(19)
(11) EP 0 244 643 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
28.09.1988 Bulletin 1988/39

(43) Date of publication A2:
11.11.1987 Bulletin 1987/46

(21) Application number: 87104971

(22) Date of filing: 03.04.1987
(84) Designated Contracting States:
DE FR GB IT

(30) Priority: 08.05.1986 US 861192

(71) Applicant: Hewlett-Packard Company
 ()

(72) Inventors:
  • Nigro, Stephen J.
     ()
  • Berretta, Frederick S.
     ()
  • Bearss, James G.
     ()
  • Meyer, Wesley L.
     ()

   


(54) Process for manufacturing thermal ink jet printheads and structures produced thereby


(57) This invention is directed to a process for manufacturing thermal ink jet printheads wherein a polymer barrier layer is employed between a thin film resistor (TFR) substrate and a metal nozzle plate and serves as both the ink reservoir-defining material and the adhesive bonding mechanism for firmly securing these members one to another. The polymer barrier layer material is initially U.V. cured, then partially thermally cured in a heat staker and finally completely thermally cured in an oven. The surface contour of the barrier layer follows that of the nozzle plate and TFR substrate and thereby prevents any gaps from occurring in this composite structure. This feature in turn enhances the structural integrity of the printhead, enhances its lifetime and improves its frequency response. Repeatability of manufacturing and a more consistent drop volume ejection from printhead to printhead is also achieved.






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