(19)
(11) EP 0 158 890 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
08.10.1986 Bulletin 1986/41

(43) Date of publication A2:
23.10.1985 Bulletin 1985/43

(21) Application number: 85103734

(22) Date of filing: 29.03.1985
(84) Designated Contracting States:
DE FR GB

(30) Priority: 11.04.1984 US 599120

(71) Applicant: International Business Machines Corporation
 ()

(72) Inventors:
  • Abber, Russell Louis
     ()
  • Horkans, Wilma Jean
     ()

   


(54) Activating a substrate for electroless plating


(57) A dielectric surface is conditioned for electroless plating of a conductive metal thereon by contacting the surface with a colloid of a precious metal and tin and then contacting the surface with a salt of ethylene diamine tetraacetic acid and/ or of diethylene triamine pentaacetic acid.





Search report