(57) A unique inverse processed film resistance heater structure is disclosed. A conventional
passivation wear layer (110) is deposited directly on a first substrate (120), followed
by the deposition and patterning of resistance (140) and conductive (150) layers,
and covered by an isolation layer (180) and a thick support layer (190). The thick
support layer is then bonded to a second substrate (310) and the first substrate (120)
is removed so that a uniform, flat passivation layer is exposed. The result is a film
resistor which has a reduced failure rate as compared to the prior art because it
is covered by a passivation wear layer with fewer pin-holes and reduced stress.
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