WAFER SCALE PACKAGE SYSTEM AND HEADER AND METHOD OF MANUFACTURE THEREOF - Patent 0174950

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(11)

EP 0 174 950 A1

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(43)	Date of publication:
	26.03.1986 Bulletin 1986/13

(21)	Application number: 85901256.0

(22)	Date of filing: 21.02.1985

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International Patent Classification (IPC):

H01L 21/ 60^{( . )}
H01L 23/ 495^{( . )}
H01L 23/ 52^{( . )}

H01L 23/ 48^{( . )}
H01L 23/ 50^{( . )}
H01L 23/ 538^{( . )}

(86)	International application number:
	PCT/US1985/000280

(87)	International publication number:
	WO 1985/003804 (29.08.1985 Gazette 1985/19)

(84)	Designated Contracting States:
	BE DE FR GB NL

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Priority:

21.02.1984 US 19840581975

(60)	Divisional application:
	90117293.2 / 0409290

(71)	Applicant: MOSAIC SYSTEMS, INC.
	Troy, MI 48084 (US)

(72)	Inventors:
	STOPPER, Herbert Orchard Lake, MI 48033 (US) PERKINS, Cornelius, Churchill Birmingham, MI 48009 (US)

(74)	Representative: Kirby, Harold Douglas Benson, et al
	G.F. Redfern & Company Marlborough Lodge 14 Farncombe Road Worthing West Sussex BN11 2BT Worthing West Sussex BN11 2BT (GB)

(54)	WAFER SCALE PACKAGE SYSTEM AND HEADER AND METHOD OF MANUFACTURE THEREOF