<?xml version="1.0" encoding="UTF-8"?><!DOCTYPE ep-patent-document PUBLIC "-//EPO//EP PATENT DOCUMENT 1.4//EN" "ep-patent-document-v1-4.dtd"><!-- Disclaimer: This ST.36 XML data has been generated from SGML data available on ESPACE discs EPAS Volumes 2003/201 to 203 enriched by the abstract retrieved from the corresponding A2/A1 document - March 2013 - EPO - Dir. Publication - kbaumeister@epo.org --><ep-patent-document id="EP82830171A3" lang="en" country="EP" doc-number="0070809" date-publ="19830713" file="82830171" kind="A3" status="n" dtd-version="ep-patent-document-v1-4"><SDOBI lang="en"><B000><eptags><B001EP>DEFRGBNLSE</B001EP></eptags></B000><B100><B110>0070809</B110><B120><B121>EUROPEAN PATENT APPLICATION</B121></B120><B130>A3</B130><B140><date>19830713</date></B140><B190>EP</B190></B100><B200><B210>82830171</B210><B220><date>19820615</date></B220></B200><B300><B310>4893281</B310><B320><date>19810720</date></B320><B330><ctry>IT</ctry></B330></B300><B400><B405><date>19830713</date><bnum>198328</bnum></B405><B430><date>19830126</date><bnum>198304</bnum></B430></B400><B500><B510><B511> 6H 01C  17/24   A</B511></B510><B540><B541>en</B541><B542>Adjustment to desired value (trimming) on thin film resistors by ion sputtering</B542><B541>fr</B541><B542>Ajustage de résistances en couche mince par pulvérisation à l'aide d'un faisceau d'ions</B542><B541>de</B541><B542>Abgleich von Dünnschichtwiderständen durch Ionenzerstäubung</B542></B540></B500><B700><B710><B711><snm>SELENIA INDUSTRIE ELETTRONICHE ASSOCIATE S.p.A.</snm></B711></B710><B720><B721><snm>Misiano, Carlo</snm></B721><B721><snm>Simonetti, Enrico</snm></B721></B720></B700><B800><B840><ctry>DE</ctry><ctry>FR</ctry><ctry>GB</ctry><ctry>NL</ctry><ctry>SE</ctry></B840><B880><date>19830713</date><bnum>198328</bnum></B880></B800></SDOBI><abstract id="abst" lang="en"><p id="pa01" num="0001">A technique for adjusting to the desired value, thin film integrated resistors is made known. This method consists in exposing a resistor, whose thickness is greater than that necessary for the desired resistance, to ionic sputtering of the resistive material until a the resistor thickness is such as to correspond to the desired electric resistance.</p><p id="pa02" num="0002">lon-sputter etching is realised iether by means of a plasma or by means of an ion-gun.<img id="iaf01" file="imgaf001.tif" wi="89" he="84" img-content="drawing" img-format="tif" inline="no" /></p></abstract><search-report-data lang="en" id="srep" srep-office="EP" date-produced=""><doc-page id="srep0001" file="srep0001.tif" type="tif" orientation="portrait" he="295" wi="208" /></search-report-data></ep-patent-document>