(19)
(11) EP 0 238 665 A1

(12)

(43) Date of publication:
30.09.1987 Bulletin 1987/40

(21) Application number: 86902027.0

(22) Date of filing: 27.03.1986
(51) International Patent Classification (IPC): 
H01L 21/ 52( . )
H01L 21/ 60( . )
H01L 23/ 48( . )
H01L 21/ 58( . )
H01L 21/ 603( . )
H01L 29/ 744( . )
(86) International application number:
PCT/JP1986/000145
(87) International publication number:
WO 1987/001866 (26.03.1987 Gazette 1987/07)
(84) Designated Contracting States:
DE FR GB

(30) Priority: 20.09.1985 JP 19850209407

(71) Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
Tokyo 100 (JP)

(72) Inventor:
  • HAGINO, Hiroyasu Mitsubishi Denki K.K.
    Itami-shi Hyogo-ken 664 (JP)

(74) Representative: Lawson, David Glynne, et al 
MARKS & CLERK, 57-60 Lincoln's Inn Fields
London WC2A 3LS
London WC2A 3LS (GB)

   


(54) SEMICONDUCTOR DEVICE