| (19) |
 |
|
(11) |
EP 0 164 580 A3 |
| (12) |
EUROPEAN PATENT APPLICATION |
| (88) |
Date of publication A3: |
|
30.12.1986 Bulletin 1986/52 |
| (43) |
Date of publication A2: |
|
18.12.1985 Bulletin 1985/51 |
| (22) |
Date of filing: 10.05.1985 |
|
|
| (84) |
Designated Contracting States: |
|
DE FR GB |
| (30) |
Priority: |
17.05.1984 US 611278
|
| (71) |
Applicant: International Business Machines Corporation |
|
() |
|
| (72) |
Inventors: |
|
- Amelio, William Joseph
()
- Bartolotta, Peter Gerard
()
- Markovich, Voya
()
- Parsons, Ralph Elliott
()
|
|
| |
|
| (54) |
Electroless copper plating bath and plating method using such bath |
(57) The electroless copper plating bath having improved stability contains a cationic
polymer from acrylamide and/or methacrylamide. The plating bath also contains essentially
a cupric ion source, a reducing agent forthe cupric ion source, and a complexing agent
for the cupric ion.
A substrate to be plated is contacted with the plating bath maintained preferably
at a temperature in the range between about 70°C and about 80°C.