(19) |
 |
|
(11) |
EP 0 158 890 A3 |
(12) |
EUROPEAN PATENT APPLICATION |
(88) |
Date of publication A3: |
|
08.10.1986 Bulletin 1986/41 |
(43) |
Date of publication A2: |
|
23.10.1985 Bulletin 1985/43 |
(22) |
Date of filing: 29.03.1985 |
|
|
(84) |
Designated Contracting States: |
|
DE FR GB |
(30) |
Priority: |
11.04.1984 US 599120
|
(71) |
Applicant: International Business Machines Corporation |
|
() |
|
(72) |
Inventors: |
|
- Abber, Russell Louis
()
- Horkans, Wilma Jean
()
|
|
|
|
(54) |
Activating a substrate for electroless plating |
(57) A dielectric surface is conditioned for electroless plating of a conductive metal
thereon by contacting the surface with a colloid of a precious metal and tin and then
contacting the surface with a salt of ethylene diamine tetraacetic acid and/ or of
diethylene triamine pentaacetic acid.