(19)
(11) EP 0 259 069 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
15.02.1989 Bulletin 1989/07

(43) Date of publication A2:
09.03.1988 Bulletin 1988/10

(21) Application number: 87307378.7

(22) Date of filing: 20.08.1987
(51) International Patent Classification (IPC)4: B27N 3/04
(84) Designated Contracting States:
AT BE CH DE ES FR GB IT LI LU NL SE

(30) Priority: 03.09.1986 CA 517415

(71) Applicant: MACMILLAN BLOEDEL LIMITED
Vancouver British Columbia V6E 3R9 (CA)

(72) Inventor:
  • Barnes, Derek
    Vancouver B.C. V6P 2A7 (CA)

(74) Representative: Heath, Derek James et al
BROMHEAD & CO. 19 Buckingham Street
London WC2N 6EF
London WC2N 6EF (GB)


(56) References cited: : 
   
       


    (54) Waferboard lumber


    (57) Substitute lumber pieces having strengths and densities substantially equivalent to lumber are cut from single layer panels (18) of over about 1 and normally less than 4 inch thickness made from wood wafers. The wafers are oriented with their lengths having a mean deviation to the longitudinal length of the panel measured in the major plane of the panel in the range of 0 to 10 degrees and a mean deviation measured in a minimum longitudinal plane perpendicular to the major plane from 0 to about 5 degrees and have an average effective length of at least 8 inches (200 mm), and preferably an average thickness less than 0.15 inches (4 mm) and a width of at least 0.25 inches (6 mm). Lumber is made by cutting the panel longitudinally. Preferably the panels are formed to have a substantially uniform density profile throughout their thicknesses.







    Search report