HIGH CURRENT PACKAGE WITH MULTI-LEVEL LEADS - Patent 0076802

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EP 0 076 802 A1

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(43)	Date of publication:
	20.04.1983 Bulletin 1983/16

(21)	Application number: 82900877.0

(22)	Date of filing: 05.02.1982

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International Patent Classification (IPC):

H01L 23/ 48^{( . )}
H01L 25/ 07^{( . )}

H01L 23/ 495^{( . )}
H01L 25/ 18^{( . )}

(86)	International application number:
	PCT/US1982/000153

(87)	International publication number:
	WO 1982/002980 (02.09.1982 Gazette 1982/21)

(84)	Designated Contracting States:
	DE FR GB

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Priority:

27.02.1981 US 19810238799

(71)	Applicant: MOTOROLA, INC.
	Schaumburg, IL 60196 (US)

(72)	Inventors:
	DuBOIS, Jerry M. Mesa, AZ 85202 (US) SPANJER, Keith G. Scottsdale, AZ 85253 (US)

(74)	Representative: Ibbotson, Harold
	Motorola European Intellectual Property Midpoint Alencon Link Basingstoke Hampshire RG21 1PL Basingstoke Hampshire RG21 1PL (GB)

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