ELECTROLYTE SOLUTION AND PROCESS FOR HIGH SPEED GOLD PLATING

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EP 0 261 203 A1

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(43)	Date of publication:
	30.03.1988 Bulletin 1988/13

(21)	Application number: 87902236.0

(22)	Date of filing: 02.03.1987

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International Patent Classification (IPC):

C25D 3/ 48^{( . )}

C25D 3/ 62^{( . )}

(86)	International application number:
	PCT/US1987/000513

(87)	International publication number:
	WO 1987/005339 (11.09.1987 Gazette 1987/20)

(84)	Designated Contracting States:
	AT BE CH DE FR GB IT LI LU NL SE

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Priority:

05.03.1986 US 19860836240

(71)	Applicant: VANGUARD RESEARCH ASSOCIATES, INC.
	South Plainfield, NJ 07080 (US)

(72)	Inventor:
	LOCHET, Jean, A. Metuchen, NJ 08840 (US)

(54)	ELECTROLYTE SOLUTION AND PROCESS FOR HIGH SPEED GOLD PLATING