| (19) |
 |
|
(11) |
EP 0 341 872 A3 |
| (12) |
EUROPEAN PATENT APPLICATION |
| (88) |
Date of publication A3: |
|
08.08.1990 Bulletin 1990/32 |
| (43) |
Date of publication A2: |
|
15.11.1989 Bulletin 1989/46 |
| (22) |
Date of filing: 28.04.1989 |
|
| (51) |
International Patent Classification (IPC)4: H01R 23/68 |
|
| (84) |
Designated Contracting States: |
|
DE FR GB IT NL |
| (30) |
Priority: |
09.05.1988 US 191636
|
| (71) |
Applicant: AT&T Corp. |
|
New York, NY 10013-2412 (US) |
|
| (72) |
Inventors: |
|
- Akkapeddi, Kaushik Sharma
Wharton
New Jersey 07885 (US)
- Rhodes, Ronald J.
South Plainfield
New Jersey 07080 (US)
- Mantay, Mark K.
Westfield
New Jersey 07090 (US)
- Winings, Clifford Lawrence
Lee's Summit
Missouri 64063 (US)
|
| (74) |
Representative: Johnston, Kenneth Graham et al |
|
Lucent Technologies (UK) Ltd,
5 Mornington Road
Woodford Green
Essex, IG8 OTU
Woodford Green
Essex, IG8 OTU (GB) |
|
| |
|
| (54) |
High density connectors |
(57) Disclosed are electrical connectors (15) for high density, large area interfaces
such as in circuit pack (11) to backplane (12) interconnections. The connectors utilize
some means, such as a multilayer structure (40) or flexible circuit (33), to provide
electrical connection and 90 degree translation from the circuit pack surface, and
a conductive elastomer (18, 19) to provide the connection from such means to the circuit
pack and/or backplane surface.