(19)
(11) EP 0 054 069 A1

(12)

(43) Date of publication:
23.06.1982 Bulletin 1982/25

(21) Application number: 81901965.0

(22) Date of filing: 19.06.1981
(51) International Patent Classification (IPC): 
H01L 23/ 367( . )
H01L 23/ 473( . )
H05K 7/ 20( . )
 H01L 23/ 40( . )
H05K 1/ 02( . )
H05K 3/ 32( . )
(86) International application number:
PCT/US1981/000826
(87) International publication number:
WO 1981/003734 (24.12.1981 Gazette 1981/30)
(84) Designated Contracting States:
FR

(30) Priority: 19.06.1980 US 19800161234

(71) Applicant: DIGITAL EQUIPMENT CORPORATION
Maynard, MA 01754 (US)

(72) Inventors:
  • OLSEN, Kenneth H.
    Lincoln, MA 01773 (US)
  • HANNEMANN, Robert J.
    Wellesley, MA 02181 (US)
  • MCELROY, James B.
    Brookline, NH 03033 (US)
  • WEAVER, Bruce H.
    Stow, MA 01775 (US)

   


(54) HEAT PIN INTEGRATED CIRCUIT PACKAGING