(57) A high density electrical connector for use between semiconductor module boards (10,
20). The connector body (211) comprises a relatively rigid member and a flexible member
connected to it, which provides elastomeric contact pressure. The rigid and flexible
members are embodied in a dual durometer rubber layers (71,81) having a relatively
high durometer layer for the rigid member (81) and a relatively low durometer layer
for the flexible member (71). The relatively low durometer layer (71) has circuit
connector leads disposed on an additional flexible layer (90) on the side facing away
from the relatively high durometer layer (81). During the positioning of the electrical
conductor into the relatively low durometer layer by pressing against a circuit board
(10,20), a wiping action occurs to clean dust particles and other contaminants from
the connector surface prior to forming an electrically conductive bond thereon.
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