(19)
(11) EP 0 388 473 A1

(12)

(43) Date of publication:
26.09.1990 Bulletin 1990/39

(21) Application number: 89909855.0

(22) Date of filing: 01.09.1989
(51) International Patent Classification (IPC): 
C08G 59/ 30( . )
H01B 1/ 22( . )
C09J 163/ 00( . )
H01B 1/ 24( . )
(86) International application number:
PCT/JP1989/000905
(87) International publication number:
WO 1990/002768 (22.03.1990 Gazette 1990/07)
(84) Designated Contracting States:
DE FR GB

(30) Priority: 02.09.1988 JP 19880221555
02.12.1988 JP 19880306522

(71) Applicant: TORAY INDUSTRIES, INC.
Tokyo 103 (JP)

(72) Inventors:
  • OHURA, Akio C-401, Royal Shikayama
    Nagoya-shi Aichi 455 (JP)
  • HIROSE, Masakazu E1-5
    Midori-ku Nagoya-shi Aichi 458 (JP)
  • WATANABE, Tetsuya
    Aichi 487 (JP)

(74) Representative: Kador & Partner 
Corneliusstrasse 15
D-80469 München
D-80469 München (DE)

   


(54) SILICONE-EPOXY RESIN COMPOSITION AND CONDUCTIVE ADHESIVE PREPARED THEREFROM