(19)
(11) EP 0 127 272 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
07.01.1987 Bulletin 1987/02

(43) Date of publication A2:
05.12.1984 Bulletin 1984/49

(21) Application number: 84301651

(22) Date of filing: 12.03.1984
(84) Designated Contracting States:
BE CH DE FR GB IT LI LU NL SE

(30) Priority: 25.05.1983 US 497798

(71) Applicant: MATERIALS RESEARCH CORPORATION
 ()

(72) Inventors:
  • Class, Walter H.
     ()
  • Hieronymi, Robert G.
     ()
  • Hurwitt, Steven D.
     ()

   


(54) Focusing magnetron sputtering apparatus


(57) A cathode assembly (10) for use in a magnetron sputtering system, the system having a cathode assembly with parallel elongated target segments (74,75) which are formed substantially of a material which is desired to be sputter- deposited onto a substrate. The elongated target segments are each provided with a material removal surface which is inclined toward the other segment with respecttothe plane of the substrate. Such inclination permits the material which is removed from the target bars to be focussed onto a relatively narrow area, thereby improving the efficiency of the sputtering operation and reducing machine down-time for cleaning and vacuum pumping. End target segments (66, 67) are provided for improving the efficiency of film deposition near the ends of the elongated bars. The end target segments are provided with material removal surfaces which are also inclined. and connect with the elongated target segments to form a rectangular frame arrangement. An elongated inner pole piece (71) has outwardly extending portions (99) near each end to improve uniformity of a trapping magnetic field between the inner pole piece and a rectangular annular outer pole piece.






Search report