(19)
(11) EP 0 417 887 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
24.07.1991 Bulletin 1991/30

(43) Date of publication A2:
20.03.1991 Bulletin 1991/12

(21) Application number: 90307220.5

(22) Date of filing: 02.07.1990
(51) International Patent Classification (IPC)5: H01L 23/538, G06K 19/06
(84) Designated Contracting States:
DE FR GB

(30) Priority: 09.09.1989 JP 233476/89
12.09.1989 JP 236281/89

(71) Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
Tokyo (JP)

(72) Inventors:
  • Uenaka, Takeshi
    Sanda City, Hyogo-ken (JP)
  • Onbuchi, Jun
    Chiyoda-ku, Tokyo (JP)
  • Onoda, Shigeo
    Chiyoda-ku, Tokyo (JP)
  • Omori, Makoto
    Chiyoda-ku, Tokyo (JP)
  • Maeda, Hajime
    Chiyoda-ku, Tokyo (JP)
  • Tachikawa, Toru
    Chiyoda-ku Tokyo (JP)

(74) Representative: Crawford, Andrew Birkby et al
A.A. THORNTON & CO. Northumberland House 303-306 High Holborn
London WC1V 7LE
London WC1V 7LE (GB)


(56) References cited: : 
   
       


    (54) IC card


    (57) An IC card (21) includes a substrate (13), semiconductor devices (1a-1h) mounted on at least one of majors surfaces of the substrate, and a casing in which the substrate with the semiconductor devices mounted on it is housed. The casing includes a frame (5) and panels (7, 8) bonded to the frame on the opposite sides of the frame by means of adhesive layers (9a, 9b). Means for preventing the semiconductor devices from being bonded to the panel via the adhesive layers are disposed at locations on the adhesive layers facing the semiconductor devices.






    Search report