METHOD AND MEANS OF FABRICATING A SEMICONDUCTOR DEVICE PACKAGE - Patent 0344259

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EP 0 344 259 A1

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(43)	Date of publication:
	06.12.1989 Bulletin 1989/49

(21)	Application number: 89900040.0

(22)	Date of filing: 26.10.1988

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International Patent Classification (IPC):

H01L 25/ 18^{( . )}
H01L 23/ 02^{( . )}
H01L 23/ 24^{( . )}
H01L 23/ 498^{( . )}

H01L 21/ 50^{( . )}
H01L 23/ 04^{( . )}
H01L 23/ 31^{( . )}
H01L 25/ 04^{( . )}

(86)	International application number:
	PCT/US1988/003790

(87)	International publication number:
	WO 1989/004552 (18.05.1989 Gazette 1989/11)

(84)	Designated Contracting States:
	DE FR GB IT NL

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Priority:

30.10.1987 US 19870115228

(71)	Applicant: LSI LOGIC CORPORATION
	Milpitas, CA 95035 (US)

(72)	Inventors:
	LONG, Jon Livermore, CA 94550 (US) SIDOROVSKY, Rachel, S. San Jose, CA 95129 (US)

(74)	Representative: Noz, Franciscus Xaverius, Ir.
	Algemeen Octrooibureau P.O. Box 645 NL-5600 AP Eindhoven NL-5600 AP Eindhoven (NL)

(54)	METHOD AND MEANS OF FABRICATING A SEMICONDUCTOR DEVICE PACKAGE