[0001] The present invention relates to a process for the production of PTC thermistors.
[0002] As is well-known in the art, a thermistor aimed at sensing temperature alone includes
a thermistor element sealed in glass or resin so as to keep it from being affected
by other factors such as humidity or gas. Referring especially to NTC thermistors,
there are available glass-sealed type thermistors which are inexpensive, easy to mass-produce
and have stabilized properties, in addition to resin-sealed type disc-form thermistors.
[0003] Turning to PTC thermistors, however, glass-sealed type PTC thermistors are still
not produced, and instead use is made of resin-sealed disc-form PTC thermistors or
PTC thermistors in which metals are mechanically pressed onto electrodes.
[0004] This may be attributable to the properties of PTC thermistors which are significantly
affected by the temperature and atmosphere at and in which the thermistor elements
are sealed in glass.
[0005] Conventional NTC thermistors are prepared by glass sealing in vacuum or a reducing
atmosphere such as N
2 or Ar gas so as to prevent Dumet wires or heaters from being oxidized. In consequence
of the studies made by the present inventors, it has been revealed that the application
of such glass sealing in a reducing atmosphere to PCT thermistors causes the properties
thereof to deteriorate to a considerable extent. It has also been found that, under
such conditions, the glass sealing temperature reaches as high as 650°C, at which
temperature the properties of PTC thermistors deteriorate significantly.
[0006] In view of the foregoing, a main object of the present invention is to provide inexpensive
glass-sealed type PTC thermistors which show a great change in resistance, especially
a markedly increased change in resistance at switching temperatures, and which have
stabilized properties .
[0007] According to one aspect of the present invention, there is provided a process for
the production of PTC thermistors by sealing a positive temperature coefficient (PTC)
semiconductor ceramic material in glass in the presence of air, oxygen or an air/oxygen
mixture (wherein 0% < the volume of air > 100%).
[0008] According to another aspect of the present invention, there is provided a process
for the production of PTC thermistors by sealing a positive temperature coefficient
semiconductor ceramic material in low-melting glass having a softening point of no
higher than 560°C.
[0009] According to a further aspect of the present invention, there is provided a process
for the production of PTC thermistors by sealing a positive temperature coefficient
semiconductor ceramic material in low-melting glass having a softening point of no
higher than 560°C in the presence of air, oxygen or an air/oxygen mixture (wherein
0% < the volume of air> 100%).
[0010] The invention wil be more particularly described with reference to the accompanying
drawings, in which:-
Figure 1 is a schematic view showing one embodiment of the steps of a process according
to the present invention; and
Figures 2 to 4 inclusive are views showing the temperature-specific resistance characteristics
of the products prepared under different conditions.
[0011] As the semiconductor ceramic material having a positive temperature coefficient used
in the present invention, there are mentioned those obtained by adding to barium titanate
base compositions any one of trivalent antimony, trivalent bismuth, pentavalent tantalum,
pentavalent niobium or a rare earth metal. The glass used has a softening point of
450°C-560°C inclusive, and includes those glasses based on B
2O
3-PbO-ZnO, B
2O
3-PbO-SiO
2, B
2O
3-PbO-Ti
2O, B
2O
3-PbO-SiO
2-Al
2O
3-ZnO, B
2O
3-PbO-V
2O
5, SiO
2-PbO-K
2O, SiO
2-PbO-Na
2O and SiO
2-PbO-K
2O-Na
2O. Preference is given to a SiO
2-PbO-K
2O base glass, since this glass shows desirous thermal expansion and wettability with
respect to lead wires (Dumet wires, viz., Fe-Ni alloy wires plated with Cu).
[0012] When a glass having a softening point of below 450
0C is used, certain limitations are imposed upon the temperature at which the resulting
glass-sealed type PTC thermistors are employed.
[0013] Referring now to Figure 1, a semiconductor barium titanate ceramic material 1 is
first sliced to any suitable thickness having regard to the length of a glass tube
4 in which the finished thermistor element is to be sealed. Silver electrodes 2 and
2 are applied to both sides of the thus obtained element, and deposited thereto for
20 minutes at 600°C. Figure l(a) shows a section of the electrode-provided element.
[0014] As shown in Figure l(b), the element is then cut to any length corresponding to the
diameter of the glass tube 4.
[0015] The element is placed in the tube 4 of a glass having a softening point of no higher
than 560°C, into both ends of which Dumet wires 3 and 3 are inserted. Finally, the
glass tube 4 is sealed by means of a carbon heater jig. The sealing temperature is
determined depending upon the softening point of the glass used, and is generally
higher than the softening point of the glass used by 50°C or more.
[0016] In the prior art NTC glass sealed thermistors, a glass having a softening point exceeding
560
0C is used and sealing is carried out at a temperature exceeding 610°C. If sealing
of a PTC thermistor is carried out under such conditions, there is a marked drop in
the properties of the resulting PTC thermistor. According to the present invention,
however, it is possible to obtain stable PTC thermistors whose properties drop only
slightly by sealing the thermistor elements in a low-melting glass having a softening
point of no higher than 560°C.
[0017] Figure 2 shows the results of an experiment run wherein PTC thermistor elements having
a Curie point of 120°C were sealed in glasses in the art.
[0018] Although the resulting properties having slightly dropped from the initial ones (prior
to sealing), yet the PTC thermistor element sealed in a glass having a softening point
of 536
0C or 560°C has been found to show excellent properties. It has also been found that
similar results are obtained with PTC thermistor elements having different Curie points.
The results of Figure 2 are also numerically given in Table 1.
[0019] Figure 3 is a characteristic diagram of a PTC thermistor sealed in glass in various
atmospheres. The PTC thermistor used had a Curie point of 120°C, and sealing was carried
out at 610°C.
[0020] It is clear from the diagram that sealing in air or oxygen gas yields a better PTC
thermistor as compared with one treated in vacuo or in an inert or reducing gas atmosphere.
The results of Figure 3 are numerically given in Table 2.
[0021] It is to be understood that similar results are obtained in an air/oxygen mixture
and/or with a PTC thermistor element having a different Curie point.
[0022] Figure 4 is a graphical view showing the relation between the specific resistance
and the temperature of PTC thermistors obtained by sealing a PTC thermistor element
having a Curie point of 120
0C in glass in air and/or oxygen gas. The results of Figure 4 are numerically given
in Table 3.
[0023] From these results, it is found that by a process according to the present invention
PTC thermistors are obtained which show a large change in resistance, which is comparable
to the properties prior to sealing.
[0024] It is to be understood that similar results are obtained in an air/oxygen mixture
and/or with PTC thermistor elements having a different Curie point.
[0026] As explained above, the present invention makes it possible to inexpensively prepare
PTC thermistors having excellent properties, and is therefor of industrially high
value.
1. A process for the production of PTC thermistors characterised by sealing a positive temperature coefficient semiconductor
ceramic material (1) in glass (4) in the presence of air, oxygen or an air/oxygen
mixture (wherein 0% the volume of air 100%).
2. A process for the production of PTC thermistors characterised by sealing a positive
temperature coefficient semiconductor ceramic material (1) in a low-melting glass
having a softening point of no higher than 560°C.
3. A process for the production of PTC thermistors characterised by sealing a positive
temperature coefficient semiconductor ceramic material (1) in a low-melting glass
(4) having a softening point of no higher than 560°C in the presence of air, oxygen
or an air/oxygen mixture (wherein 0% the volume of air 100%).
4. A process according to claim 1, 2 or 3, characterised in that the glass (4) has
a softening point of from 450°C to 560°C inclusive.
5. A process according to any one of the preceding claims, characterised in that the
glass (4) is in the form of a tube sealed at both ends.
6. A process according to claim 5, characterised in that lead wires (3) are inserted
into opposite ends of the glass tube (4) prior to the sealing thereof.
7. A process according to claim 5 or 6, characterised in that electrodes (2) are applied
to opposite sides of the semiconductor material (1) prior to its insertion in the
glass tube (4).
8. A process according to any one of the preceding claims, characterised in that the
glass used is based on B2O3-PbO-ZnO, B2O3-PbO-SiO2, B2O3-PbO-Ti2O, B2O3-PbO-SiO2-Al2O3-ZnO, B203-PbO-V2051 Sio2-PbO-K20, SiO2-PbO-Na2O or SiO2-PbO-K2O-Na2O.
9. A process according to any one of the preceding claims, characterised in that the
semiconductor material (1) is a barium titanate ceramic material.
10. A process according to claim 9, characterised in that the barium titanate ceramic
material has added thereto any one of trivalent antimony, trivalent bismuth, pentavalent
tantalum, pentavalent niobium or a rare earth metal.