Field of the Invention
[0001] This invention is concerned with improvements in or relating to methods for depositing
finish coatings on substrates of anodisable metals, such as aluminum and its anodisable
alloys, and to the products of such methods, and especially but not exclusively to
methods for plating finish coatings of chromium on aluminum and its alloys.
Review of the Prior Art
[0002] The deposition of chromium and other metals suitable as "finish" coatings on a substrate,
usually steel or aluminum, is a well-developed art. Plating on less easily oxidized
metals such as steel is relatively routine, involving for example the deposition of
a layer of copper directly on the steel substrate, followed in succession by a thick
"semi-bright" nickel layer, a thinner "bright" nickel layer, and an even thinner finish
layer of the chromium; the chromium is semi-transparent and the bright appearance
is actually provided by the bright nickel layer seen through the finish chromium layer.
[0003] Plating on anodisable metals, such as aluminum and its anodisable alloys, is considerably
more difficult owing to their relative ease of oxidation, and the consequent inevitable
presence of an oxide coating which must be removed if adequate adhesion of the deposited
layers to the underlying metal substrate is to be obtained. The art currently is dominated
by two methods of preparing the substrate surface, namely zincate and stannate immersion.
In these processes the substrate surface is immersed in a suitable zincate or stannate
solution, usually of the sodium salt, together with other additions that have been
found in practice to increase the appearance and adhesion of the coatings. The zinc
or tin atoms respectively displace aluminum atoms at the surface, in the process removing
the oxide layer, to result in an adherent zinc or tin layer on which other layers,
for example copper followed by nickel, can be deposited to constitute the finish layer,
or to constitute a support layer receiving a finish layer, e.g. of chromium. Both
of these processes are relatively expensive and are therefore mainly used on expensive
commodities. The stannate immersion processes are reported to provide better anti-corrosion
performance and adhesion of the resultant coatings, but are the more expensive of
the two because of the more expensive components and longer processing time.
[0004] It has also been proposed to deposit adherent metal coatings directly on aluminum
or aluminium alloy substrates by producing a porous anodized layer at the surface
of the substrate onto which the subsequent metal layers are deposited; this anodized
layer incorporating the oxide layer that was present on the substrate surface. In
an article entitled "Plating on Aluminum, a Review" by D.S. Lashmore, published in
the June 1985 issue of "Plating & Surface Finishing" (pp 36-39), summarizing previous
publications, it was reported that studies have shown that there must be a minimum
pore size in the anodized coating, into which the subsequent coatings can mechanically
"lock" or "key", and that this limits the process to the use of electrolytes that
will produce fairly large pores of the order of 0.07 micrometres (700 Angstroms).
The report goes on to state it has been found empirically that only anodising solutions
comprising phosphoric acid are sucessful, sulfuric or oxalic acid sometimes being
mixed with the phosphoric acid. The report further states that the adhesion of the
subsequent coatings is primarily mechanical, with the cohesive strength of the porous
oxide coatings to the metal substrate being the limiting factor, so that improvements
in the anodic process should be directed towards increasing this cohesive strength
and the strength of the oxide layer itself. Lastly, it mentions that local turbulence,
presumably in the anodizing bath, or changes in the electrochemical potential, can
lead to branching of the pores, and these phenomenon lead to higher mechanical adhesion.
Despite developments of these phosphoric acid anodizing/coating processes for over
50 years they have not yet been widely adopted commercially, apparently because of
relatively poor adhesion and brightness.
[0005] There is disclosed in U.S. Patents Nos. 4,111,763 and 4,163,083 processes for plating
chromium on aluminum and its alloys comprising anodizing the surface to be plated
in an acid bath, impregnating the anodized layer with a chemical that is pyrolisable
to form an electronically conductive oxide, and then heating the surface to pyrolise
the chemical to form the oxide in the pores of the anodized layer, thereby providing
an anodic coating of high ionic resistance forming a continuous high corrosion resistance
barrier layer upon which the plating of successive metal layers can be continued.
Suggested chemicals are stannous chloride and orthobutyl titanate to form respectively
stannous oxide and conductive titanium oxide (Ti₂O₃); with titanium the surface can
be further treated after plating of the finish coating to convert the (Ti₂O₃) to insulating
titanium dioxide (TiO₂).
Definition of the Invention
[0006] It is therefore the principal object of the present invention to provide new methods
for plating metal layers on substrates of aluminum and its alloys.
[0007] In accordance with the present invention there is provided a new method of depositing
a layer of a finish metal on a surface of a substrate of an anodisable metal, the
method including the steps of:
a) anodising the substrate at the said surface to produce a porous anodised layer
of thickness from about 0.5 to about 50 micrometres and having pores therein of transverse
dimension from about 0.005 to 0.10 micrometres;
b) depositing a pore-filling metal into the pores using AC or modified AC deposition
to completely fill the pores with the metal up to the surface of the anodised layer,
and continuing the deposition of the pore-filling metal to form a continuous support
layer on the surface of the anodised layer of thickness in the range about 0.5 to
3 micrometres; and
c) depositing at least one coating of a finish metal on the support layer.
[0008] Also in accordance with the invention there is provided a new method of depositing
a layer of a finish metal on a surface of a substrate of an anodizable metal, the
method including the steps of:
a) anodizing the substrate at the said surface to produce a porous anodized layer,
the substrate surface first being anodized to produce a large-pore anodised layer
portion with large pores opening to its free surface, and subsequently being anodised
to produce a small-pore anodized layer portion between the large-pore layer portion
and the remainder of the substrate communicating with the large pores of the large-pore
layer portion.
b) depositing a pore-filling metal on to the porous anodised layer to fill the pores
therein and to form a support layer of the pore-filling metal thereover; and
c) depositing at least one layer of a finish metal on the support layer.
Description of the Drawings
[0009] Methods of depositing various layers of metals on a surface of an anodisable substrate,
and the products of such methods, constituting particular preferred embodiments of
the invention, will now be described by way of example with reference to the accompanying
drawings, wherein:-
Figure 1 is a cross-section through the surface and adjacent portion of an aluminum
substrate and through a porous anodised layer that has been formed thereon by sulfuric
acid anodising;
Figure 2 is a cross-section similar to Figure 1 through a porous anodised layer that
has been formed on the anodisation substrate by phosphoric acid anodising;
Figure 3 is a cross-section through the surface and adjacent portion of an aluminum
substrate, through the porous anodised layer formed in accordance with the invention,
and through the various layers of metal that have been deposited on the anodised layer;
Figure 4 is a cross-section to a much enlarged scale of the small portion 4 of Figure
3, showing the anodised layer and the immediately adjacent metal layers; and
Figure 5 is the same cross-section as that of Figure 4, showing a part thereof to
a still larger scale;
Description of the Preferred Embodiments
[0010] The acid most widely used for porous anodising is sulfuric acid because of its ready
availability and lower cost, although phosphoric, oxalic and chromic acids, and mixtures
of these and other acids, can also be used. The anodised layer is inherently porous
in structure because of the manner of its formation, and a typical structure of a
layer 10 obtained by sulfuric acid anodising of an aluminum substrate 12 is shown
in Figure 1. For convenience in drawing the surfaces of the layers are shown as flat,
but in practice, even at quite low magnification these surfaces will be seen to be
highly irregular.
[0011] Figure 1 shows an anodised layer 10 of aluminum oxide (Al₂O₃) of about 5 micrometres
(50,000 Angstroms) thickness, that typically will be produced using sulfuric acid
at about 20°C and of about 165g/litre or 15% by weight concentration, employing an
anodising voltage of about 15-20 volts for 10 minutes. The porous structure obtained
is relatively uniform, although highly idealised as shown in Figure 1 for convenience
in drawing, and typically the pores will be found to average 0.015 micrometres (150
Angstroms) in transverse dimension, spaced on average about 0.024 micrometres (240
Angstroms) from one another. The pores do not end at the surface of the aluminum substrate,
but instead they are on average spaced about 0.015 micrometres (150 Angstroms) from
that surface to form a continuous non-porous barrier layer of the relatively non-conductive
aluminum oxide, the thickness of this layer depending principally directly on the
value of the anodising voltage. Usually with sulfuric acid anodising this thickness
averages about 0.0010 to 0.0014 micrometres (10 to 14 Angstroms) per volt. It may
be noted that references herein and in the literature to pore sizes, etc. are usually
made in Angstroms, while references to thicknesses are made in micrometres, merely
to avoid the need to refer to small fractions, 1 micrometre being equal to 10,000
Angstroms.
[0012] It has been found possible in previous commercial practice to form coatings of deposited
metal that are sufficiently strong and stable of up to about 5 micrometres thickness,
but beyond this value the hydrogen that is generated in the long, narrow pores (i.e.
length to width ratio in the sample illustrated of about 330:1) tends to cause spalling
of the coating, destroying its strength to the extent that it is unsuitable to receive
and retain the subsequent metal layers. Another problem is that it is difficult to
deposit a sufficiently adherent coating of a pore-filling metal into the long narrow
pores employing conventional D.C. plating methods. Thus, there is too great a tendency
for the plating step to cause physical disruption of the anodised layer, so that the
plated metal layer is poorly adherent.
[0013] Figure 2 shows an anodised layer 10 of aluminum oxide (Al₂O₃) of about 2 micrometres
(20,000 Angstroms) thickness that typically will be produced using phosphoric acid
at about 20°C and of about 100g/litre or 10% by weight concentration,employing an
anodising voltage of about 50-60 volts for 10 minutes. The pores themselves are of
much larger transverse dimension to give a much lower length/width ratio (20:1 in
this example), and they are much more widely spaced apart at an average value of about
0.07 micrometres (700 Angstroms). The barrier layer is thicker because of the higher
voltage used; e.g. 60 volts gives a layer of about 700 Angstroms thickness. Such much
larger pores are easier to plate into using DC current, but despite considerable work
on this type of anodising, to the best of our knowledge it has not been adopted commercially
to any great extent, if at all, because of this adhesion problem, and also becuase
of poor appearance of the resultant coatings.
[0014] Figure 3 is a cross-section through an aluminum substrate 12 at the surface of which
there has been formed an anodised layer 10 of aluminum oxide in accordance with this
invention, a portion 4 of which is shown to a larger scale in Figure 4. A pore-filling
metal, semi-bright nickel in this embodiment, is deposited on the anodised layer to
form a support layer 14, and then a layer 15 is deposited to the desired thickness,
which again in this embodiment is semi-bright nickel. This semi-bright nickel layer
15 is followed by a layer 16 of bright nickel and a thin finish layer 18 of chromium.
[0015] Referring now to Figures 4 and 5, the layer 10 is formed by means of a first anodising
step at the surface of the substrate 12 to produce a first layer portion having relatively
large transverse dimension pores 20 which open to the substrate free surface. This
first step is stopped when the corresponding layer portion is sufficiently thick,
and a second anodising step is then employed to produce a second layer portion having
relatively small transverse dimension pores 22 that open into the large pores 20,
the barrier layer 24 being formed between this second layer portion and the substrate
12. In the embodiment illustated by Figures 4 and 5 the pores 20 are of 0.09 micrometre
(900 Angstroms) transverse dimension and about 1.5 micrometres (15,000 Angstroms)
depth, being spaced about 0.07 micrometre (700 Angstroms) from one another while the
small pores 22 of the second layer communicating with the large pores 20 are of 0.015
micrometre (150 Angstroms) transverse dimension and about 2.5 micrometres (25,000
Angstroms) depth, being spaced about 0.024 micrometre (240 Angstroms) from one another.
Such a composite structure can be filled with the metal of the layer 14 without disruption
of the pores and/or of the barrier layer, while providing the necessary good adhesion
between the layers 10 and 14, and also the necessary strength of the layer.
[0016] The preferred method of depositing the pore-filling metal of the layer 14 into the
composite pores 20 and 22 without damage to the barrier layer is by use of one of
the known systems employing what is referred to herein and in the appended claims
as a modified A.C. current, preferably one in which a predetermined negative-going
D.C. current has been superimposed on the A.C. current. Such a system avoids the disruption
of the barrier layer that would be produced by a pure D.C. current. It may be noted
however that owing to the rectification characteristic of the aluminum oxide an A.C.
current alone will produce deposition of the metal and production of a support layer
sufficient for relatively thin anodic coatings e.g. 2 micrometres. For thicker coatings
such unmodified A.C. deposition gives insufficient pore penetration and at too slow
a deposition rate to produce the support layer. The rate and thickness are therefore
increased by increasing the D.C. component to the maximum level that does not cause
disruption. This method of deposition is disclosed for example in U.S. Patent No.
4,226,680, issued to Alcan Research and Development Limited, the disclosure of which
is incorporated herein by this reference. Other "modified A.C." systems are also possible.
For example, the superimposed D.C. component is commonly produced by means of a negative
bias, which is increased as necessary, while the equivalent effect can be obtained
by reduction of positive bias. Another system offsets the A.C. waveform in a manner
that will produce an effective negative bias. A further way is to increase the amplitude
of the negative portion of the waveform relative to that of the positive portion,
which again has the same effect.
[0017] In a preferred process the substrate is first phosphoric acid anodised with the anodising
voltage starting in the usual higher range of values for phosphoric acid, and is decreased
during this step until at the end of the phosphoric acid anodising it has reached
the range of lower values suitable for sulfuric acid anodising, when the electrolyte
is changed, usually by moving the article from the phosphoric acid bath to the sulfuric
acid bath, with thorough water rinsing in between, thereby avoiding the sudden application
of electric potentials that may deleteriously affect the coating.
[0018] The use of an anodic film before plating introduces the possibility, if desired,
of a reduction in the thickness of the subsequent plated layers with consequent cost
savings. Further reductions are possible by using a thicker and/or stronger anodic
film such as that produced using low temperature sulfuric acid anodising. It will
be understood that this industry is particularily cost conscious, especially with
regard to the relatively expensive corrosion-resistant metals that are employed in
the intermediate and finish coatings, so that any saving that can be achieved in their
thickness for an equivalent performance in protection and/or appearance is commercially
important.
[0019] In the processes of the invention the anodised layer 10 can be of thickness in the
range 0.5 - 50 micrometres, usually in the range 1-10 micrometres, preferably in the
range 2-6 micrometres, and more preferably 3-5 micrometres, with a thickness of 5
micrometres being usually commercially suitable. The pore-filling material need not
form a support coating of more than about 2 micrometres thickness and excellent results
can be obtained with the application of a single thin finish coating of chromium over
the pore-filling metal layer. The preferred pore-filling metal is nickel. Metals other
than nickel, such as cobalt, tin or copper, can also be used. Because of the thin
coatings that are employed it is preferred in some processes to pre-treat the surface
of the anodisable metal to obtain a very smooth surface; this can be a "macro" treatment
by buffing and/or a "micro" treatment of chemical or electro-brightening. The support
layer of the pore-filling metal preferably is of thickness in the range 0.5 - 3 micrometres,
and more preferably in the range 1-2 micrometres. The chromium layer preferably is
of thickness in the range of 2-3 micrometres.
[0020] The anodising processes described employing acid baths in the temperature range 20-35°C
are usually characterised as"conventional" anodising, but "hard" anodising processes
can also be employed for the invention, the usual bath temperature being in the range
3-7°C. Such hard anodised layers are usually thicker than the conventional anodised
layers. Such hard layers are also the basis for the pore-filling metal deposition
of nickel or cobalt, which can be the support layer for further deposits, which further
deposits can be thinner than those normally previously used.
[0021] Another aspect of the present invention provides deposition processes in which a
single stage sulfuric acid anodisation of the surface of an anodisable substrate is
followed by a step in which the pores are completely filled with pore-filling metal
using an A.C. with superimposed D.C. or other modified A.C. deposition current, and
the deposition is continued until there is a layer of the pore-filling metal of only
about 2 micrometres on the surface of the anodised layer. Prior processes have been
disclosed for example, as in the above-mentioned U.S. Patent No. 4,226,680, and also
U.S. Patent No. 4,251,330, the disclosure of which is also incorporated herein by
this reference, in which sulfuric acid anodising is followed by only partial filling
of the pores with metal to produce a desired colour.
Example 1
[0022] In a specific example of a process of the invention the aluminum substrate is pretreated,
usually by cleaning with appropriate alkaline and/or acid solutions, and is then anodised
using 10% concentration by weight of phosphoric acid at 21°C. The voltage is held
at 60 VDC for 2 minutes then decreased progressively to 15 VDC over a period of 3
minutes and held at 15 VDC for 2 minutes. The article is then rinsed in water and
moved to a sulfuric acid anodising bath with 15% by weight concentration acid at 21°C
and held at 15 VDC for 5 minutes. Nickel is then deposited in the pores using a Watts
nickel bath employing for example 240 g/L nickel sulphate (NiSO₄.7H₂O), 60 g/L nickel
chloride (NiCl₂.6H₂O) and 45 g/L of boric acid (H₃BO₃), the bath being held at a pH
of 4.5 and temperature of 21°C. The bath is employed with AC current taking 1 minute
to increase the voltage to 12 1/2 VAC; the voltage is then held at 12 1/2 VAC for
2 minutes and subsequently is held for 8 minutes at 12 1/2 VAC with a -2 VDC bias
to provide the main deposition current. Further nickel and chromium layers are then
deposited using any suitable conventional processes.
[0023] In other processes the temperature of the phosphoric acid electrolyte can be in the
range 21°C - 35°C, and the time for increase to 60 VDC can be in the range 2-5 minutes.
Example 2
[0024] A substrate of mechanically buffed aluminum of type AA6463, as commonly used for
architectural application, is pretreated in appropriate alkaline and acid cleaning
solutions, and is then anodised using 10% by weight phosphoric acid at 21°C; the voltage
is held at 60VDC for 2 minutes then decreased progressively to 15VDC over a period
of 3 minutes and held at 15VDC for 2 minutes. The article is then rinsed in water
and moved to a 15% by weight sulphuric acid bath at 21°C and held at 15VDC for 5 minutes.
A support layer of nickel is deposited using the bath of example 9 below and the electrical
protocol of example 10 below; thereafter a 25 micrometres thick layer of electroless
nickel is applied, using a process as suggested for example 5.
Example 3
[0025] A substrate of mechanically buffed aluminum alloy of type AA7029, as commonly used
for automotive bumpers, is pretreated and anodised as in example 2. A support layer
of nickel is deposited as in example 10 below followed by a 40 micrometres thick layer
of semi-bright nickel, a 15 micrometre thick layer of bright nickel, and a 2 micrometre
thick layer of chromium, all applied using conventional plating techniques. The resulting
product has a bright "chromium" finish, as is desired for such an automotive application.
Example 4
[0026] A substrate of mechanically buffed aluminum of type AA6063, which is a non-bright
material as commonly used for non-decorative architectural purposes, is pretreated
and anodised as in example 2. A support layer of nickel is deposited as in example
10, followed by a 15 micrometre thick layer of bright nickel and a 2 micrometre thick
layer of chromium, applied using conventional plating techniques. The resulting product
had a bright "chromium" finish.
Example 5
[0027] The production of the porous anodised layer 10 with a pore-filling metal and a support
layer as described in Example 1, is followed by electroless deposition, the metal
being selected from nickel, cobalt and copper. There are a large number of electroless
compositions suitable for this purpose as disclosed for example in an article by N.
Feldstein in Metal Finishing, 51st Guidebook and Directory Issue, 1983, Vol. 81, No.
1A entitled Electroless (Autocatalytic) Plating (pp 468-476), the disclosure of which
is incorporated herein by this reference. Because of the additional strength and adherence
of the anodised layer the electroless layer can be made much thicker than the support
layer, up to about 25 micrometres, to result in a mirror-bright finish suitable for
decorative application.
Example 6
[0028] A substrate of mechanically buffed aluminum of type AA6061, which is an extruded
material for general application, such as machine stock, is pretreated in appropriate
alkaline and acid cleaning solutions. It is then anodised using 10% byweight phosphoric
acid at 21°C, the voltage being held at 60 VDC for 2 minutes then decreased progressively
to 20 VDC over a period of 3 minutes and held at 20 VDC for 2 minutes. The article
is then rinsed in water and hard anodised by moving to a 15% by weight sulphuric acid
bath at 5°C and held at 20 VDC for 5 minutes. A support layer of nickel and a 25 micrometre
layer of electroless nickel are added as in examples 2 and 5. The resulting product
has a "stainless steel" appearance combined with good abrasion resistance, making
it very suitable for engineering applications requiring a hard surface
Example 7
[0029] An aluminum substrate is pretreated and then anodised using a 15% concentration bath
of sulfuric acid at 21°C and for 10 minutes at 15 VDC ,producing an anodised layer
of about 5 micrometres thickness. This is then plated using either the Watts nickel
plating bath of example 1 or a cobalt plating bath, for example one consisting of
100 g/L of cobalt sulfate (CoSO₄.7H₂O), 40 g/L of boric acid (H₃BO₃), and 150 g/L
of magnesium sulfate (MgSO₄.7H₂O), the pH being 4.4 and the bath being operated at
16°C
Example 8
[0030] A substrate of bright rolled aluminum of type AA5657, as used commercially for bright
automotive trim is pretreated in appropriate alkaline and acid cleaning solutions,
followed by chemical brightening in a phosphoric acid based solution. It is then anodised
to result in a porous anodised layer of 2 micrometres thickness using sulphuric acid
of 15% by weight (165g/L) at 20°C, and employing a voltage of 15VDC for 4 1/2 minutes.
After thorough rinsing, cobalt is deposited into the pores using the electrolyte of
example 6 with A.C. current applied at 12 1/2 VAC for 5 minutes. A thin chromium layer
of 2 micrometres is then applied using conventional plating techniques. The resulting
product had the appearance typical of stainless steel.
Example 9
[0031] A substrate of bright rolled aluminum of type AA5252, also used commercially for
bright automotive trim is bright anodised to a thickness of 2 micrometres, as described
in example 8. After thorough rinsing, nickel is deposited into the pores using the
same electrical parameters as in example 8 and using a Watt's nickel bath of 240g/L
nickel sulphate (NiSO₄.7H₂O), 60g/L nickel chloride (NiCl₂.6H₂O) and 45g/L boric acid
(H₃BO₄) the bath being held at a pH of 4.5 and temperature of 21°C. A thin chromium
layer of 2 micrometres thickness is then applied using conventional plating techniques.
The resulting product had the appearance typical of stainless steel.
Example 10
[0032] A substrate of mechanically buffed extruded aluminum of type AA6463, as commonly
used for architectural applications, is bright anodised to a thickness of 5 micrometres
as described in example 7 for 10 minutes. After thorough rinsing nickel is deposited
into the pores using a Watt's nickel bath as described in example 8. A.C. current
is used by ramping over a period 1 minute to 12 1/2 VAC, held at this voltage for
2 minutes then a negative 2 VDC shift is superimposed on the A.C. for a further 8
minutes. A layer of 5 micrometres thickness of electroless nickel is then applied
using a conventional electroless plating technique. The resulting product had the
appearance characteristic of polished stainless steel.
Example 11
[0033] A substrate of bright rolled aluminum of type AA5657 is bright anodised to a thickness
of 5 micrometres as described in example 8 for 10 minutes. After thorough rinsing
nickel is deposited into the pores using a Watt's nickel bath as described in example
9. The A.C. voltage is set initially at 12 1/2 VAC with a negative 2 VDC bias and
the current is ramped up to this level over a period of 1 minute and maintained at
this level for 10 minutes. A layer of 5 micrometres thickness of electroless nickel
is then applied using a conventional electroless plating technique. The resulting
product had the same appearance as with example 10.
[0034] The processes of the invention are not limited to the production of architectural,
automotive and decorative finishes, and an example of an alternative application is
the deposition of a black chrome finish layer on a nickel support layer for solar
selective absorber applications. A similar process can be employed for the production
of magnetic discs, also involving the production of a support layer of nickel followed
by a chromium layer.
1. A method of depositing a layer of a finish metal on a surface of a substrate of
an anodisable metal, characterized by the steps of:
a) anodising the substrate at the said surface to produce a porous anodised layer
of thickness from about 0.5 to about 50 micrometres and having pores therein of transverse
dimension from about 0.005 to 0.10 micrometres;
b) depositing a pore-filling metal into the pores using AC or modified AC deposition
to completely fill the pores with the metal up to the surface of the anodized layer,
and continuing the deposition of the pore-filling metal to form a continuous support
layer on the surface of the anodised layer of thickness in the range about 0.5 to
3 micrometres; and
c) depositing at least one coating of a finish metal on the support layer.
2. A method as claimed in claim 1, characterized in that the anodisable metal is selected
from aluminum and anodisable alloys thereof.
3. A method as claimed in claims 1 or 2, characterized in that the pore-filling metal
is selected from nickel, cobalt, copper, tin and mixtures thereof.
4. A method as claimed in any one of claims 1 to 3, characterized in that the finish
metal is chromium.
5. A method as claimed in any one of claims 1 to 3, characterized in that the layer
of chromium finish metal is of thickness about 1-5 micrometres.
6. A method as claimed in any one of claims 1 to 3, characterized in that the finish
metal is electroless plated on the support layer.
7. A method as claimed in any one of claims 1 to 3, characterized in that the finish
metal is electroless plated to a thickness of about 10-25 micrometres on the support
layer.
8. A method as claimed in any one of claims 1 to 3, characterized in that the finsih
metal is electroless plated nickel to a thickness of about 10-25 micrometres on the
support layer.
9. A method as claimed in any one of claims 1 to 8, characterized in that the substrate
is first anodized at the surface to produce a large-pore anodised layer portion with
large pores opening to its free surface, and is subsequently anodised to produce a
small-pore anodised layer portion between the large-pore layer portion and the remainder
of the substrate with the small pores of the small-pore layer portion in communication
with the large pores of the large-pore layer portion.
10. A method as claimed in claim 9, characterized in that the first anodising to produce
large pores is acid anodising using phosphoric acid and the subsequent anodising to
produce small pores is acid anodising using sulfuric acid, or chromic acid or oxalic
acid, or mixtures thereof.
11. A method as claimed in claim 9, characterized in that the substrate is first phosphoric
acid anodised to produce the large-pore anodised layer portion, and is subsequently
sulfuric acid anodised to produce the small-pore anodised layer portion.
12. A method as claimed in claim 9, characterized in that the substrate surface is
first anodised to produce a large-pore anodised layer portion with large pores of
transverse dimension from about 0.07 to 0.1 micrometre, and is subsequently anodised
to produce a small-pore anodised layer portion with small pores of corresponding transverse
dimension from about 0.01 to 0.02 micrometre.
13. A method as claimed in claim 9, characterized in that the substrate surface is
first anodised to produce a large-pore anodised layer portion with large pores of
transverse dimension of about 0.09 micrometre, and is subsequently anodised to produce
a small-pore anodised layer portion with small pores of corresponding transverse dimension
of about 0.015 micrometre.
14. A method as claimed in any one of claims 9 to 14, characterized in that the substrate
is first phosphoric aicd anodised while the anodising voltage is increased from a
value for sulfuric acid anodising to a maximum value for phosphoric acid anodising,
and subsequently is reduced to the said value for sulfuric acid anodising, and thereafter
is sulfuric acid anodised while the anodising voltage is held at the value for sulfuric
acid anodising.
15. A method of depositing a layer of a finish metal on a surface of a substrate of
an anodizable metal, the method including the steps of:
a) anodizing the substrate at the said surface to produce a porous anodized layer,
the substrate surface first being anodized to produce a large-pore anodised layer
portion with large pores opening to its free surface, and subsequently being anodised
to produce a small-pore anodized layer portion between the large-pore layer portion
and the remainder of the substrate communicating with the large pores of the large-pore
layer portion;
b) depositing a pore-filling metal on to the porous anodised layer to fill the pores
therein and to form a support layer of the pore-filling metal thereover; and
c) depositing at least one layer of a finish metal on the support layer.
16. A method as claimed in claim 15, characterized in that the first anodising to
produce large pores is acid anodising using phosphoric acid and the subsequent anodising
to produce small pores is acid anodising using sulfuric acid, or chromic acid or oxalic
acid, or mixtures thereof.
17. A method as claimed in claim 15, characterized in that the substrate is first
phosphoric acid anodised to produce the large-pore anodised layer portion, and is
subsequently sulfuric acid anodised to produce the small-pore anodised layer portion.
18. A method as claimed in claim 15, characterized in that the substrate surface is
first anodised to produce a large-pore anodised layer portion with large pores of
transverse dimension from about 0.07 to 0.1 micrometre, and is subsequently anodised
to produce a small-pore anodised layer portion with small pores of corresponding transverse
dimension from about 0.01 to 0.02 micrometre.
19. A method as claimed in claim 15, characterized in that the substrate surface is
first anodised to produce a large-pore anodised layer portion with large pores of
transverse dimension of about 0.09 micrometre, and subsequently is anodised to produce
a small-pore anodised layer portion with small pores of corresponding transverse dimension
of about 0.015 micrometre.
20. A method as claimed in any one of claims 15 to 19, characterized in that the substrate
is first phosphoric acid anodised while the anodising voltage is increased from a
value for sulfuric acid anodising to a maximum value for phosphoric acid anodising,
and subsequently is reduced to the said value for sulfuric acid anodising, and thereafter
is sulfuric acid anodised while the anodising voltage is held at the value for sulfuric
acid anodising.
21. A method as claimed in any one of claims 15 to 20, characterized in that the anodised
layer is of thickness from about 1 to 10 micrometres.
22. A method as claimed in any one of claims 15 to 21, characterized in that the support
layer is of thickness from about 0.5 to 3 micrometres.
23. A method as claimed in any one of claims 15 to 22, characterized in that the finish
layer is of thickness from about 1 to 5 micrometres.
24. A method as claimed in any one of claims 15 to 23, characterized in that the finish
metal is electroless plated on the support layer.
25. A method as claimed in any one of claims 15 to 23, characterized in that the finish
metal is electroless plated to a thickness of about 10-25 micrometres on the support
layer.
26. A method as claimed in any one of claims 15 to 23, characterized in that the finish
metal is electroless plated nickel.
27. A method as claimed in any one of claims 15 to 23, characterized in that the pore-filling
metal is deposited using AC with superimposed DC deoposition to completely fill the
pores and form the support layer.
28. A substrate of anodisable metal having thereon a porous anodised layer, the pores
of which are filled with pore-filling metal, a support layer of metal on the surface
of the anodised layer, and a coating of a finish metal on the support layer, when
prepared by a method as claimed in any one of claims 1 to 27.