[0001] The invention relates to a cooling device or heat pump, comprising a number of vertical,
hollow cooling plates which are placed in planes parallel to each other and which
are connected near the bottom edge of the cooling plates to a supply pipe for the
infeed of evaporable cooling medium to the interior of the cooling plates, and near
their top edge are connected to a pipe which runs parallel to the supply pipe and
is for the discharge of evaporated cooling medium, while provision is made above the
top edges of the cooling plates for a trickle device out of which the liquid to be
cooled can flow in the form of a thin film over the outer surfaces of the cooling
plates and can finally reach a collecting tank under the bottom edges of the cooling
plates.
[0002] Such a device is known, for example from DE-A-3306865.
[0003] This known device has a number of hollow plates which at the top and bottom are integral
with collecting pipes which are all closed at one end, while at the other end they
are connected near the bottom edge of the plates to a supply pipe, and are connected
near the top edge at the same side to a discharge pipe.
[0004] A device is provided above the cooling plates for feeding in, at the outside of the
cooling plates, the liquid which has to give off heat, said feed device in general
comprising a tank with a large number of apertures situated above the top edges of
the plates, so that the liquid emerging therefrom can flow downwards in the form of
a thin film over the plates and is collected in a tank underneath for discharge or
further use.
[0005] In the known device the plates are placed at a relatively great distance from each
other. The device is therefore bulky.
[0006] Very great stresses can occur in the cooling plates and in the connections between
these cooling plates and the feed or discharge pipes, in particular in the connections
with the latter pipes, due to the fact that temperature differences of the order of
40°C can occur within a few minutes, namely from +20 to -20°C. This leads to heat
stresses and vibrations, and means that there is a risk of fatigue fractures, in particular
at the connections with the discharge pipes. In the above-mentioned known device the
connection between the top discharge pipe and the collecting pipes formed at the
top edges of the plates is a straight axial extension of these collecting pipes. Such
a design cannot absorb heat stresses very well, but leakage of the cooling medium,
for example Freon, definitely must not occur. In order to ensure a reliable design
all the same, it is known to make plates and tubes of the required wall thickness
using high-quality material. This is at the expense of the heat transfer, and makes
the device expensive. The device must be able to withstand pressure changes which
can go as high as 30 bars.
[0007] The object of the invention is then to produce a cooling device which takes up less
space, is capable of absorbing heat stresses and can therefore be made of thinner
material, and in which the volume of cooling medium can be smaller. The discharge
pipe for evaporated cooling medium opens into a separator for separating vapour and
liquid from each other. Reducing the amount of cooling medium affects the size of
the separator.
[0008] This object is achieved according to the invention in the first place by the fact
that:
the supply pipe for cooling medium is situated essentially centrally below the bottom
edges of the cooling plates and is connected to the inside of each cooling plate by
means of vertical pipe lengths;
the discharge for evaporated cooling medium comprises two discharge pipes, one near
each top corner of the cooling plates;
the discharge pipes are connected to the cooling plates at the corners by elbow-type
pipe lengths;
the elbow-type pipe lengths are connected to the discharge pipes so that they are
staggered relative to each other;
the vertical pipe lengths between supply pipe and bottom side of the cooling plates
are connected to the supply pipe in staggered fashion;
all this being in such a way that the vertical pipe lengths and the elbow-type pipe
lengths belonging to one cooling plate lie between those of the preceding or following
plate.
[0009] Instead of one discharge pipe for evaporated cooling medium, one now uses two pipes,
which preferably have a diameter considerably greater than that of the collecting
chambers or collecting pipes on the top of the plates. This already makes it possible
to absorb pressure peaks caused by the evaporation of the cooling medium. Heat stresses
can be absorbed by using elbow-type pipe lengths between the discharge pipes and the
top ends of the plates.
[0010] Since all pipe lengths are connected staggered relative to each other to the discharge
pipes, but also to the supply pipe, the cooling plates can be placed close together,
which makes the whole device smaller.
[0011] Placing the supply pipe for the cooling medium centrally below the cooling plates
means that uniform distribution is achieved in the spread of the cooling medium occurring
in the plates from the bottom. This again is an advantage as regards the heat stresses
occurring.
[0012] A further simplification of the design can be obtained if according to the invention
the supply pipe and the discharge pipe are essentially the same as regards their diameter
and the connection points of the respective pipe lengths. A single type of pipe can
be used to permit placing of the cooling plates close to each other.
[0013] These cooling plates can have alternately differing measurements. It is, however,
preferable to have a cooling device in which the cooling plates are identical and
are alternately displaced laterally relative to each other. This lateral displacement
is then in keeping with the staggered connection points, i.e. displaced in the same
direction, to the discharge pipe(s), so that the elbow-type pipe lengths can be essentially
equal to each other and the straight pipe lengths at the bottom edge can be located
precisely in the centre of the bottom edge of each cooling plate.
[0014] It is also possible according to the invention to use cooling plates which are identical
to each other, but which are displaced in the vertical direction alternately relative
to each other, with or without lateral displacement. The elbow-type and straight pipe
lengths then do have alternately differing measurements, but the number of types is
limited. It is, however, possible here to place the plates closer together, in particular
if these plates have collecting chambers or pipes at the top and/or bottom whose diameter
is greater than the horizontal external thickness of the plates.
[0015] A very expedient design of the cooling plates is obtained if they are thin plates,
which are connected to each other along the vertical edges to form one unit, for example
by welding, which are connected along the top and bottom edge to collecting pipes,
forming a continuous connection between the inside of the cooling plates and said
pipes, and which have weld points between them, uniformly distributed over the surface
of the two plates, these plates being pressed apart by means of internal excess pressure
in the areas between the connection points after the joins have been made.
[0016] It is pointed out that it is known per se, for example from European Patent Specification
0,112,513, in a heat exchanger such as a radiator to connect the vertical ribbed pipes
through which medium to be cooled flows in a staggered arrangement to a collecting
pipe (see Figs. 4 and 5 in particular). However, in this case it is not a question
of avoiding heat stresses, but the idea is to place pipes provided with cooling ribs
as closely together as possible. Heat stresses of any significance do not, however,
occur here.
[0017] The invention will now be explained in greater detail with reference to the drawings.
Fig. 1 shows in perspective and very schematically the main part of a device according
to the invention.
Fig. 2 is a cross section through the front cooling plate shown in Fig. 1, and indicated
by the arrow A.
Fig. 3 is a cross section which is comparable to that of Fig. 2 through the plate
which is displaced relative to the plate A, and which is indicated by the arrow B.
Fig. 4 shows a view of a corner of a plate, with the connecting pipe length omitted.
Fig. 5 is a longitudinal section through the succession of cooling plates shown in
Fig. 1, at the line V-V of Fig. 4.
Fig. 6 is a longitudinal section which shows the positioning of the cooling plates
relative to each other in a slightly different way, and which is made through the
area of the successive plates which is indicated by the line VI-VI in Fig. 4.
Fig. 7 shows a view of a supply or discharge pipe.
[0018] The device shown in Fig. 1 comprises a number of cooling plates which are placed
in vertical planes parallel to each other, and the first five of which are indicated
by the numbers 1 to 5. These cooling plates are identical to each other, i.e. height
and width are the same. The plates 1, 3 and 4 take up exactly the same space in the
device in the crosswise and vertical direction. The plates 2, 4 and subsequent plates
(not shown) are displaced both laterally, i.e. to the right in Fig. 1, and vertically,
i.e. downwards in Fig. 1, relative to the plates 1, 3 and 5.
[0019] A supply pipe 6 for liquid cooling medium is provided under the plates. Discharge
pipes 7, 8 for evaporated cooling medium are provided near the top corners.
[0020] All plates have a collecting pipe 9 at the bottom edge and a collecting pipe 10 at
the top edge. The diameter of these collecting pipes is about 1/5th of that of the
supply pipe 6 or discharge pipes 7 and 8.
[0021] The connection between the supply pipe 6 and the collecting pipes 9 is made with
straight pipe lengths 11, 12 which are in the centre of the bottom edge of the cooling
plates and are connected to the supply pipe 6 in staggered fashion.
[0022] The top collecting pipes 10 are connected by means of elbow-type pipe lengths 13,
14 to the discharge pipe 7, 8, the upward-facing ends of said pipe lengths 13, 14
connecting in a staggered manner to the discharge pipes 7, 8.
[0023] Fig. 7 shows a view of a pipe which is suitable for use as a supply pipe 6 or discharge
pipe 7 or 8. This pipe, which can have a diameter of, say, 10 cm, is provided with
connection points for the pipe lengths, said connection points being indicated by
15, 16 respectively, and being staggered relative to the central plane. In the case
of the supply pipe 6 they are at the top, and in the case of the discharge pipes they
are at the bottom.
[0024] Fig. 4 shows a corner part of a single cooling plate, for example plate 1, with a
collecting pipe at the top edge. The cool ing plate comprises two thin plates which
are connected along the vertical edges, such as the edge 17, either by welding edges
to each other or by folding over, and which have weld points 18 further distributed
over the surface to connect the individual plates.
[0025] Fig. 6 shows these weld points 18 in cross section and also shows that a throughflow
space 19 has been created between the plates. Slit-type connections with the collecting
pipe 9, 10 are provided between the top weld points and bottom weld points.
[0026] Fig. 6 also shows that the collecting pipes 10 are staggered relative to each other,
which means that the plates can be placed closer together. In addition, Fig. 6 shows
by line 20 the shape of the bottom of a liquid supply device with outflow aperture
21, 22, from which liquid can finally reach the outer surface of the collecting pipes
10, and from there can flow along the outside walls of the plates.
[0027] Fig. 5 shows yet another longitudinal section, omitting non-relevant parts, and
this figure shows how the collecting pipes 9, 10 connect in staggered fashion with
the pipe lengths 11 and 12 to the supply pipe 6 and with the elbow-type pipe lengths
13, 23 to the top discharge pipe, such as the pipe 7.
[0028] A compact unit is achieved by placing the cooling plates staggered relative to each
other and by the staggered connection to feed and discharge pipe(s). The symmetry
from supply to discharge and the pipe lengths used in the process make it possible
to keep the heat stresses under control. This again makes it possible to design the
device with a smaller volume for the cooling medium.
1. Cooling device or heat pump, comprising a number of vertical, hollow cooling plates
(2, 3, 4, 5) which are placed in planes parallel to each other and which are connected
near the bottom edge of the cooling plates to a supply pipe (6) for the infeed of
evaporable cooling medium to the interior of the cooling plates, and near their top
edge are connected to a pipe (7) which runs parallel to the supply pipe and is for
the discharge of evaporated cooling medium, while provision is made above the top
edges of the cooling plates (2, 3, 4, 5) for a trickle device out of which the liquid
to be cooled can flow in the form of a thin film over the outer surfaces of the cooling
plates and can finally reach a collecting tank under the bottom edges of the cooling
plates, characterized in that:
the supply pipe (6) for cooling medium is situated essentially centrally below the
bottom edges of the cooling plates and is connected to the inside of each cooling
plate by means of vertical pipe lengths (11, 12);
the discharge for evaporated cooling medium comprises two discharge pipes (7, 8),
one near each top corner of the cooling plates;
the discharge pipes are connected to the cooling plates at the corners by elbow-type
pipe lengths (13, 14);
the elbow-type pipe lengths are connected to the discharge pipes so that they are
staggered relative to each other;
the vertical pipe lengths (11, 12) between supply pipe and bottom side of the cooling
plates are connected to the supply pipe in staggered fashion;
all this being in such a way that the vertical pipe lengths and the elbow-type pipe
lengths belonging to one cooling plate lie between those of the preceding or following
plate.
2.Cooling device according to Claim 1, characterized in that the supply pipe and the discharge pipe are essentially the same as regards their
diameter and the connection points of the respective pipe lengths.
3.Cooling device according to Claim 1 or 2, characterized in that the cooling plates are identical and are alternately displaced laterally relative
to each other.
4.Cooling device according to Claim 1, 2 or 3, characterized in that the cooling plates are identical and are alternately displaced relative to each
other in the vertical direction.
5.Cooling device according to Claim 4, in which the cooling plates have collecting
chambers or pipes at the top and/or bottom, characterized in that these are staggered relative to each other.
6.Cooling device according to one or more of the preceding claims, characterized in that the cooling plates are two thin plates, which are connected to each other along the
vertical edges to form one unit, for example by welding, which are connected along
the top and bottom edge to collecting pipes, forming a continuous connection between
the inside of the cooling plates and said pipes, and which have weld points between
them, uniformly distributed over the surface of the two plates, these plates being
pressed apart by means of internal excess pressure in the areas between the connection
points after the joins have been made.