(57) There is disclosed a chemical copper plating solution containing a copper salt, a
complexing agent, a reducing agent and a pH adjustor which further comprises at least
one of the following Groups (A) and (B); Group (A); at least one non-ionic surface
active agent selected from the group consisting of a non-ionic surface active agent
having the formula:
(wherein m, and n, each represent an integer of 1 or more) and a non-ionic surface
active agent having formula:
(wherein m2 and n2 each represent an integer of 1 or more), and at least one compound selected from
the group consisting of 1,10-phenanthroline, a 1,10-phenanthroline derivative, 2,2'-dipyridyl,
2,2'-biquinotine and a water-soluble cyan compound; Group (B); an organic sulfur compound
and an ethyleneamine compound.
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