INTERCONNECTS FOR WAFER-SCALE-INTEGRATED ASSEMBLY - Patent 0253886

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EP 0 253 886 A1

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(43)	Date of publication:
	27.01.1988 Bulletin 1988/04

(21)	Application number: 87902022.0

(22)	Date of filing: 24.12.1986

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International Patent Classification (IPC):

H01L 25/ 00^{( . )}
H01L 23/ 52^{( . )}
H01L 25/ 07^{( . )}
H01L 31/ 167^{( . )}

G02B 6/ 43^{( . )}
H01L 25/ 065^{( . )}
H01L 25/ 18^{( . )}

(86)	International application number:
	PCT/US1986/002805

(87)	International publication number:
	WO 1987/004566 (30.07.1987 Gazette 1987/17)

(84)	Designated Contracting States:
	DE FR GB IT NL

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Priority:

21.01.1986 US 19860820624

(71)	Applicant: AT&T Corp.
	New York, NY 10013-2412 (US)

(72)	Inventors:
	HORNAK, Lawrence, Anthony Ocean, NJ 07712 (US) TEWKSBURY, Stuart, Keene Middletown, NJ 07748 (US)

(74)	Representative: Johnston, Kenneth Graham, et al
	AT&T (UK) Ltd. 5 Mornington Road Woodford Green Essex, IG8 OTU Woodford Green Essex, IG8 OTU (GB)

(54)	INTERCONNECTS FOR WAFER-SCALE-INTEGRATED ASSEMBLY