(19)
(11) EP 0 377 935 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
17.07.1991 Bulletin 1991/29

(43) Date of publication A2:
18.07.1990 Bulletin 1990/29

(21) Application number: 89307285.0

(22) Date of filing: 19.07.1989
(51) International Patent Classification (IPC)5B41N 1/24
(84) Designated Contracting States:
DE FR GB IT

(30) Priority: 12.01.1989 JP 5389/89

(71) Applicant: Asahi Kasei Kogyo Kabushiki Kaisha
Osaka-shi Osaka 530 (JP)

(72) Inventors:
  • Yoshimura, Isao
    Fujisawa-shi Kanagawa (JP)
  • Ohno, Toshiaki
    Suzuka-shi Mie (JP)
  • Hata, Hideo
    Suzuka-shi Mie (JP)

(74) Representative: Blake, John Henry Francis et al
BROOKES AND MARTIN High Holborn House 52/54 High Holborn
London WC1V 6SE
London WC1V 6SE (GB)


(56) References cited: : 
   
       


    (54) High-sensitivity thermosensitive multilayer film and method for production of plate-making stencil sheet


    (57) The present invention relates to a high-sensitivity thermosensitive multilayer film and a method to produce plate-making paper using the film. In the present invention, the high-sensitivity thermosensitive multilayer film consists of at least one functional layer and at least one peeling layer. The said functional layer is made of the thermoplastic resin layer with the thickness of 0.1 to 12 µm and with at least 30% of a thermal shrinkage rate and at least 50 g/mm² of thermal shrinkage stress value. The peeling layer consists of the thermoplastic resin layer which is different from that of the functional layer and is the special multilayer film which is readily releasable and capable of exerting a compressive force to the functional layer.
    When the stencil sheet is manufactured by using the said multilayer film, the operation efficiency at time of lamination and the shrinking capacity can improve by peeling the said peeling layer after lamination from porous supporting member. Moreover the resistance of the original paper to curling is remarkably enhanced under a high temperature circumustances by removing the compressive force working on the functional layer as result of peeling the peeling layer after lamination if the compressive force exists at the said peeling layer.





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