed liquid down toward the heated portion
of the heat pipe. For example, such an orientation may include a heat pipe being angled
downwardly from the lower temperature area of the heat pipe to the heated area of
the heated pipe. This allows gravity to draw the condensed liquid from the higher,
condensing area of the heat pipe toward the lower, evaporating area of the heat pipe.
[0010] A large fin stack is positioned around the lower temperature area, and possibly the
adiabatic portion, of the heat pipe. The fin stack can transfer the heat away from
the heat pipes into the air through forced or natural convection.
[0011] However, even such a heat pipe apparatus may not be effective to dissipate heat from
certain devices that are either exceedingly inefficient or of a size significant enough
to require a greater cooling capacity than such a heat pipe apparatus can provide
on its own.
SUMMARY OF THE INVENTION
[0012] Described herein are multiple example embodiments related to hybrid heat pipe assemblies.
[0013] According to the invention, a hybrid heat pipe assembly is provided according to
claim 1.
[0014] The complex heat pipe extends from the baseplate and through the fins and the heat
pipe fin stack. In an embodiment, the fins are bonded to the baseplate in a plurality
of groups. The groups are separated from each other by the complex heat pipe. In a
further embodiment, the complex heat pipe extends from the baseplate and through two
of the fin groups and the heat pipe fin stack. Each of the complex heat pipes extends
through the heat pipe fin stack.
[0015] The heat pipe fin stack includes a heat pipe protective fin into which the complex
heat pipe extends. The heat pipe protective fin is positioned on an opposite side
of the heat pipe fin stack from the fins. The heat pipe protective fin is positioned
adjacent to one end of the complex heat pipe. Another end of the complex heat pipe
is embedded in the baseplate.
[0016] In an embodiment, the fins bonded to the baseplate are mounted to an opposite side
of the baseplate from a side of the baseplate in contact with the device. In still
another embodiment, the complex heat pipe is embedded in the baseplate.
[0017] The complex heat pipes extend from the chamber through the fins and the heat pipe
fin stack. In an embodiment, the fins are bonded to the baseplate in a plurality of
groups, and the groups are separated from each other by the complex heat pipes. In
an embodiment, the complex heat pipes extend from the chamber through two of the fin
groups and the heat pipe fin stack. In an example, the chamber is mounted horizontally
in the baseplate. The chamber is embedded in the baseplate. The chamber is positioned
in a baseplate channel comprising walls defining the baseplate channel, the chamber
being secured to the walls.
[0018] Other features and aspects may be apparent from the following detailed description,
the drawings and the claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0019]
FIG. 1 is a perspective view illustrating an example of a hybrid heat pipe assembly.
FIG. 2 is front view illustrating an example of the hybrid heat pipe assembly shown
in FIG. 1.
FIG. 3 is a side cross-sectional view taken along lines 3-3 of FIG. 2 illustrating
an example of the hybrid heat pipe assembly shown in FIG. 1.
FIG. 4 is a close-up view of area 4 of FIG. 3 illustrating an example of an interface
of a baseplate and a complex heat pipe of the hybrid heat pipe assembly shown in FIG.
1.
FIG. 5 is a perspective view illustrating an example of a complex heat pipe of the
hybrid heat pipe assembly shown in FIG. 1.
FIG. 6 is a perspective view illustrating an example of the hybrid heat pipe assembly
shown in FIG. 1 with devices in contact therewith.
[0020] Throughout the drawings and the detailed description, unless otherwise described,
the same drawing reference numerals will be understood to refer to the same elements,
features and structures. The relative size and depiction of these elements may be
exaggerated for clarity, illustration and convenience.
DETAILED DESCRIPTION
[0021] Examples incorporating one or more embodiments are described and illustrated in the
drawings. These illustrated examples are not intended to be limiting. For example,
one or more aspects of an embodiment may be utilized in other embodiments and even
other types of devices.
[0022] FIGS. 1-6 illustrate an example hybrid heat pipe assembly in surface contact with
a plurality of devices 4. While the devices 4 illustrated in FIG. 6 bear a common
resemblance with electronic modules, embodiments described herein are not limited
thereto. In fact, one having ordinary skill in the art may use the hybrid heat pipe
assembly 2 to cool any applicable heat-generating device having the ability to be
in contact with the hybrid heat pipe assembly 2.
[0023] While the devices 4 illustrated in FIG. 6 are mounted to the hybrid heat pipe assembly
2 using fasteners 6, embodiments described herein are not limited thereto. For example,
the devices 4 may merely be in contact with the hybrid heat pipe assembly 2 without
being fixed or mounted thereto. In addition, the devices 4 contacting the hybrid heat
pipe assembly 2 may be related or unrelated to each other. Moreover, the devices 4
may be in contact with or isolated from each other. Whatever the case, the devices
4 to be cooled by the hybrid heat pipe assembly 2 are positioned with respect to the
hybrid heat pipe assembly in such a way as to maximize surface contact with the hybrid
heat pipe assembly 2, thereby serving to increase an amount of heat extracted from
the devices 4 by the hybrid heat pipe assembly 2.
[0024] The illustrated hybrid heat pipe assembly 2 may combine various aspects and elements
of a bonded fin heat sink and a heat pipe apparatus. However, the hybrid heat pipe
assembly 2 is not limited thereto and can be further supplemented by other heat transfer
means known by those of ordinary skill in the art.
[0025] The example hybrid heat pipe assembly 2 described and illustrated herein includes
a baseplate 8 in contact with the devices 4, baseplate fins 10 bonded to the baseplate
8, a complex heat pipe 12 extending from the baseplate 8 and having an end positioned
within the baseplate 8, and a heat pipe fin stack 14 joined to the complex heat pipe
12.
[0026] The baseplate 8 is configured to extract heat from the devices 4 in contact with
the baseplate 8. As was previously noted with respect to the hybrid heat pipe assembly
2, while the devices 4 illustrated in FIG. 6 are mounted to the baseplate 8 using
fasteners 6, embodiments described herein are not limited thereto. For example, the
devices 4 may be in contact with the baseplate 8 without being fixed or mounted thereto.
In addition, the devices 4 may be related or unrelated to each other or other items
contacting the baseplate 8.
[0027] The baseplate 8 may have a shape consistent with that of a rectangular block. However,
embodiments disclosed herein are not limited thereto as the baseplate 8 can have any
shape or structure that is effective in cooling devices in contact therewith. Further,
while the baseplate 8 is illustrated in the example herein as being flat or planar,
embodiments described here are not limited thereto, as the baseplate 8 may be curved
or otherwise to maximize surface contact with the devices 4 and extract heat from
the devices 4 as efficiently as possible. Thus, the shape and design of the baseplate
8 may be adjusted for effective extraction of heat from whatever device might be in
surface contact therewith.
[0028] The baseplate 8 may be mounted on a corresponding structure such that an edge line
20 of the baseplate 8 is parallel with gravity. However, embodiments disclosed herein
are not limited thereto, as the baseplate 8 can be mounted in any plane particularly
suited for cooling the devices 4 in contact therewith, as long as requirements for
cooling the heat-generating devices 4 are met and acceptable support is provided for
the baseplate 8.
[0029] The heat extracted from the devices 4 by the baseplate 8 may be transferred therefrom
to the baseplate fins 10 bonded to the baseplate 8. The heat received by the baseplate
fins 10 may be directly transferred to the air surrounding the baseplate fins 10.
[0030] The baseplate fins 10 may be mounted directly on the baseplate 8 or on a fin plate
30 that is subsequently mounted on the baseplate 8. If mounted directly on the baseplate
8, each of the baseplate fins 10 may include a flange (not shown) via which the baseplate
fin 10 is fastened to the baseplate 8. The flange may extend from an edge of a body
32 of the baseplate fin 10 in a substantially perpendicular manner that is additionally
substantially parallel with the sides 16, 18 of the baseplate 8. The baseplate fins
10 may be bonded to the baseplate 8 in a plurality of groups. In addition, the baseplate
fins 10 may be mounted to an opposite side 16 of the baseplate 8 from a side 18 of
the baseplate 8 in contact with the devices 4.
[0031] In some cases, when cooling requirements for the devices 4 are great, the heat generated
by the devices 4 may be too substantial to be effectively dissipated solely by the
baseplate fins 10. When this occurs, the excess heat may be dissipated from the baseplate
8 through the complex heat pipe 12. The complex heat pipe 12 may transfer the received
excess heat from the baseplate 8 to the heat pipe fin stack 14 for subsequent dissipation
to air surrounding the heat pipe fin stack 14.
[0032] As is the case with the baseplate fins 10, the complex heat pipe 12 is positioned
on the opposite side 16 of the baseplate 8 from the side 18 of the baseplate 8 in
contact with the devices 4.
[0033] The complex heat pipe 12 may be similar in design to a clarinet heat pipe or a tube
that has been fabricated to seal a working fluid under vacuum pressure. Several complex
heat pipes 12 may be mounted in the baseplate 8 to extend therefrom. Ends of the complex
heat pipes 12 may also be embedded in the baseplate 8.
[0034] As such, a complex heat pipe 12 may separate one group of the baseplate fins 10 from
another group of the baseplate fins 10. The complex heat pipe 12 may extend from the
baseplate 8 and through the baseplate fins 10 and the heat pipe fin stack 14. The
baseplate fins 10 may be mounted to and arranged on the baseplate 8 in a plurality
of separated groups. In such cases, the groups of the baseplate fins 10 may be separated
from each other by a complex heat pipe 12 extending from the baseplate 8, between
the groups of the baseplate fins 10, and through the heat pipe fin stack 14. For example,
two groups of baseplate fins 10 may be separated by a complex heat pipe 12 mounted
to the baseplate 8 in an area between the two groups of the baseplate fins 10. The
complex heat pipe 12 may extend between and past the baseplate fins 10 and into the
heat pipe fin stack 14. The heat pipe fin stack 14 may be separated from the baseplate
8 by the baseplate fins 10.
[0035] Further, a complex heat pipe apparatus 22 includes a plurality of the complex heat
pipes 12 secured within a closed chamber 24 that is positioned within the baseplate
8. The complex heat pipes 12 are secured within respective recesses in the closed
chamber 24 by brazing the heat pipes 12 to respective walls that define the recesses.
The chamber 24 is embedded in a baseplate channel 26 formed within the baseplate 8
such that chamber 24 can fit therein. The chamber 24 is welded to walls that define
the baseplate channel 26. The closed chamber 24 is configured to act as a fluid reservoir
within the baseplate 8 to expedite the transfer of heat from the baseplate 8 using
a two-phase flow cycle created within the complex heat pipes 12.
[0036] Moreover, the closed chamber 24 may be mounted at a location in the baseplate 8 that
enhances or maximizes heat extraction from the devices 4. The baseplate channel 26
location on the side 16 is essentially opposite a location on the side 18 at which
the devices 4 are in surface contact therewith.
[0037] Further, the chamber 24 and the channel 26 may be correspondingly oriented to maximize
exposure to devices 4 in surface contact with the baseplate 8 in order to enhance
or maximize extraction of heat therefrom. For example, while both the chamber 24 and
the channel 26 are illustrated herein as being straight, embodiments disclosed herein
are not limited thereto, as the channel 24 can be correspondingly curved to a curved
channel 26 and of the baseplate 8 in order to maximize heat extraction from a correspondingly
positioned and/or shaped group of devices 4 making surface contact with the baseplate
8.
[0038] The heat pipe fin stack 14 includes a heat pipe protective fin 28 to provide protection
for a complex heat pipe 12 extending therethrough. The heat pipe protective fin 28
is positioned on an opposite side of the heat pipe fin stack 14 from the baseplate
fins 10 and adjacent to one end 36 of the complex heat pipe 12. The pipe end 36 may
extend through the heat pipe protective fin 28, such that the pipe end 36 is separated
from a remainder of the complex heat pipe 12 by the heat pipe protective fin 28. Further,
an end cap 34 is positioned on the pipe end 36 of the complex heat pipe 12 to provide
additional protection to the complex heat pipe 12.
[0039] In the examples described herein, the complex heat pipe 12 is positioned to absorb
excess heat from the baseplate 8 when cooling requirements are high enough that the
baseplate fins 10 are unable to effectively cool the devices 4 contacting the baseplate
8. As a result, melting of a devices 4 due to insufficient cooling may be inhibited.
[0040] A number of examples have been described above. Nevertheless, it will be understood
that various modifications may be made. For example, suitable results may be achieved
if the described elements are combined in a different manner and/or replaced or supplemented
by other elements or their equivalents. Accordingly, other implementations are within
the scope of the following claims.
1. A hybrid heat pipe assembly comprising:
a baseplate (8) dimensioned to be placed in surface contact with a device, the baseplate
being configured to extract heat from the device, the baseplate having a channel (26)
formed within the baseplate (8) at a location on one side (16) of the base plate (8)
that is essentially opposite a location on another side (18) of the baseplate at which
the device (4) is in surface contact with the baseplate (8);
a plurality of fins (10) bonded to the baseplate in parallel, the fins bonded to the
baseplate being configured to transfer a first portion of the extracted heat from
the baseplate (8) to air surrounding the fins bonded to the baseplate;
a complex heat pipe apparatus (22) comprising a closed chamber (24) positioned within
the baseplate (8), embedded within the channel (26), and welded to walls that define
the channel (26), the apparatus further comprising a plurality of complex heat pipes
(12), the complex heat pipes (12) being secured within respective recesses of said
closed chamber (24) by brazing the complex heat pipes (12) to respective walls that
define the recesses, the complex heat pipes (12) extending from the baseplate (8)
through the fins bonded to the baseplate, the closed chamber (24) being configured
to act within the baseplate as a reservoir for the fluid to expedite the transfer
of a second portion of the extracted heat from the baseplate (8) using a two-phase
flow cycle created within the complex heat pipes (12), the closed chamber (24) being
configured to transfer the second heat portion from the chamber to the complex heat
pipes, the complex heat pipes being configured to receive the second heat portion;
and
a heat pipe fin stack (14) through which the complex heat pipes (12) extend and to
which the complex heat pipes are configured to transfer the second portion of heat,
the heat pipe fin stack (14) being joined to the complex heat pipes and configured
to transfer the second portion of the extracted heat received from the complex heat
pipes to air surrounding the stack,
wherein the heat pipe fin stack comprises a heat pipe protective fin (28) into which
the complex heat pipe extends,
wherein the heat pipe protective fin is positioned on an opposite side of the heat
pipe fin stack from the fins bonded to the baseplate,
wherein the heat pipe protective fin (28) is positioned adjacent to one end of each
of the complex heat pipes (12),
wherein an end cap (34) is positioned on the one end (36) of the complex heat pipes
(12), wherein each of the complex heat pipes (12) extends from the baseplate to an
end of each of the complex heat pipes at an oblique angle, and
wherein fins of the heat pipe fin stack (14) extend in parallel to a side (16) of
the baseplate in which the channel (26) is formed.
2. The assembly of any one of the previous claims, wherein the heat pipe fin stack is
separated from the baseplate by the fins bonded to the baseplate.
3. The assembly of any one of the previous claims, wherein the fins bonded to the baseplate
are bonded to the baseplate in a plurality of groups, and
wherein each of the complex heat pipes separates one of the fin groups from another
one of the fin groups.
4. The assembly of claim 3, wherein the complex heat pipes extend through two of the
fin groups and the heat pipe fin stack.
5. The assembly of any one of the previous claims, wherein the fins (10) bonded to the
baseplate are mounted to an opposite side of the plate from a side of the baseplate
(8) in contact with the device.
6. The assembly of any one of the previous claims, wherein the complex heat pipes (12)
are embedded in the baseplate.
1. Hybrid-Wärmerohreinheit, umfassend:
eine Grundplatte (8), die abgemessen ist, um in Oberflächenkontakt mit einer Vorrichtung
platziert zu sein, wobei die Grundplatte konfiguriert ist, um Wärme aus der Vorrichtung
zu extrahieren, wobei die Grundplatte einen Kanal (26) aufweist, der innerhalb der
Grundplatte (8) an einer Stelle auf einer Seite (16) der Grundplatte (8) gebildet
ist, die im Wesentlichen gegenüber einer Stelle an einer anderen Seite (18) der Grundplatte
liegt, an der die Vorrichtung (4) in Oberflächenkontakt mit der Grundplatte (8) ist;
eine Vielzahl von Rippen (10), die mit der Grundplatte parallel verbunden sind, wobei
die mit der Grundplatte verbundenen Rippen konfiguriert sind, um einen ersten Teil
der extrahierten Wärme von der Grundplatte (8) an Luft, die die mit der Grundplatte
verbundenen Rippen umgibt, zu übertragen;
eine komplexe Wärmerohrvorrichtung (22), umfassend eine geschlossene Kammer (24),
die innerhalb der Grundplatte (8) positioniert ist, eingebettet innerhalb des Kanals
(26) und geschweißt an Wände, die den Kanal (26) definieren, wobei die Vorrichtung
weiter eine Vielzahl von komplexen Wärmerohren (12) umfasst, wobei die komplexen Wärmerohre
(12) innerhalb entsprechender Aussparungen der geschlossenen Kammer (24) durch Löten
der komplexen Wärmerohre (12) an entsprechende Wände, die die Aussparungen definieren,
befestigt sind, wobei sich die komplexen Wärmerohre (12) von der Grundplatte (8) durch
die an die Grundplatte gebundenen Rippen erstrecken, wobei die geschlossene Kammer
(24) konfiguriert ist, um innerhalb der Grundplatte als ein Tank für das Fluid zu
dienen, um die Übertragung eines zweiten Teils der extrahierten Wärme vom der Grundplatte
(8) unter Verwendung eines zweiphasigen Flusszyklus, erzeugt innerhalb der komplexen
Wärmerohre (12), zu beschleunigen, wobei die geschlossene Kammer (24) konfiguriert
ist, um den zweiten Wärmeteil von der Kammer zu den komplexen Wämerohren zu übertragen,
wobei die komplexen Wärmerohre konfiguriert sind, um den zweiten Wärmeteilt zu erhalten;
und
einen Wärmerohr-Rippenstapel (14), durch den sich die komplexen Wärmerohre (12) erstrecken,
und wobei die komplexen Wärmerohre konfiguriert sind, um den zweiten Teil der Wärme
zu übertragen, wobei der Wärmerohr-Rippenstapel (14) mit den komplexen Wärmerohren
verbunden und konfiguriert ist, um den zweiten Teil der extrahierten Wärme, erhalten
von den komplexen Wärmerohren, an Luft zu übertragen, die den Stapel umgibt,
wobei der Wärmerohr-Rippenstapel mindestens eine Wärmerohr-Schutzrippe (28) umfasst,
in die sich das komplexe Wärmerohr erstreckt,
wobei die Wärmerohr-Schutzrippe auf einer gegenüberliegenden Seite des Wärmerohr-Rippenstapels
von den mit der Grundplatte verbundenen Rippen positioniert ist,
wobei die Wärmerohr-Schutzrippe (28) benachbart einem Ende jedes der komplexen Wärmerohre
(12) positioniert ist,
wobei eine Endkappe (34) an dem einen Ende (36) der komplexen Wärmerohre (12) positioniert
ist, wobei sich jede der komplexen Wärmerohre (12) von der Grundplatte zu einem Ende
jedes der komplexen Wärmerohre in einem schrägen Winkel erstreckt, und
wobei sich Rippen des Wärmerohr-Rippenstapels (14) parallel zu einer Seite (16) der
Grundplatte, in der der Kanal (26) gebildet ist, erstrecken.
2. Einheit nach einem der vorhergehenden Ansprüche, wobei der Wärmerohr-Rippenstapel
von der Grundplatte durch die mit der Grundplatte verbundenen Rippen getrennt ist.
3. Einheit nach einem der vorhergehenden Ansprüche, wobei die mit der Grundplatte verbundenen
Rippen in einer Vielzahl von Gruppen mit der Grundplatte verbunden sind, und
wobei jedes der komplexen Wärmerohre eine der Rippengruppen von einer anderen der
Rippengruppen trennt.
4. Einheit nach Anspruch 3, wobei sich die komplexen Wärmerohre durch zwei der Rippengruppen
und den Wärmerohr-Rippenstapel erstrecken.
5. Einheit nach einem der vorhergehenden Ansprüche, wobei die mit Grundplatte verbundenen
Rippen (10) auf eine gegenüber liegende Seite der Platte von einer Seite der Grundplatte
(8) in Kontakt mit der Vorrichtung montiert sind.
6. Einheit nach einem der vorhergehenden Ansprüche, wobei die komplexen Wärmerohre (12)
in die Grundplatte eingebettet sind.
1. Ensemble de caloducs hybrides comprenant :
une plaque de base (8) dimensionnée pour être placée en contact de surface avec un
dispositif, la plaque de base étant configurée pour extraire la chaleur du dispositif,
la plaque de base ayant un canal (26) formé à l'intérieur de la plaque de base (8)
à un emplacement d'un côté (16) de la plaque de base (8) qui est essentiellement opposé
à un emplacement de l'autre côté (18) de la plaque de base au niveau duquel le dispositif
(4) est en contact de surface avec la plaque de base (8) ;
une pluralité d'ailettes (10) reliées à la plaque de base, en parallèle, les ailettes
reliées à la plaque de base étant configurées pour transférer une première partie
de la chaleur extraite de la plaque de base (8) à l'air entourant les ailettes reliées
à la plaque de base ;
un appareil de caloducs complexes (22) comprenant une chambre fermée (24) positionnée
à l'intérieur de la plaque de base (8), encastré à l'intérieur du canal (26) et soudé
aux parois qui définissent le canal (26), l'appareil comprenant en outre une pluralité
de caloducs complexes (12), les caloducs complexes (12) étant fixés dans des évidements
respectifs de ladite chambre fermée (24) en brasant les caloducs complexes (12) sur
des parois respectives qui définissent les évidements, les caloducs complexes (12)
s'étendant à partir de la plaque de base (8) à travers les ailettes reliées à la plaque
de base, la chambre fermée (24) étant configurée pour agir à l'intérieur de la plaque
de base en tant que réservoir pour que le fluide accélère le transfert d'une seconde
partie de la chaleur extraite de la plaque de base (8) en utilisant un cycle d'écoulement
à deux phases créé dans les caloducs complexes (12), la chambre fermée (24) étant
configurée pour transférer la seconde partie de chaleur de la chambre aux caloducs
complexes, les caloducs complexes étant configurés pour recevoir la seconde partie
de chaleur ; et
une pile d'ailettes de caloduc (14) à travers laquelle les caloducs complexes (12)
s'étendent et à laquelle les caloducs complexes sont configurés pour transférer la
seconde partie de chaleur, la pile d'ailettes de caloduc (14) étant assemblée aux
caloducs complexes et configurée pour transférer la seconde partie de la chaleur extraite
reçue des caloducs complexes à l'air entourant la pile,
dans lequel la pile d'ailettes de caloduc comprend une première ailette de protection
de caloduc (28) dans laquelle le caloduc complexe s'étend,
dans lequel l'ailette de protection de caloduc est positionnée sur un côté opposé
de la pile d'ailettes de caloduc à partir des ailettes reliées à la plaque de base,
dans lequel l'ailette de protection de caloduc (28) est positionnée de manière adjacente
à une extrémité de chacun des caloducs complexes (12),
dans lequel un capuchon d'extrémité (34) est positionné sur la une extrémité (36)
des caloducs complexes (12), dans lequel chacun des caloducs complexes (12) s'étend
à partir de la plaque de base jusqu'à une extrémité de chacun des caloducs complexes
selon un angle oblique, et
dans lequel les ailettes de la pile d'ailettes de caloduc (14) s'étendent parallèlement
à un côté (16) de la plaque de base dans laquelle le canal (26) est formé.
2. Ensemble selon l'une quelconque des revendications précédentes, dans lequel la pile
d'ailettes de caloduc est séparée de la plaque de base par les ailettes reliées à
la plaque de base.
3. Ensemble selon l'une quelconque des revendications précédentes, dans lequel les ailettes
reliées à la plaque de base sont reliées à la plaque de base en une pluralité de groupes,
et
dans lequel chacun des caloducs complexes sépare l'un des groupes d'ailettes d'un
autre groupe des groupes d'ailettes.
4. Ensemble selon la revendication 3, dans lequel les caloducs complexes s'étendent à
travers deux des groupes d'ailettes et la pile d'ailettes de caloduc.
5. Ensemble selon l'une quelconque des revendications précédentes, dans lequel les ailettes
(10) reliées à la plaque de base sont montées sur un côté opposé de la plaque à partir
d'un côté de la plaque de base (8) en contact avec le dispositif.
6. Ensemble selon l'une quelconque des revendications précédentes, dans lequel les caloducs
complexes (12) sont encastrées dans la plaque de base.