HIGH PRESSURE BONDING PROCESS - Patent 0380593

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EP 0 380 593 A1

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(43)	Date of publication:
	08.08.1990 Bulletin 1990/32

(21)	Application number: 89902114.0

(22)	Date of filing: 10.01.1989

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International Patent Classification (IPC):

B23K 20/ 00^{( . )}

B23K 20/ 02^{( . )}

(86)	International application number:
	PCT/US1989/000098

(87)	International publication number:
	WO 1989/006583 (27.07.1989 Gazette 1989/16)

(84)	Designated Contracting States:
	DE GB

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Priority:

14.01.1988 US 19880144137

(71)	Applicants:
	ELECTRIC POWER RESEARCH INSTITUTE, INC Palo Alto, California 94303 (US) FINDLAN, Shane J. Concord, NC 28025 (US)

(72)	Inventor:
	FINDLAN, Shane, J. Concord, NC 28025 (US)

(74)	Representative: Jackson, David Spence, et al
	REDDIE & GROSE 16, Theobalds Road London, WC1X 8PL London, WC1X 8PL (GB)

(54)	HIGH PRESSURE BONDING PROCESS