(19)
(11) EP 0 172 889 A1

(12)

(43) Date of publication:
05.03.1986 Bulletin 1986/10

(21) Application number: 85901243.0

(22) Date of filing: 15.02.1985
(51) International Patent Classification (IPC): 
H01L 23/ 14( . )
H01L 23/ 538( . )
H01L 29/ 06( . )
H01L 23/ 522( . )
H01L 23/ 64( . )
(86) International application number:
PCT/US1985/000263
(87) International publication number:
WO 1985/003806 (29.08.1985 Gazette 1985/19)
(84) Designated Contracting States:
DE FR GB NL

(30) Priority: 17.02.1984 US 19840581259
17.02.1984 US 19840581260
17.02.1984 US 19840581336
21.02.1984 US 19840582079

(71) Applicant: AT&T Corp.
New York, NY 10013-2412 (US)

(72) Inventors:
  • NG, Kwok, Kwok
    Union, NJ 07083 (US)
  • SZE, Simon, Min
    Murray Hill, NJ 07974 (US)
  • TAI, King, Lien
    Berkeley Heights, NJ 07922 (US)

(74) Representative: Buckley, Christopher Simon Thirsk, et al 
AT&T (UK) Ltd. 5 Mornington Road
Woodford Green Essex IG8 0TU
Woodford Green Essex IG8 0TU (GB)

   


(54) INTEGRATED CIRCUIT CHIP ASSEMBLY