(19)
(11)
EP 0 388 473 A1
(12)
(43)
Date of publication:
26.09.1990
Bulletin 1990/39
(21)
Application number:
89909855.0
(22)
Date of filing:
01.09.1989
(51)
International Patent Classification (IPC):
C08G
59/
30
( . )
H01B
1/
22
( . )
C09J
163/
00
( . )
H01B
1/
24
( . )
(86)
International application number:
PCT/JP1989/000905
(87)
International publication number:
WO 1990/002768
(
22.03.1990
Gazette 1990/07)
(84)
Designated Contracting States:
DE FR GB
(30)
Priority:
02.09.1988
JP 19880221555
02.12.1988
JP 19880306522
(71)
Applicant:
TORAY INDUSTRIES, INC.
Tokyo 103 (JP)
(72)
Inventors:
OHURA, Akio C-401, Royal Shikayama
Nagoya-shi Aichi 455 (JP)
HIROSE, Masakazu E1-5
Midori-ku Nagoya-shi Aichi 458 (JP)
WATANABE, Tetsuya
Aichi 487 (JP)
(74)
Representative:
Kador & Partner
Corneliusstrasse 15
D-80469 München
D-80469 München (DE)
(54)
SILICONE-EPOXY RESIN COMPOSITION AND CONDUCTIVE ADHESIVE PREPARED THEREFROM