(57) Disclosed is a substrate for an array of integrated circuit dice 10' disposed in
a regular array on the monolithic wafer substrate 1. Also disposed on the wafer substrate
1 is a network 11' interconnecting various circuits 10', with other integrated circuits,
disposed in the array formed on the wafer for data transfer therebetween. Terminals
12' exist in the network 11' for connection of the connections of the network with
the various integrated circuits 10'. The networks are connected to a contact pad by
one or more connection pads 13', for power and for data entry, and there is provided
an auxiliary lead and contact pad for each network for testing each network for operability,
also disclosed in the testing method.
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