(19)
(11) EP 0 074 406 A1

(12) EUROPEAN PATENT APPLICATION
published in accordance with Art. 158(3) EPC

(43) Date of publication:
23.03.1983 Bulletin 1983/12

(21) Application number: 81900634.7

(22) Date of filing: 10.03.1981
(51) International Patent Classification (IPC)3B24B 41/04
(86) International application number:
PCT/JP8100/053
(87) International publication number:
WO 8203/039 (16.09.1982 Gazette 1982/22)
(84) Designated Contracting States:
DE FR GB

(71) Applicant: SHIBAYAMA KIKAI CO., LTD.
Minato-ku Tokyo 108 (JP)

(72) Inventor:
  • ISHIMURA, Yoshio
    Funabashi-shi Chiba-ken 274 (JP)

(74) Representative: Rodhain, Claude (FR) 
Brevets Rodhain & Porte 3, rue Moncey
F-75009 Paris
F-75009 Paris (FR)


(56) References cited: : 
   
       


    (54) SPINDLE TILTING CONTROL DEVICE FOR PLANE AND SPHERICAL ROTARY GRINDING MACHINE, FINE GRINDING MACHINE, LAPPING MACHINE, AND POLISHING MACHINE


    (57) O A spindle tilting control device for a plane and spherical rotary grinding machine, fine gliding machine, lapping machine and polishing machine, which are super precise machines for manufacturing microminiature electronic part components, which device employs a joint (7) for tilting a spindle, can perpendicularly secure a rotary table (1) with respect to the spindle (3) by clamping crank bolts (4), (5), tilts a grind-stone or surface plate (2) with a spindle tilting joint (7), thereby machining a spherical surface together with electric and chemical methods. This machine can extremely precisely machine semiconductor material, magnetic material, ceramics, superhard alloys, or the like.




    Description

    Title of the Invention



    [0001] Spindle tilting control device for plane and' spherical rotary grinding machine, fine gliding machine, lapping machine and polishing machine. _ _

    Field of the Art



    [0002] According to the advance of electronics, the development of semiconductors has remarkably progressed. It has been necessary to gradually miniaturize computers, microcomputers and office computers by the shift from miniaturization and precision to microminiaturization and super precision, namely the shift from transitors to ICs, ICs to LSIs and LSIs to super LSIs. Super precise machines have been required for producing these microminiature electronic part components.

    [0003] This invention is to provide a spindle tilting control device for a plane and spherical rotary grinding machine, fine gliding machine, lapping machine and polishing machine, which device can machine these semiconductor materials such as silicon, magnetic materials such as ferrite and Sendust, ceramics and hard metals or the like, to a super precise planeness or sphericity.

    Background of the Art



    [0004] These processing had been chiefly done by hands and depended on the skilled in the art. After a flat lapping machine was invented in the United States in 1919, several kinds of grinding machines, lapping machines and polishing machines have subsequently appeared, and the processing is now being in rapid progress of the mechanization.

    Disclosure of the Invention



    [0005] A device of this invention is to provide improved models of a conventional plane and spherical rotary grinding machine, fine gliding machine, lapping machine and polishing machine and is developed in order to achieve a super precise plane and an extreme machining precision by freely tilting its spindle in four quarter directions.

    Brief Description of the Drawings



    [0006] The drawings show an embodiment according to this invention.

    [0007] Fig. 1 is a right side view of a spindle tilting control device of this invention,

    [0008] Fig. 2 is a front view of the spindle tilting control device of this invention.

    [0009] In these drawings, numeral 1 represents a rotary table, numeral 2 represents a grindstone or surface plate, numeral 3 represents a spindle head, numeral 4 and 5 represent clamp bolts, numeral 6 represents a motor and numeral 7 represents a joint for tilting a spindle.

    Best Form for Working the Invention



    [0010] The actions and effects of the device according to this invention will be explained with reference to these drawings, as follows.

    [0011] Numeral 1 represents a rotary table for retaining a work magnetically or by vacuum and revolving the work, numeral 2 represents a grindstone or a lapping or polishing surface plate for grinding, lapping or polishing the work, numeral 3 represents a spindle head for revolving the grindstone or surface plate 2, numerals 4 and 5 represent clamp bolts for clamping on tilting the spindle head in one of four quarter directions or on setting the spindle completely perpendicular to the rotary table and numeral 6 represents a motor for driving a spindle head 3.

    [0012] The device according to this invention is thus composed and can be used for a spherical grinding machine as the angle between the rotary table and a spindle shaft can be adjusted within a degree of a by tilting the spindle head 3 in one of four quarter directions with use of a joint 7 provided for tilting the spindle as illustrated in a detailed drawing in Fig. 1 differring from those in the conventional plane, spherical and rotary grinding machines, and also can achieve a complete planeness or sphericity of the work as the plane of the grindstone or the lapping or polishing surface plate and the plane of the rotary table can be kept completely in parallel to each other by setting the spindle completely perpendicular to the rotary table l.

    Applicability in Industry



    [0013] The device according to this invention will be required to be improved with a growing necessity for higher-grade machine tools for producing further extremely precise microminiature electronic part components, and the development for such improved machines is an urgent necessity.


    Claims

    A spindle tilting control device for a plane and spherical rotary grinding machine, fine gliding machine, lapping machine and polishing machine, which device can perpendicularly secure a spindle with respect to a rotary table by clamp bolts and can machine a spherical surface by tilting the spindle employing a - - spindle tilting joint with use of electric and chemical methods.
     




    Drawing










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