(19)
(11)
EP 0 238 665 A1
(12)
(43)
Date of publication:
30.09.1987
Bulletin 1987/40
(21)
Application number:
86902027.0
(22)
Date of filing:
27.03.1986
(51)
International Patent Classification (IPC):
H01L
21/
52
( . )
H01L
21/
60
( . )
H01L
23/
48
( . )
H01L
21/
58
( . )
H01L
21/
603
( . )
H01L
29/
744
( . )
(86)
International application number:
PCT/JP1986/000145
(87)
International publication number:
WO 1987/001866
(
26.03.1987
Gazette 1987/07)
(84)
Designated Contracting States:
DE FR GB
(30)
Priority:
20.09.1985
JP 19850209407
(71)
Applicant:
MITSUBISHI DENKI KABUSHIKI KAISHA
Tokyo 100 (JP)
(72)
Inventor:
HAGINO, Hiroyasu Mitsubishi Denki K.K.
Itami-shi Hyogo-ken 664 (JP)
(74)
Representative:
Lawson, David Glynne, et al
MARKS & CLERK, 57-60 Lincoln's Inn Fields
London WC2A 3LS
London WC2A 3LS (GB)
(54)
SEMICONDUCTOR DEVICE