SUBSTRATE FOR DIRECT MOUNTING OF INTEGRATED CIRCUIT MODULES

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EP 0 245 491 A1

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(43)	Date of publication:
	19.11.1987 Bulletin 1987/47

(21)	Application number: 87900362.0

(22)	Date of filing: 20.10.1986

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International Patent Classification (IPC):

H05K 1/ 02^{( . )}
H05K 3/ 34^{( . )}

H05K 1/ 03^{( . )}

(86)	International application number:
	PCT/US1986/002197

(87)	International publication number:
	WO 1987/003163 (21.05.1987 Gazette 1987/11)

(84)	Designated Contracting States:
	AT BE CH DE FR GB IT LI LU NL SE

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Priority:

07.11.1985 US 19850795932

(71)	Applicant: SUNDSTRAND DATA CONTROL, INC.
	Redmond, WA 98073-9701 (US)

(72)	Inventor:
	BRADY, Arthur, R. Redmond, WA 98053 (US)

(54)	SUBSTRATE FOR DIRECT MOUNTING OF INTEGRATED CIRCUIT MODULES