(19)
(11) EP 0 301 523 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
08.02.1989 Bulletin 1989/06

(43) Date of publication A2:
01.02.1989 Bulletin 1989/05

(21) Application number: 88112166.9

(22) Date of filing: 27.07.1988
(51) International Patent Classification (IPC)4C08J 3/24, C08J 3/28, C08F 283/08, C08L 71/12
(84) Designated Contracting States:
BE DE FR GB NL

(30) Priority: 28.07.1987 JP 189473/87
16.09.1987 JP 233269/87

(71) Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
Osaka-shi, Osaka 541 (JP)

(72) Inventor:
  • Sakamoto, Yoshito c/o Osaka Works
    Konohana-ku Osaka- (JP)

(74) Representative: Patentanwälte Kirschner & Grosse 
Forstenrieder Allee 59
81476 München
81476 München (DE)


(56) References cited: : 
   
       


    (54) Molding of modified polyphenylene oxide resin


    (57) A molding of modified polyphenylene oxide resin comprises a composite of modified polyphenylene oxide containing polyphenylene oxide having structure expressed in the following general formula (I) as a basic skeleton, which resin composite preferably contains a cross linking agent, more preferably phosphoric ester serving as a cross linking agent, while the molding is cross-linked by irradiation to ionizing radiation:

    where R₁, R₂, R₃ and R₄ represents univalent substituents selected from a group of hydrogen, alkyl group, halogen, alkoxyl group and haloalkoxyl group, and n represents a natural number.







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