ELECTRONIC CIRCUIT CHIP CONNECTION ASSEMBLY AND METHOD - Patent 0123676

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EP 0 123 676 A1

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(43)	Date of publication:
	07.11.1984 Bulletin 1984/45

(21)	Application number: 83900116.0

(22)	Date of filing: 09.11.1982

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International Patent Classification (IPC):

H05K 3/ 30^{( . )}
H05K 3/ 32^{( . )}

H01L 21/ 60^{( . )}
H05K 7/ 10^{( . )}

(86)	International application number:
	PCT/US1982/001584

(87)	International publication number:
	WO 1984/002051 (24.05.1984 Gazette 1984/13)

(84)	Designated Contracting States:
	AT BE CH DE FR GB LI LU NL SE

(71)	Applicant: SILICON CONNECTION, INC.
	Pleasanton, CA 94566 (US)

(72)	Inventor:
	SCHROEDER, Jon, Murray Oakdale, CA 95361 (US)

(74)	Representative: Purvis, William Michael Cameron, et al
	D. Young & Co., 21 New Fetter Lane London EC4A 1DA London EC4A 1DA (GB)

(54)	ELECTRONIC CIRCUIT CHIP CONNECTION ASSEMBLY AND METHOD