(57) A surface grinding apparatus for grinding the surface of a workpiece (W) such as
a semiconductor wafer. The surface grinding apparatus comprises a support stand (4),
at least one workpiece holding chuck table (6) rotatably mounted on the support stand
(4), a rotatably mounted grinding wheel (8) for grinding the surface of the workpiece
(W) held on the chuck table (6), chuck table rotating means (76) for rotating the
chuck table (6) and wheel rotating means (116) for rotating the grinding wheel (8).
When grinding the surface of the workpiece (W) held on the chuck table (6) with the
grinding wheel (8), the grinding wheel (8) is rotated and the chuck table (6) is also
rotated to rotate the workpiece (W) held on the chuck table (6).
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