| (19) |
 |
|
(11) |
EP 0 404 177 A3 |
| (12) |
EUROPEAN PATENT APPLICATION |
| (88) |
Date of publication A3: |
|
19.11.1992 Bulletin 1992/47 |
| (43) |
Date of publication A2: |
|
27.12.1990 Bulletin 1990/52 |
| (22) |
Date of filing: 22.06.1990 |
|
|
| (84) |
Designated Contracting States: |
|
DE FR GB IT |
| (30) |
Priority: |
23.06.1989 JP 161383/89
|
| (71) |
Applicant: NITTO BOSEKI CO., LTD. |
|
Fukushima-shi (JP) |
|
| (72) |
Inventors: |
|
- Watanabe, Akihiko
Fukushima-shi (JP)
- Numazaki, Yuuki
Fukushima-shi (JP)
- Kanno, Naoto
Fukushima-shi (JP)
- Inoguchi, Hirokazu
Fukushima-shi (JP)
|
| (74) |
Representative: Hansen, Bernd, Dr. Dipl.-Chem. et al |
|
Hoffmann, Eitle & Partner
Patent- und Rechtsanwälte,
Postfach 81 04 20
81904 München
81904 München (DE) |
|
| |
|
| (54) |
Transfer sheet for making printed-wiring board by injection molding and method for
producing same |
(57) The present invention provides a transfer sheet for making a printed-wiring board
by injection molding which is free from damage of circuit at injection molding and
is excellent in releasability and which comprises a carrier film, a copper foil circuit
and a releasing layer provided between the carrier film and the copper foil circuit.
Preferably, said releasing layer provides a T-type peeling strength between the carrier
film and the copper foil circuit of 0.025-0.25 kg/25 mm. A method for producing such
transfer sheet is also provided which comprises coating a releasing layer on a carrier
film, then contact-bonding a copper foil thereto with heating, pattern-printing an
etching resist on the resulting laminate film and subjecting it to etching to form
a copper foil circuit.