(19)
(11) EP 0 403 022 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
22.01.1992 Bulletin 1992/04

(43) Date of publication A2:
19.12.1990 Bulletin 1990/51

(21) Application number: 90201516.3

(22) Date of filing: 12.06.1990
(51) International Patent Classification (IPC)5: C08G 59/06, C08G 59/62, C08L 63/02, H01B 3/40, H01L 23/29
// (C08L63/02, 61:04)
(84) Designated Contracting States:
DE IT NL

(30) Priority: 13.06.1989 JP 148282/89
13.06.1989 JP 148283/89

(71) Applicant: SHELL INTERNATIONALE RESEARCH MAATSCHAPPIJ B.V.
NL-2596 HR Den Haag (NL)

(72) Inventors:
  • Konishi, Isako
    Yokkaichi City, Mie Prefecture (JP)
  • Murata, Yasuyuki
    Yokkaichi City, Mie Prefecture (JP)
  • Tanaka, Ryohei
    Yokkaichi City, Mie Prefecture (JP)
  • Nakanishi, Yoshinori
    Suzuka City, Mie Prefecture (JP)


(56) References cited: : 
   
       


    (54) Encapsulating epoxy resin composition


    (57) Epoxy resins prepared by reacting a bisphenol-type epoxy resin of the formula:


    X¹ and X² being H, hal or C₁₋₅ alkyl and n a number from 0 to 5 on average, with polyhydric phenols having an average number of hydroxyl groups per molecule of from 2.3 to 10, the reactant ratio being such that per epoxy group of bisphenol-type epoxy resin the number of hydroxyl groups of polyhydric phenols is in the range of 0.05 to 0.6.
    Encapsulating epoxy resin compositions based on bisphenol-type epoxy resins of the above formula or reaction products thereof.





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