ATTACHMENT OF SEMICONDUCTOR DIE TO LEAD FRAME BY MEANS OF AN ADHESIVE RESIN - Patent 0333734

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EP 0 333 734 A1

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(43)	Date of publication:
	27.09.1989 Bulletin 1989/39

(21)	Application number: 87907718.0

(22)	Date of filing: 12.11.1987

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International Patent Classification (IPC):

C09J 5/ 06^{( . )}
H01L 21/ 52^{( . )}
H01L 21/ 60^{( . )}

C09J 179/ 08^{( . )}
H01L 21/ 58^{( . )}
H01L 23/ 482^{( . )}

(86)	International application number:
	PCT/US1987/002952

(87)	International publication number:
	WO 1988/003704 (19.05.1988 Gazette 1988/11)

(84)	Designated Contracting States:
	CH DE FR GB IT LI NL SE

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Priority:

13.11.1986 US 19860930600

(71)	Applicant: M & T CHEMICALS, INC.
	Woodbridge, NJ 07095 (US)

(72)	Inventors:
	BOLSTER, William, N. Santa Rosa, CA 96401 (US) MARCUS, Stanley, A. Washington Crossing, PA 18977 (US) YING, Lincoln Bridgewater, NJ 08807 (US)

(74)	Representative: Jaeger, Klaus, Dr., et al
	Jaeger, Böck & Köster, Patentanwälte, Postfach 16 20 D-82121 Gauting D-82121 Gauting (DE)

(54)	ATTACHMENT OF SEMICONDUCTOR DIE TO LEAD FRAME BY MEANS OF AN ADHESIVE RESIN