[0001] This invention relates to a waveguide arrangement and more particularly, but not
exclusively, to a waveguide of the type formed from two parts, each having a channel
and means for connecting the parts together so that the two channels co-operate to
form a rectangular waveguide.
[0002] One such waveguide is shown in Figures 1A, 1B and 1C which show a known waveguide
in perspective view, a transverse section of the waveguide of Figure 1A and a sectional
view along the line W-W of Figure 1B respectively.
[0003] Waveguides formed in this way are most efficient if the "split" between the two parts
is mid-way along the broad dimension of the rectangular cross-section of the waveguide.
This is because, at this position, the radio frequency current is zero or near zero
and thus the split has little effect on the performance of the waveguide. This technique
is known generally as "E-plane technology" because the split is in the plane of the
electric or E field of the dominant waveguide mode.
[0004] E-plane technology is employed in integrated systems comprising a number of components
joined by waveguides, both waveguides and components being fabricated in a common
conductive block. In many such systems it is desirable to mount conductors or components
inside the waveguide at or near the E-plane, for instance in fin-line switches. These
conductors or components are often mounted on printed circuit boards (P.C.B's). This
introduces a problem in that the P.C.B substrate provides a route for energy travelling
along the waveguide to escape, which is obviously undesirable.
[0005] In a first known method, a P.C.B. substrate is supported in detents in the sides
of the waveguide, the detents being so small compared to the wavelength of the radiation
carried in the waveguide that they have negligible effect on its propogation. Such
a waveguide is shown in Figures 2A, 2B and 2C which show a waveguide of this known
type in perspective view, a transverse cross section of the waveguide of Figure 2A
and a sectional view on the line X-X of Figure 2B respectively. This method has the
disadvantage of complexity and expense because it requires the P.C.B.'s to be manufactured
and placed with great accuracy. Also it is difficult to D.C. isolate the P.C.B's from
the waveguide walls if this is required.
[0006] In another known method, a P.C.B. substrate passes through the walls of the waveguide
and a system of R.F. chokes is used to prevent the escape of radiation from the waveguide.
Such a waveguide is shown in Figures 3A, 3B and 3C which show a waveguide of that
known type in perspective view, a transverse cross section of the waveguide of Figure
3A and a sectional view on the line Y-Y of Figure 3B respectively. The problem with
this method is that the space required for the chokes greatly increases the size of
the waveguide assembly and the chokes allow a significant amount of radiation to escape
from the waveguide.
[0007] According to the invention there is provided a waveguide arrangement comprising a
waveguide and an insulating body arranged to partially occupy the waveguide, characterised
by at least some of the surfaces of the insulating body bearing conductive material
which is substantially coplanar with a surface of the waveguide.
[0008] This gives the advantage that the problems of the known methods outlined above are
avoided, such an arrangement prevents the escape of radiation without the need for
chokes and because the insulating body defines the edges of the waveguide the very
accurate manufacturing and assembly required to use detents is not needed, also it
is relatively simple to D.C. isolate the insulating body from the waveguide walls.
[0009] Preferably the insulating body is substantially planar and the surfaces bearing conductive
material are edges of the insulating body.
[0010] Advantageously the surfaces bearing conductive material are provided by apertures
through the insulating body.
[0011] A waveguide assembly embodying the invention will now be described with reference
to the accompanying figures in which:
Figure 4A shows a waveguide assembly in accordance with the invention,
Figure 4B shows a transverse cross section of the waveguide of Figure 4A,
Figure 4C shows a sectional view on the line Z-Z of Figure 4B,
Figure 5 shows a more detailed transverse cross section through the waveguide of Figure
4A,
Figure 6 shows a cross section through another type of waveguide assembly constructed
according to the invention,
Figure 7 shows a top view of the PCB used in the waveguide of Figure 5, and
Figure 8 shows a transverse cross section through yet another type of waveguide assembly
constructed according to the invention; identical parts having the same reference
numerals throughout.
[0012] Referring to Figures 4A, B and C and 5, in a waveguide assembly constructed in accordance
with the invention, a P.C.B. 10 separates the two conductive bodies 2 and 3. The P.C.B.
10 has a number of slots 11 cut in it, which are plated through with a layer of conductive
material 12. The slots 11 are positioned so that when the P.C.B. 10 is in place, the
layer of conductive material 12 is coplanar with a side wall of the waveguide 1 such
that the two conductive bodies 2 and 3 and the conductive layer 12 form a single conductive
surface.
[0013] The conductive layer 12 acts as a part of the waveguide wall and prevents the escape
of the radiation propagated along the wavegude. In order to give good results, the
portions of the PCB 13 between the slots should be made as small as possible, in order
to prevent the escape of radiation through them, however the gaps must also be large
enough to give the P.C.B. 10 the necessary physical strength. It has been found that
a slot separation in the approximate range λ/10 to λ/20 gives good results.
[0014] The length 14 and width 15 of the slots 11 must be such that they do not form resonant
cavities and radiate the radiation propagating along the waveguide 1 to the outside,
the length 14 of the slots being near to an odd number of λ/4 and the width 15 being
in the approximate range λ/10 to λ/20 has been found, to prevent resonance.
[0015] The assembly shown in Figures 6 and 7 is used when it is necessary to D.C. isolate
the P.C.B. 10 from the conductive bodies 2 and 3 in order to allow D.C. biasing and
control signals to pass to components on the P.C.B. 10 in the waveguide 1.
[0016] Referring to figure 6, a conductive pattern 16 is laid down in the surface of the
P.C.B. 10 to carry power to a diode 17 mounted on the P.C.B. 10 in the waveguide 1.
An insulating layer 18 is then laid down on the conductive surface of the P.C.B. 10
so that when the waveguide is assembled the insulating layer separates the conductive
surface of the P.C.B. 10 from the conductive bodies 2 and 3. This insulating layer
18 insulates the conductive pattern 16 and the conductive layers 12 from the conductive
bodies 2 and 3 and so allows D.C. isolation.
[0017] Another way in which the invention could be used is shown in Figure 8. A P.C.B. 19
is supported by detents 20 in conductive bodies 2 and 3. Conductive layers 21 on the
edges of the P.C.B. 19 are arranged to form a part of the waveguide walls together
with the conductive bodies 2 and 3.
[0018] The conductive layers 21 cannot, of course, be coplanar with the conductive bodies
2 and 3 because there must be enough overlap to support the P.C.B. 10, but if the
overlap is small enough the overlap will not affect the radiation propagating in the
waveguide 1. Since the detents 20 cut into the conductive bodies 2 and 3 do not define
the walls of the waveguide 1 they need not be formed with precision.
[0019] Although this description refers to a P.C.B. any other type of insulating substrate
could be used.
1. A waveguide arrangement comprising a waveguide and an insulating body arranged
to partially occupy the waveguide, characterised by at least some of the surfaces
of the insulating body bearing conductive material which is substantially coplanar
with a surface of the waveguide. 2. A waveguide arrangement as claimed in claim 1
in which the insulating body is substantially planar and the surfaces bearing conductive
material are edges of the insulating body.
3. A waveguide arrangement as claimed in any preceding claim in which the surfaces
bearing conductive material are provided by apertures through the insulating body.
4. A waveguide arrangement as claimed in claim 3 in which the apertures have, at least
one planar face bearing conductive material and arranged to be substantially coplanar
with a surface of the waveguide. 5. A waveguide arrangement as claimed in any preceding
claim in which the insulating body is a printed circuit board.
6. A waveguide arrangement as claimed in claim 5 when dependent on claim 4 in which
the conductive material is provided by through plating of apertures in the printed
circuit board.